Fairchild Semiconductor QEE122, QEE123 Datasheet
• λ
PLASTIC INFRARED
LIGHT EMITTING DIODE
QEE122 QEE123
PACKAGE DIMENSIONS
0.175 (4.44)
0.087 (2.22)
Ø0.065 (1.65)
0.050 (1.27)
Ø0.095 (2.41)
CATHODE
0.020 (0.51) SQ.
0.030 (0.76)
0.100 (2.54)
NOM
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless
otherwise specified.
0.200 (5.08)
0.500 (12.70)
ANODE
(2X)
0.100 (2.54)
MIN
SCHEMATIC
ANODE
CATHODE
DESCRIPTION
The QEE12X is a 880 nm AlGaAs LED encapsulated in a medium wide angle, plastic sidelooker package.
FEATURES
= 880 nm
• Package Type = Sidelooker
• Chip Material = AlGaAs
• Matched Photosensor: QSE113
• Medium Wide Emission Angle, 50°
• Package Material: Clear Epoxy
• High Output Power
• Orange stripe on the top side
© 2002 Fairchild Semiconductor Corporation
Page 1 of 4
4/30/02
PLASTIC INFRARED
LIGHT EMITTING DIODE
QEE122 QEE123
ABSOLUTE MAXIMUM RATINGS
(T
= 25°C unless otherwise specified)
A
Parameter Symbol Rating Unit
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)
Soldering Temperature (Flow)
Continuous Forward Current
Reverse Voltage
Power Dissipation
(1)
(2,3,4)
(2,3)
T
T
T
SOL-I
T
SOL-F
OPR
STG
I
F
V
R
P
D
-40 to + 100 °C
-40 to + 100 °C
240 for 5 sec °C
260 for 10 sec °C
50 mA
5V
100 mW
NOTES:
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6 mm) minimum from housing
.
ELECTRICAL / OPTICAL CHARACTERISTICS
(T
A
=25°C)
Parameter Test Conditions Symbol Min Typ Max Units
I
Peak Emission Wavelength
Emission Angle
Forward Voltage
Reverse Current
Radiant Intensity QEE122
Radiant Intensity QEE123
Rise Time
Fall Time
= 100 mA
F
I
= 100 mA
F
I
= 100 mA, tp = 20 ms V
F
V
= 5 V I
R
I
= 100 mA, tp = 20 ms I
F
I
= 100 mA, tp = 20 ms I
F
I
= 100 mA
F
λ
PE
— 940 — nm
2 Θ 1/2 — 50 — Deg.
F
R
E
E
t
r
t
f
——1.7 V
——10 µA
4 — 16 mW/sr
8 ——mW/sr
— 800 — ns
— 800 — ns
© 2002 Fairchild Semiconductor Corporation
Page 2 of 4
4/30/02
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