Fairchild Semiconductor QEC121, QEC122, QEC123 Datasheet

DESCRIPTION
The QEC12X is an 880 nm AlGaAs LED encapsulated in a clear purple tinted, plastic T-1 package.
QEC121 QEC122 QEC123
FEATURES
D= 880 nm
• Chip material = AlGaAs
• Package type: T-1 (3mm lens diameter)
• Matched Photosensor: QSC112/113/114
• High Output Power
• Package material and color: Clear, purple tinted, plastic
SCHEMATIC
0.030 (0.76) NOM
0.116 (2.95)
0.193 (4.90)
0.800 (20.3) MIN
0.050 (1.27)
0.100 (2.54) NOM
0.018 (0.46) SQ. (2X)
0.155 (3.94)
CATHODE
0.052 (1.32)
0.032 (0.082)
REFERENCE
SURFACE
PACKAGE DIMENSIONS
NOTES:
1. Dimensions are in inches (millimeters)
2. Tolerance of ± .010 (.25) on all non nominal dimensions unless otherwise specified.
PLASTIC INFRARED
LIGHT EMITTING DIODE
2001 Fairchild Semiconductor Corporation
DS300335 5/18/01 1 OF 4 www.fairchildsemi.com
ANODE
CATHODE
Parameter Symbol Rating Unit
Operating Temperature T
OPR
-40 to +100 °C
Storage Temperature T
STG
-40 to +100 °C
Soldering Temperature (Iron)
(2,3,4)
T
SOL-I
240 for 5 sec °C
Soldering Temperature (Flow)
(2,3)
T
SOL-F
260 for 10 sec °C
Continuous Forward Current I
F
50 mA
Reverse Voltage V
R
5V
Power Dissipation
(1)
P
D
100 mW
ABSOLUTE MAXIMUM RATINGS
(TA= 25°C unless otherwise specified)
www.fairchildsemi.com 2 OF 4 5/18/01 DS300335
QEC121 QEC122 QEC123
PLASTIC INFRARED
LIGHT EMITTING DIODE
PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS
Peak Emission Wavelength IF= 100 mA D
PE
880 nm
Emission Angle IF= 100 mA 20
1/
2
16 Deg.
Forward Voltage IF= 100 mA, tp = 20 ms V
F
——1.7 V
Reverse Current VR= 5 V I
R
——10 µA
Radiant IntensityQEC121 IF= 100 mA, tp = 20 ms I
E
14 ——mW/sr
Radiant IntensityQEC122 IF= 100 mA, tp = 20 ms I
E
27 94 mW/sr
Radiant IntensityQEC123 IF= 100 mA, tp = 20 ms I
E
39 ——mW/sr
Rise Time
I
F
= 100 mA
t
r
800 ns
Fall Time t
f
800 ns
ELECTRICAL / OPTICAL CHARACTERISTICS
(TA= 25°C)
NOTES
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron
1/16
(1.6mm) minimum from housing.
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