Fairchild Semiconductor HUF75345S3 Datasheet

©2001 Fairchild Semiconductor Corporati on HUF75345G3, HUF75345P3, HUF75345S3S Rev. B
HUF75345G3, HUF75345P3, HUF75345S3S
75A, 55V, 0.007 Ohm, N-Channel UltraFET Power MOSFETs
These N-Channel pow er MOSFETs are manufactured using the innovat ive Ul traFET® pr ocess. This
advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outsta ndi ng performance. This device i s c apa ble of withstanding hi gh ene r gy in the a valanche mode and the diode exhibits very low reverse recove ry time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, low­voltage bus switches, and power management in portable and battery-operated products.
Formerly developmental type TA75345.
Features
• 75A, 55V
• Simulation Models
- Temperature Compensated PSPICE® and SABER™ Models
- Thermal Impedance SPICE and SABER Models Available on the WEB at: www.fairchildsemi.com
• Pea k Cu rrent vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount Components to PC Boards”
Symbol
Packaging
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html
For severe environments, see our Automotive HUFA series.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
Ordering Information
PART NUMBER PACKAGE BRAND
HUF75345G3 TO-247 75345G HUF75345P3 TO-220AB 75345P HUF75345S3S TO-263AB 75345S
NOTE: When ordering, use the entire part number. Add the suffix T to obtain the TO-263AB variant in tape and reel, e.g., HUF75345S3ST.
D
G
S
JEDEC STYLE TO-247 JEDEC TO-220AB
JEDEC TO-263AB
SOURCE
DRAIN
GATE
DRAIN (TAB)
DRAIN
SOURCE
GATE
DRAIN
(FLANGE)
GATE
SOURCE
DRAIN
(FLANGE)
Data Sheet December 2001
©2001 Fairchild Semiconductor Corporati on HUF75345G3, HUF75345P3, HUF75345S3S Rev. B
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
55 V
Drain to Gate Voltage (R
GS
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
55 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
±20 V
Drain Current
Continuous (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
75
Figure 4
A
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
AS
Figure 6
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
325
2.17
W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
-55 to 175
o
C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
L
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
300 260
o
C
o
C
CAUTION: Stresses above those listed in “A bsolute Maximu m Rating s” may cause per manent d amage to t he device. This is a str ess onl y rating and operation o f the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. T
J
= 25oC to 150oC.
Electrical Specifications
TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV
DSSID
= 250µA, VGS = 0V (Figure 11) 55 - - V
Zero Gate Voltage Drain Current I
DSS
VDS = 50V, VGS = 0V - - 1 µA V
DS
= 45V, VGS = 0V, TC = 150oC--250µA
Gate to Source Leakage Current I
GSS
VGS = ±20V - - ±100 nA
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V
GS(TH)VGS
= VDS, ID = 250µA (Figure 10) 2 - 4 V
Drain to Source On Resistance r
DS(ON)ID
= 75A, VGS = 10V (Figure 9) - 0.006 0.007 W
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case R
θJC
(Figure 3) - - 0.46
o
C/W
Thermal Resistance Junction to Ambient R
θJA
TO-247 - - 30
o
C/W
TO-220, TO-263 - - 62
o
C/W
SWITCHING SPECIFICATIONS (V
GS
= 10V)
Turn-On Time t
ON
VDD = 30V, ID 75A, R
L
= 0.4Ω, VGS = 10V,
R
GS
= 2.5
--145ns
Turn-On Delay Time t
d(ON)
-20- ns
Rise Time t
r
-75- ns
Turn-Off Delay Time t
d(OFF)
-45- ns
Fall Time t
f
-30- ns
Turn-Off Time t
OFF
--115ns
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q
g(TOT)VGS
= 0V to 20V VDD = 30V,
I
D
75A,
R
L
= 0.4
I
g(REF)
= 1.0mA
(Figure 13)
- 220 275 nC
Gate Charge at 10V Q
g(10)
VGS = 0V to 10V - 125 165 nC
Threshold Gate Charge Q
g(TH)
VGS = 0V to 2V - 6.8 10 nC
Gate to Source Gate Charge Q
gs
-14-nC
Gate to Drain “Miller” Charge Q
gd
-58-nC
HUF75345G3, HUF75345P3, HUF75345S3S
©2001 Fairchild Semiconductor Corporati on HUF75345G3, HUF75345P3, HUF75345S3S Rev. B
CAPACITANCE SPECIFICATIONS
Input Capacitance C
ISS
VDS = 25V, VGS = 0V, f = 1MHz (Figure 12)
- 4000 - pF
Output Capacitance C
OSS
- 1450 - pF
Reverse Transfer Capacitance C
RSS
- 450 - pF
Electrical Specifications
TC = 25oC, Unless Otherwise Specified (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
SD
ISD = 75A - - 1.25 V
Reverse Recovery Time t
rr
ISD = 75A, dISD/dt = 100A/µs - - 110 ns
Reverse Recovered Charge Q
RR
ISD = 75A, dISD/dt = 100A/µs - - 225 nC
Typical Performance Curves
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
TC, CASE TEMPERATURE (oC)
POWER DISSIPA TION MULTIPLIER
0
0 25 50 75 100 150
0.2
0.4
0.6
0.8
1.0
1.2
125 17
5
I
D
, DRAIN CURRENT (A)
TC, CASE TEMPERATURE (oC)
20
40
60
80
50 75 100 125 150 17
5
0
25
t, RECTANGULAR PULSE DURATION (s)
SINGLE PULSE
NOTES: DUTY FACTOR: D = t
1/t2
PEAK TJ = PDM x Z
θJC
x R
θJC
+ T
C
P
DM
t
1
t
2
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.01
0.02
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
-5
0.1
1
2
0.01
Z
θJC
, NORMALIZED
THERMAL IMPEDANCE
HUF75345G3, HUF75345P3, HUF75345S3S
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