Fairchild Semiconductor RFP50N06 Datasheet

G
D
S
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
RFG50N06, RFP50N06, RF1S50N06SM
Data Sheet January 2002
50A, 60V, 0.022 Ohm, N-Channel Power MOSFETs
Formerly developmental type TA49018.
Ordering Information
PART NUMBER PACKAGE BRAND
RFG50N06 TO-247 RFG50N06
RFP50N06 TO-220AB RFP50N06
RF1S50N06SM TO-263AB F1S50N06
NOTE: When ordering, use the entire part number. Add the suffix, 9A, to obtain the TO-263AB variant in tape and reel, i.e. RF1S50N06SM9A.
Packaging
JEDEC STYLE TO-247 JEDEC TO-220AB
Features
• 50A, 60V
DS(ON)
= 0.022
•r
• Temperature Compensating PSPICE
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
o
• 175
C Operating Temperature
Symbol
®
Model
SOURCE
DRAIN
DRAIN
(BOTTOM
SIDE METAL)
©2002 Fairchild Semiconductor Corporation RFG50N06, RFP50N06, RF1S50N06SM Rev. B
GATE
GATE
SOURCE
JEDEC TO-263AB
DRAIN
(FLANGE)
±
µ
µ
±
θ
θ
RFG50N06, RFP50N06, RF1S50N06SM
Absolute Maximum Ratings
o
T
= 25
C, Unless Otherwise Specified
C
RFG50N06, RFP50N06
RF1S50N06SM UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Drain to Gate Voltage (R
= 20k ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Continuous Drain Current (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
DSS
DGR
GS
D
DM
AS
D
, T
J
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
60 V
60 V
20 V
50
(Figure 5)
(Figure 6)
131
0.877
-55 to 175
300 260
W/
A
W
o
C
o
C
o
C
o
C
NOTE:
J
= 25
o
C to 150
1. T
Electrical Specifications
o
C.
o
T
= 25
C, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BV
Gate to Source Threshold Voltage V
GS(TH)
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
Drain to Source On Resistance r
DS(ON)
Turn-On Time t
Turn-On Delay Time t
d(ON)
Rise Time t
Turn-Off Delay Time t
d(OFF)
Fall Time t
Turn-Off Time t
Total Gate Charge Q
g(TOT)
Gate Charge at 10V Q
Threshold Gate Charge Q
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Thermal Resistance Junction to Case R
Thermal Resistance Junction to Ambient R
DSS
DSS
GSS
ON
r
f
OFF
g(10)
g(TH)
ISS
OSS
RSS
JC
JA
I
= 250 µ A, V
D
V
= V
GS
DS
V
= 60V,
DS
V
= 0V
GS
V
= ± 20V - -
GS
I
= 50A, V
D
V
= 30V, I
DD
R
= 0.6 , V
L
R
= 3.6
GS
(Figure 13)
= 0V (Figure 11) 60 - - V
GS
, I
= 250 µ A (Figure 10) 2 - 4 V
D
T
T
o
= 25
C--1
C
o
= 150
C
C--50
100 nA
= 10V (Figures 9) - - 0.022
GS
= 50A
D GS
= 10V
- - 95 ns
-12 - ns
-55 - ns
-37 - ns
-13 - ns
- - 75 ns
V
= 0 to 20V V
GS
V
= 0 to 10V - 67 80 nC
GS
V
= 0 to 2V - 3.7 4.5 nC
GS
V
= 25V, V
DS
GS
f = 1MHz (Figure 12)
DD
R
L
I
g(REF)
(Figure 13)
= 0V
= 48V, I
= 0.96
= 1.45mA
= 50A,
D
- 125 150 nC
- 2020 - pF
- 600 - pF
- 200 - pF
(Figure 3) - - 1.14
TO-247 - - 30
TO-220, TO-263 - - 62
o
o
o
A
A
C/W
C/W
C/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
Reverse Recovery Time t
©2002 Fairchild Semiconductor Corporation RFG50N06, RFP50N06, RF1S50N06SM Rev. B
SD
rr
I
= 50A - - 1.5 V
SD
I
= 50A, dI
SD
/dt = 100A/ µ s - - 125 ns
SD
50
40
30
20
10
0
25 50 75 100 125 150 175
I
D
,
DRAIN CURRENT (A)
TC, CASE TEMPERATURE (oC)
60
10-310
-2
10
-1
10
0
10
1
10
2
10
3
10
4
10
2
10
3
t, PULSE WIDTH (ms)
VGS = 20V
VGS = 10V
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT CAPABILITY AS FOLLOWS:
II
25
175 T
C
150
------------------------



=
I
DM
,
PEAK CURRENT (A)
40
TC = 25oC
RFG50N06, RFP50N06, RF1S50N06SM
Typical Performance Curves
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
Unless Otherwise Specified
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
2
1
0.5
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
0.2
0.1
0.1
THERMAL IMPEDANCE
0.01
0.05
0.02
0.01
SINGLE PULSE
-5
10
-4
10
, NORMALIZED
θJC
Z
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
400
100
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS AREA MAY BE LIMITED BY r
1
1 10 100
DS(ON)
DRAIN TO SOURCE VOLTAGE (V)
V
DS,
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY
©2002 Fairchild Semiconductor Corporation RFG50N06, RFP50N06, RF1S50N06SM Rev. B
V
DSS(MAX)
-3
10
t1, RECTANGULAR PULSE DURATION (s)
= MAX RATED
T
J
SINGLE PULSE
TC = 25oC
= 60V
100µs
1ms
10ms
100ms
DC
P
DM
t
1
t
θJC
2
x R
2
+ T
θJC
C
1
10
NOTES: DUTY FACTOR: D = t1/t PEAK TJ = PDM x Z
-2
10
-1
10
0
10
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