Fairchild Semiconductor FQU5N20L, FQD5N20L Datasheet

FQD5N20L / FQU5N20L
December 2000
QFET
QFET
QFETQFET
FQD5N20L / FQU5N20L
TM
General Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation modes. These devices are well suited for high efficiency switching DC/DC conv erte rs, switch mode power supplies, and motor control.
D
S
D-PAK
= 25°C)
C
G
D
S
= 25°C unless otherwise noted
C
= 25°C)
C
= 100°C)
C
FQD Series
- Continuous (T
- Continuous (T
- Derate above 25°C 0.29 W/°C
G
Absolute Maximum Ratings T
Symbol Parameter FQD5N20L / FQU5N20L Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt P
D
, T
T
J
STG
T
L
Drain-Source Voltage 200 V Drain Current
Drain Current - Pulsed Gate-Source Voltage ± 20 V Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy
Power Dissipation (TA = 25°C) * Power Dissipation (T
Operating and Storage Temperature Range -55 to +150 °C Maximum lead temperature for soldering purposes,
1/8 from case for 5 seconds
Features
• 3.8A, 200V, R
• Low gate charge ( typical 4.8 nC)
• Low Crss ( typical 6.0 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• Low level gate drive requirement allowing direct operation from logic drivers
I-PAK
FQU Series
(Note 1)
(Note 2) (Note 1) (Note 1) (Note 3)
= 1.2Ω @VGS = 10 V
DS(on)
!
!
G
3.8 A
2.4 A
15.2 A
60 mJ
3.8 A
3.7 mJ
5.5 V/ns
2.5 W 37 W
300 °C
!
!
D
!
!
"
"
"
"
"
" "
"
!
!
S
Thermal Characteristics
Symbol Parameter Typ Max Units
R
θJC
R
θJA
R
θJA
* When mounted on the minimum pad size recommended (PCB Mount)
©2000 Fairchild Semiconductor International
Thermal Resistance, Junction-to-Case -- 3.4 °C/W Thermal Resistance, Junction-to-Ambient * -- 50 °C/W Thermal Resistance, Junction-to-Ambient -- 110 °C/W
Rev. A2, December 2000
FQD5N20L / FQU5N20L
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter T e s t Conditions Min Typ Max Units
Off Characteristics
BV
DSS
BV
DSS
/ ∆T I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage Breakdown Voltage Temperature
Coefficient
J
Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 µA
V
GS
I
= 250 µA, Referenced to 25°C
D
V
= 200 V, VGS = 0 V
DS
V
= 160 V, TC = 125°C
DS
V
= 20 V, VDS = 0 V
GS
= -20 V, VDS = 0 V
V
GS
200 -- -- V
-- 0.18 -- V/°C
-- -- 1 µA
-- -- 10 µA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V R
g
FS
GS(th)
DS(on)
Gate Threshold Voltage Static Drain-Source
On-Resistance Forward Transconductance
V
= VGS, ID = 250 µA
DS
V
= 10 V, ID = 1.9 A
GS
= 5 V, ID = 1.9 A
V
GS
V
= 30 V, ID = 1.9 A
DS
(Note 4)
1.0 -- 2.0 V
0.94
--
0.98
1.2
1.25
-- 3.35 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance -- 40 50 pF Reverse Transfer Capacitance -- 6 8 pF
= 25 V, VGS = 0 V,
V
DS
f = 1.0 MHz
-- 250 325 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q Q Q
g gs gd
Turn-On Delay Time Turn-On Rise Time -- 90 190 ns Turn-Off Delay Time -- 15 40 ns Turn-Off Fall Time -- 50 110 ns Total Gate Charge Gate-Source Charge -- 1.2 -- nC Gate-Drain Charge -- 2.4 -- nC
= 100 V, ID = 4.5 A,
V
DD
= 25
R
G
= 160 V, ID = 4.5 A,
V
DS
V
GS
= 5 V
(Note 4, 5)
(Note 4, 5)
-- 9 25 ns
-- 4.8 6.2 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 6.2mH, IAS = 3.8A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD 4.5A, di/dt 300A/µs, VDD BV
4. Pulse Test : Pulse width 300µs, Duty cycle 2%
5. Essentially independent of operating temperature
©2000 Fairchild Semiconductor International
Maximum Continuous Drain-Source Diode Forward Current -- -- 3.8 A Maximum Pulsed Drain-Source Diode Forward Current -- -- 15.2 A
= 0 V, IS = 3.8 A
Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge -- 0.3 -- µC
Starting TJ = 25°C
DSS,
V
GS
= 0 V, IS = 4.5 A,
V
GS
/ dt = 100 A/µs
dI
F
(Note 4)
-- -- 1.5 V
-- 95 -- ns
Rev. A2, December 2000
Typical Characteristics
FQD5N20L / FQU5N20L
V
GS
1
10
Top : 10 V
8.0 V
6.0 V
5.0 V
4.5 V
4.0 V
3.5 V Botto m : 3.0 V
0
10
, Drain Current [A]
D
I
-1
10
-1
10
0
10
Notes :
1. 250μs Pulse Test
2. T
= 25
C
1
10
VDS, Drain-Source Voltage [V]
8
6
],
4
Ω
[
DS(ON)
R
2
Drain-Source On-Resistance
0
0246810
VGS = 5V
VGS = 10V
Note : T
= 25
J
ID, Dra in Current [A]
1
10
150
0
10
25
, Dra in Curre n t [A]
D
I
-1
10
0246810
-55
Notes :
1. V
= 30V
DS
2. 250μs Pulse Test
VGS , Gate -Source Voltag e [V]
Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s
1
10
0
10
, Reverse Drain Current [A]
DR
I
-1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
150
25
Notes :
1. V
= 0V
GS
2. 250μs Pulse Te st
VSD , So u r c e-Drai n V oltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
500
400
300
200
Capacitance [pF]
100
0
-1
10
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics
©2000 Fairchild Semiconductor International
C C C
C
iss
C
oss
C
rss
0
10
VDS, Drain-Source Voltage [V]
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
oss
gd
= C
rss
gd
Notes :
1. V
GS
2. f = 1 MH z
1
10
= 0 V
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
VDS = 40V
Note : I
= 4.5 A
D
Rev. A2, December 2000
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
0246810
VDS = 100V
VDS = 160V
QG, Tota l Gate Charge [n C]
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