Fairchild Semiconductor QED221, QED222, QED223 Datasheet
0.195 (4.95)
0.040 (1.02)
NOM
0.100 (2.54)
NOM
0.050 (1.25)
0.800 (20.3)
MIN
0.305 (7.75)
0.240 (6.10)
0.215 (5.45)
0.020 (0.51)
SQ. (2X)
REFERENCE
SURFACE
CATHODE
PACKAGE DIMENSIONS
FEATURES
• != 880 nm
• Chip material = AlGaAs
• Package type: T-1 3/4 (5mm lens diameter)
• Matched Photosensor: QSD122/123/124
• Medium Wide Emission Angle, 40°
• High Output Power
• Package material and color: Clear, purple tinted, plastic
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
SCHEMATIC
PLASTIC INFRARED LIGHT
EMITTING DIODE
2001 Fairchild Semiconductor Corporation
DS300337 12/07/01 1 OF 4 www.fairchildsemi.com
QED221 QED222 QED223
DESCRIPTION
The QED22X is an 880nm AlGaAs LED encapsulated in clear, purple tinted, plastic T-1 3/4 package.
ANODE
CATHODE
Parameter Symbol Rating Unit
Operating Temperature T
OPR
-40 to +100 °C
Storage Temperature T
STG
-40 to +100 °C
Soldering Temperature (Iron)
(2,3,4)
T
SOL-I
240 for 5 sec °C
Soldering Temperature (Flow)
(2,3)
T
SOL-F
260 for 10 sec °C
Continuous Forward Current I
F
100 mA
Reverse Voltage V
R
5V
Power Dissipation
(1)
P
D
200 mW
Peak Forward Current
(5)
I
F(Peak)
1.5 A
ABSOLUTE MAXIMUM RATINGS
(TA= 25°C unless otherwise specified)
PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS
Peak Emission Wavelength IF= 100 mA !
PE
— 880 — nm
Emission Angle IF= 100 mA " — ±20 — Deg.
Forward Voltage IF= 100 mA, tp = 20 ms V
F
——1.7 V
Reverse Current VR= 5 V I
R
——10 µA
Radiant Intensity QED221 IF= 100 mA, tp = 20 ms I
E
10 — 20 mW/sr
Radiant Intensity QED222 IF= 100 mA, tp = 20 ms I
E
16 — 32 mW/sr
Radiant Intensity QED223 IF= 100 mA, tp = 20 ms I
E
25 ——mW/sr
Rise Time
I
F
= 100 mA
t
r
— 800 — ns
Fall Time t
f
— 800 — ns
ELECTRICAL / OPTICAL CHARACTERISTICS
(TA =25°C)
PLASTIC INFRARED LIGHT
EMITTING DIODE
QED221 QED222 QED223
www.fairchildsemi.com 2 OF 4 12/07/01 DS300337
1. Derate power dissipation linearly 2.67 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron
1/16” (1.6mm) minimum from housing.
5. Pulse conditions; tp = 100 µS, T = 10 ms.
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