SEMICONDUCTOR
December 1995
RFD16N03L,
RFD16N03LSM
16A, 30V, Avalanche Rated N-Channel Logic Level
Enhancement-Mode Power MOSFETs
Features
• 16A, 30V
•r
•
= 0.022Ω
DS(ON)
Temperature Compensating
PSPICE Model
• Can be Driven Directly from CMOS, NMOS,
and TTL Circuits
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
o
• +175
C Operating Temperature
Description
The RFD16N03L and RFD16N03LSM are N-channel power
MOSFETs manufactured using the MegaFET process. This
process, which uses feature sizes approaching those of
LSI circuits, gives optimum utilization of silicon, resulting in
outstanding performance. They were designed for use in
applications such as switching regulators, switching converters, motor drivers and relay drivers. This performance is
accomplished through a special gate oxide design which
provides full rated conductance at gate bias in the 3V - 5V
range, thereby facilitating true on-off power control directly
from logic level (5V) integrated circuits.
PACKAGE AVAILABILITY
PART NUMBER PACKAGE BRAND
RFD16N03L TO-251AA 16N03L
RFD16N03LSM TO-252AA 16N03L
Packaging
DRAIN (FLANGE)
Symbol
JEDEC TO-251AA
JEDEC TO-252AA
GATE
SOURCE
GATE
DRAIN
SOURCE
SOURCE
DRAIN
GATE
DRAIN (FLANGE)
NOTE: When ordering, use the entire part number. Add the suffix
9A, to obtain the TO-252AA variant in tape and reel, e.g.
RFD16N03LSM9A.
Formerly developmental type TA49030.
Absolute Maximum Ratings T
Drain-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain-Gate Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
RMS Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E
Power Dissipation
TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate above +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Soldering Temperature of Leads for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper ESD Handling Procedures.
Copyright
© Harris Corporation 1995
= +25oC
C
5-31
STG
RFD16N03LSM UNITS
DSS
DGR
GS
D
Refer to Peak Current Curve
DM
Refer to UIS Curve
, T
AS
D
J
L
RFD16N03L,
30 V
30 V
±10 V
16
90
0.606
-55 to +175
260
File Number 4013.1
A
W
W/oC
o
C
o
C
Specifications RFD16N03L, RFD16N03LSM
Electrical Specifications T
= +25oC, Unless Otherwise Specified
C
PARAMETERS SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain-Source Breakdown Voltage BV
Gate Threshold Voltage V
Zero Gate Voltage Drain Current I
Gate-Source Leakage Current I
On Resistance r
Turn-On Time t
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Turn-Off Time t
Total Gate Charge Q
Gate Charge at 5V Q
Threshold Gate Charge Q
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Thermal Resistance Junction-to-Case R
Thermal Resistance Junction-to-Ambient R
DSS
GS(TH)
DSS
GSS
DS(ON)ID
ON
D(ON)
R
D(OFF)
F
OFF
G(TOT)
G(5)
G(TH)
ISS
OSS
RSS
θJC
θJA
ID = 250µA, VGS = 0V 30 - - V
VGS = VDS, ID = 250µA1-2V
VDS = 30V,
VGS = 0V
TC = +25oC--1µA
= +150oC--50µA
T
C
VGS = ±10V - - 100 nA
= 16A, VGS = 5V - - 0.022 Ω
VDD = 15V, ID = 16A,
RL = 0.93Ω, VGS = 5V,
RGS = 5Ω
- - 120 ns
-15-ns
-95-ns
-25-ns
-27-ns
- - 80 ns
VGS = 0V to 10V VDD = 24V,
VGS = 0V to 5V - 30 36 nC
ID = 16A,
RL = 1.5Ω
-5060nC
VGS = 0V to 1V - 1.5 1.8 nC
VDS = 25V, VGS = 0V,
f = 1MHz
- 1650 - pF
- 575 - pF
- 200 - pF
- - 1.65
TO-251 and TO-252 - - 100
o
o
C/W
C/W
Source-Drain Diode Specifications
PARAMETERS SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Forward Voltage V
Reverse Recovery Time t
RR
SD
ISD = 16A - - 1.5 V
ISD = 16A, dISD/dt = 100A/µs--75ns
5-32
Typical Performance Curves
RFD16N03L, RFD16N03LSM
500
TC = +25oC
2
1
100
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
1
1
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
DS(ON)
V
DSS
MAX = 30V
10
100µs
1ms
10ms
100ms
DC
50
0.5
0.2
0.1
0.1
, NORMALIZED
.05
JC
θ
.02
Z
THERMAL RESPONSE
.01
SINGLE PULSE
0.01
-5
10
10
t, RECTANGULAR PULSE DURATION (s)
P
DM
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-4
-3
10
-2
10
-1
10
FIGURE 1. SAFE OPERATING AREA CURVE FIGURE 2. NORMALIZED MAXIMUM TRANSIENT THERMAL
IMPEDANCE
20
15
10
500
100
VGS = 10V
VGS = 5V
FOR TEMPERATURES
ABOVE +25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I = I
175 - T
25
150
t
1
t
2
JC
θ
10
TC = +25oC
C
1/t2
0
+ T
C
1
10
, DRAIN CURRENT (A)
5
D
I
0
25 50 75 100
125
150
TC, CASE TEMPERATURE (oC)
FIGURE 3. MAXIMUM CONTINUOUS DRAIN CURRENT vs
TEMPERATURE
100
VGS = 10V
75
50
, DRAIN CURRENT (A)
25
D
I
0
0
1.0
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
PULSE DURATION = 250µs, T
2.0 3.0 5.0
= +25oC
C
VGS = 5V
VGS = 4.5V
V
GS
VGS = 3.5V
VGS = 3V
4.0
= 4V
175
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
, PEAK CURRENT CAPABILITY (A)
DM
I
10
-5
10
-4
10
FIGURE 4. PEAK CURRENT CAPABILITY
100
75
50
25
, ON-STATE DRAIN CURRENT (A)
D(ON)
I
0
0
VGS, GATE-TO-SOURCE VOLTAGE (V)
-3
10
-2
10
t, PULSE WIDTH (s)
-55oC
PULSE TEST
PULSE DURATION = 250µs
DUTY CYCLE = 0.5% MAX
3.0 4.5 6.0 7.51.5
-1
10
0
10
V
DD
= 15V
1
10
+175oC
+25oC
FIGURE 5. TYPICAL SATURATION CHARACTERISTICS
FIGURE 6. TYPICAL TRANSFER CHARACTERISTICS
5-33