Data Sheet December 2001
20A, 60V, 0.037 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFETs
Packaging
JEDEC TO-251AA JEDEC TO-252AA
DRAIN
(FLANGE)
HUFA76423D3
SOURCE
DRAIN
GATE
GATE
SOURCE
HUF A76 423D3S
DRAIN
(FLANGE)
Symbol
HUFA76423D3, HUFA76423D3S
Features
• Ultra Low On-Resistance
-r
-r
• Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
• Peak Cu rrent vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs R
DS(ON)
DS(ON)
= 0.032Ω, V
= 0.037Ω,
GS
GS
V
GS
= 10V
= 5V
Curves
D
G
S
Absolute Maximum Ratings
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
Continuous (T
Continuous (TC = 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TC = 100oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TC = 100oC, VGS = 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS Figures 6, 17, 18
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Maximum T emperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
NOTES:
1. T
= 25oC to 150oC.
J
CAUTION: Stresses above those listed in “Absolute Ma ximum Ratings” m ay cause per manen t damag e to t he device. This is a stress o nly rating and operation of th e
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
= 25oC, VGS = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
TC = 25oC, Unless Otherwise Specified
Ordering Information
PART NUMBER PACKAGE BRAND
HUFA76423D3 TO-251AA 76423D
HUFA76423D3S TO-252AA 76423D
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUFA76423D3ST.
HUFA76423D3,
HUFA76423D3S UNITS
DSS
DGR
GS
D
D
D
D
DM
D
, T
J
STG
L
pkg
60 V
60 V
±16 V
20
20
20
20
Figure 4
85
0.567
-55 to 175
300
260
A
A
A
A
W
W/oC
o
C
o
C
o
C
This product has be en desi gned t o mee t t he ex tre me test con diti ons a nd e nviro nment dema nded by the autom otive indu str y. Fo r a copy
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
©2001 Fairchild Semiconductor Corpo ration HUFA76423D3, HUFA76423D3S Rev. B
of the requirements, see AEC Q101 at: http://www.aecouncil.com/
HUFA76423D3, HUFA76423D3S
Electrical Specifications
TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V
Drain to Source On Resistance r
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case R
Thermal Resistance Junction to
Ambient
SWITCHING SPECIFICATIONS (V
= 4.5V)
GS
Turn-On Time t
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Turn-Off Time t
SWITCHING SPECIFICATIONS (V
GS
= 10V)
Turn-On Time t
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Turn-Off Time t
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q
Gate Charge at 5V Q
Threshold Gate Charge Q
Gate to Source Gate Charge Q
Gate to Drain “Miller” Charge Q
CAPACITANCE SPECIFICATIONS
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
DSSID
I
D
DSS
GSS
GS(TH)VGS
DS(ON)ID
θJC
R
θJA
ON
d(ON)
d(OFF)
OFF
ON
d(ON)
d(OFF)
OFF
g(TOT)VGS
g(5)
g(TH)
ISS
OSS
RSS
VDS = 55V, VGS = 0V - - 1 µA
V
DS
VGS = ±16V - - ±100 nA
I
D
I
D
TO-251 and TO-252 - - 1.76oC/W
VDD = 30V, ID = 20A
V
GS
(Figures 15, 21, 22)
r
f
VDD = 30V, ID = 20A
V
GS
R
r
f
GS
(Figures 16, 21, 22)
VGS = 0V to 5V - 16 20 nC
VGS = 0V to 1V - 1.2 1.5 nC
gs
gd
VDS = 25V, VGS = 0V,
f = 1MHz
(Figure 13)
= 250µA, VGS = 0V (Figure 12) 60 - - V
= 250µA, VGS = 0V , TC = -40oC (Figure 12) 55 - - V
= 50V, VGS = 0V, TC = 150oC - - 250 µA
= VDS, ID = 250µA (Figure 11) 1 - 3 V
= 20A, VGS = 10V (Figures 9, 10) - 0.027 0.032 Ω
= 20A, VGS = 5V (Figure 9) - 0.031 0.037 Ω
= 20A, VGS = 4.5V (Figure 9) - 0.033 0.040 Ω
- - 100
o
C/W
- - 240 ns
= 4.5V, RGS = 10Ω
-12-ns
- 145 - ns
-27-ns
-50-ns
- - 120 ns
- - 65 ns
= 10V,
= 10Ω
-7-ns
-35-ns
-52-ns
- 50 - ns
- - 155 ns
= 0V to 10V VDD = 30V,
I
= 20A,
D
= 1.0mA
I
g(REF)
-2834nC
(Figures 14, 19, 20)
-3.5-nC
-7-nC
- 1060 - pF
- 315 - pF
-65-pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
Reverse Recovery Time t
Reverse Recovered Charge Q
©2001 Fairchild Semiconductor Corpo ration HUFA76423D3, HUFA76423D3S Rev. B
SD
rr
RR
ISD = 20A - - 1.25 V
= 10A - - 1.0 V
I
SD
ISD = 20A, dISD/dt = 100A/µs--90ns
ISD = 20A, dISD/dt = 100A/µs - - 225 nC
Typical Performance Curves
HUFA76423D3, HUFA76423D3S
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 17
125
150
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIP ATION vs CASE
TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
JC
θ
Z
THERMAL IMPEDANCE
SINGLE PULSE
0.01
-5
10
-4
10
10
-3
t, RECTANGULAR PULSE DURATION (s)
25
20
V
15
GS
= 4.5V
10
, DRAIN CURRENT (A)
D
I
5
0
25 50 75 100 125 150 17
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
P
DM
t
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
10
-1
10
1/t2
x R
JC
θ
10
+ T
JC
θ
0
V
= 10V
GS
1
t
2
C
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
500
100
VGS = 10V
, PEAK CURRENT (A)
DM
I
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
10
-5
10
-4
10
VGS = 5V
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
0
C
150
10
FIGURE 4. PEAK CURRENT CAPABILITY
©2001 Fairchild Semiconductor Corpo ration HUFA76423D3, HUFA76423D3S Rev. B