Fairchild Semiconductor NDP7050 Datasheet

NDP7050 / NDB7050 N-Channel Enhancement Mode Field Effect Transistor
General Description Features
March 1996
These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage applications such as automotive, DC/DC converters, PWM motor controls, and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.
75A, 50V. R
= 0.013 @ VGS=10V.
DS(ON)
Critical DC electrical parameters specified at elevated temperature.
Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor.
175°C maximum junction temperature rating. High density cell design for extremely low R
DS(ON)
TO-220 and TO-263 (D2PAK) package for both through hole and surface mount applications.
.
_______________________________________________________________________________
D
G
S
Absolute Maximum Ratings T
= 25°C unless otherwise noted
Symbol Parameter NDP7050 NDB7050 Units
V
DSS
V
DGR
V
GSS
Drain-Source Voltage 50 V Drain-Gate Voltage (RGS < 1 M)
50 V
Gate-Source Voltage - Continuous ± 20 V
- Nonrepetitive (tP < 50 µs) ± 40
I
D
Drain Current - Continuous 75 A
- Pulsed 225
P
D
Maximum Power Dissipation @ TC = 25°C 150 W
Derate above 25°C 1 W/°C TJ,T T
L
Operating and Storage Temperature Range -65 to 175 °C
STG
Maximum lead temperature for soldering
275 °C
purposes, 1/8" from case for 5 seconds
© 1997 Fairchild Semiconductor Corporation
NDP7050.SAM Rev. D
Electrical Characteristics (T
= 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units DRAIN-SOURCE AVALANCHE RATINGS (Note 1)
W
I
AR
Single Pulse Drain-Source Avalanche
DSS
Energy
VDD = 25 V, ID = 75 A 550 mJ
Maximum Drain-Source Avalanche Current 75 A
OFF CHARACTERISTICS
BV I
DSS
Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 50 V
DSS
Zero Gate Voltage Drain Current VDS = 50 V, V
= 0 V 250 µA
GS
TJ = 125°C 1 mA
I
GSSF
I
GSSR
Gate - Body Leakage, Forward VGS = 20 V, VDS = 0 V 100 nA Gate - Body Leakage, Reverse VGS = -20 V, VDS = 0 V -100 nA
ON CHARACTERISTICS (Note 1)
V
GS(th)
Gate Threshold Voltage VDS = VGS, ID = 250 µA 2 2.8 4 V
TJ = 125°C 1.4 2.1 3.6
R
DS(ON)
Static Drain-Source On-Resistance VGS = 10 V, ID = 40 A 0.01 0.013
TJ = 125°C 0.015 0.023 I g
D(on)
FS
On-State Drain Current VGS = 10 V, VDS = 10 V 75 A Forward Transconductance VDS = 10 V, ID = 37.5 A 15 39 S
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Input Capacitance VDS = 25 V, VGS = 0 V, Output Capacitance 1130 1600 pF
f = 1.0 MHz
Reverse Transfer Capacitance 380 800 pF
2960 3600 pF
SWITCHING CHARACTERISTICS (Note 1)
t t
t t
Q Q Q
D(on)
r
D(off)
f
g
gs
gd
Turn - On Delay Time VDD = 30 V, ID = 75 A, Turn - On Rise Time 128 400 nS
VGS = 10 V, R
GEN
= 5
17 30 nS
Turn - Off Delay Time 54 80 nS Turn - Off Fall Time 90 200 nS
Total Gate Charge VDS = 48 V, Gate-Source Charge 14.5 nC
ID = 75 A, VGS = 10 V
100 115 nC
Gate-Drain Charge 51 nC
NDP7050.SAM Rev. D
Electrical Characteristics (T
= 25°C unless otherwise noted)
C
Symbol Parameter Conditions Min Typ Max Units DRAIN-SOURCE DIODE CHARACTERISTICS
I
S
Maximum Continuos Drain-Source Diode Forward Current 75 A ISM Maximum Pulsed Drain-Source Diode Forward Current 225 A V
SD
Drain-Source Diode Forward Voltage VGS = 0 V, IS = 37.5 A (Note 1) 0.9 1.3 V
TJ = 125°C 0.84 1.2
t
rr
I
rr
Reverse Recovery Time VGS = 0 V, IF = 75 A, dIF/dt = 100 A/µs 80 150 ns
Reverse Recovery Current 2 4.8 10 A
THERMAL CHARACTERISTICS
R
θ
R
θ
Note:
1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.
Thermal Resistance, Junction-to-Case 1 °C/W
JC
Thermal Resistance, Junction-to-Ambient 62.5 °C/W
JA
NDP7050.SAM Rev. D
Typical Electrical Characteristics
120
V =20V
GS
100
80
60
10
8.0
7.0
6.5
6.0
5.5
40
20
D
I , DRAIN-SOURCE CURRENT (A)
0
0 1 2 3 4 5
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1. On-Region Characteristics.
2
I = 40A
D
1.8
V = 10V
GS
1.6
1.4
1.2
1
DS(ON)
0.8
R , NORMALIZED
0.6
DRAIN-SOURCE ON-RESISTANCE
0.4
-50 -25 0 25 50 75 100 125 150 175 T , JUNCTION TEMPERATURE (°C)
J
5.0
4.5
4.0
2.5
V = 5.0V
GS
2
1.5
DS(on)
1
R , NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
0.5 0 20 40 60 80 100 120
5.5
6.0
I , DRAIN CURRENT (A)
D
6.5
Figure 2. On-Resistance Variation with Gate
Voltage and Drain Current.
1.8
V = 10V
GS
1.6
1.4
1.2
1
DS(on)
R , NORMALIZED
0.8
DRAIN-SOURCE ON-RESISTANCE
0.6 0 20 40 60 80 100 120
T = 125°C
J
25°C
I , DRAIN CURRENT (A)
D
-55°C
7.0
8.0 10
12
20
Figure 3. On-Resistance Variation
with Temperature.
60
V = 10V
DS
50
T = -55°C
25°C
J
125°C
40
30
20
D
I , DRAIN CURRENT (A)
10
0
2 3 4 5 6 7
V , GATE TO SOURCE VOLTAGE (V)
GS
Figure 5. Transfer Characteristics.
Figure 4. On-Resistance Variation with Drain
Current and Temperature.
1.2
V = V
1.1
1
0.9
0.8
0.7
GS(th)
V , NORMALIZED
0.6
GATE-SOURCE THRESHOLD VOLTAGE
0.5
-50 -25 0 25 50 75 100 125 150 175 T , JUNCTION TEMPERATURE (°C)
J
DS
I = 250µA
D
Figure 6. Gate Threshold Variation with
Temperature.
GS
NDP7050.SAM Rev. D
Loading...
+ 8 hidden pages