Fairchild Semiconductor FQI3N80, FQB3N80 Datasheet

FQB3N80 / FQI3N80

800V N-Channel MOSFET

September 2000

TM

QFET

General Description

FQB3N80 / FQI3N80

These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well

Features

• 3.0A, 800V, R

• Low gate charge ( typical 15 nC)

• Low Crss ( typical 7.0 pF)

• Fast switching

• 100% avalanche tested

• Improved dv/dt capability

= 5.0Ω @VGS = 10 V

DS(on)

suited for high efficiency switch mode power supply.

D

!

!

G

S

D2-PAK

FQB Series

G

Absolute Maximum Ratings

D

S

TC = 25°C unless otherwise noted

I2-PAK

FQI Series

G

Symbol Parameter FQB3N80 / FQI3N80 Units

V

DSS

I

D

I

DM

V

GSS

E

AS

I

AR

E

AR

dv/dt Peak Diode Recovery dv/dt
P

D

Drain-Source Voltage 800 V
Drain Current

- Continuous (T

- Continuous (T

Drain Current - Pulsed

= 25°C)

C

= 100°C)

C

(Note 1)

3.0 A

1.9 A
12 A

Gate-Source Voltage ± 30 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy

Power Dissipation (TA = 25°C) *
Power Dissipation (T

= 25°C)

C

(Note 2)
(Note 1)
(Note 1)
(Note 3)

320 mJ

3.0 A

10.7 mJ

4.0 V/ns

3.13 W
107 W

- Derate above 25°C 0.85 W/°C

T

, T

J

STG

T

L

Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds

300 °C

D

!

!

"

"

5

5

3

3

"

"
"

"

!

!

S

Thermal Characteristics

Symbol Parameter Typ Max Units

R

θJC

R

θJA

R

θJA

* When mounted on the minimum pad size recommended (PCB Mount)

©2000 Fairchild Semiconductor International

Thermal Resistance, Junction-to-Case -- 1.17 °C/W
Thermal Resistance, Junction-to-Ambient * -- 40 °C/W
Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W

Rev. A, September 2000

FQB3N80 / FQI3N80

Electrical Characteristics

T

= 25°C unless otherwise noted

C

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV

DSS

∆BV

DSS

/ ∆T
I

DSS

I

GSSF

I

GSSR

Drain-Source Breakdown Voltage
Breakdown Voltage Temperature

Coefficient

J

Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward

Gate-Body Leakage Current, Reverse

= 0 V, ID = 250 µA

V

GS

I

= 250 µA, Referenced to 25°C

D

V

= 800 V, VGS = 0 V

DS

V

= 640 V, TC = 125°C

DS

V

= 30 V, VDS = 0 V

GS

= -30 V, VDS = 0 V

V

GS

800 -- -- V

-- 0.9 -- V/°C

-- -- 10 µA

-- -- 100 µA

-- -- 100 nA

-- -- -100 nA

On Characteristics

V
R

g

FS

GS(th)

DS(on)

Gate Threshold Voltage
Static Drain-Source

On-Resistance
Forward Transconductance

V

= VGS, ID = 250 µA

DS

= 10 V, ID = 1.5 A

V

GS

= 50 V, ID = 1.5 A

V

DS

(Note 4)

3.0 -- 5.0 V

-- 3.8 5.0 Ω

-- 2.85 -- S

Dynamic Characteristics

C

iss

C

oss

C

rss

Input Capacitance
Output Capacitance -- 57 75 pF
Reverse Transfer Capacitance -- 7.0 9.0 pF

= 25 V, VGS = 0 V,

V

DS

f = 1.0 MHz

-- 530 690 pF

Switching Characteristics

t

d(on)

t

r

t

d(off)

t

f

Q
Q
Q

g
gs
gd

Turn-On Delay Time
Turn-On Rise Time -- 40 90 ns
Turn-Off Delay Time -- 30 70 ns
Turn-Off Fall Time -- 30 70 ns
Total Gate Charge
Gate-Source Charge -- 3.5 -- nC
Gate-Drain Charge -- 7.7 -- nC

= 400 V, ID = 3.0 A,

V

DD

= 25 Ω

R

G

V

= 640 V, ID = 3.0 A,

DS

V

GS

= 10 V

(Note 4, 5)

(Note 4, 5)

-- 15 4 0 ns

-- 15 1 9 nC

Drain-Source Diode Characteristics and Maximum Ratings

I

S

I

SM

V

SD

t

rr

Q

rr

Notes:

1. Repetitive Rating : Pulse width limited by maximum junction temperature

2. L = 67mH, IAS = 3.0A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C

3. ISD ≤ 3.0A, di/dt ≤ 200A/µs, VDD ≤ BV

4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%

5. Essentially independent of operating temperature

©2000 Fairchild Semiconductor International

Maximum Continuous Drain-Source Diode Forward Current -- -- 3.0 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 12 A

= 0 V, IS = 3.0 A

Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 2.8 -- µC

Starting TJ = 25°C

DSS,

V

GS

= 0 V, IS = 3.0 A,

V

GS

/ dt = 100 A/µs

dI

F

-- -- 1.4 V

-- 530 -- ns

(Note 4)

Rev. A, September 2000

Typical Characteristics

1

10

V

GS

Top : 15 .0 V

10.0 V

8.0 V

7.0 V

6.5 V

6.0 V

0

10

Botto m : 5.5 V

FQB3N80 / FQI3N80

-1

10

, Drain Current [A]

D

I

-2

10

-1

10

0

10

※

Notes :

1. 250μs Pulse Tes t

℃

2. T

= 25

C

1

10

VDS, Drain-Source Voltage [V]

1

10

150oC

0

10

, Drain Current [A]

D

I

-1

10

246810

25oC

VGS, Gate-Source V oltage [V]

-55oC

※

Notes :

1. V

= 50V

DS

2. 250μs Pulse Test

Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s

10

8

],

Ω

[

6

DS(ON)

R

4

VGS = 10V

VGS = 20V

Drain-Source On-Resistance

℃

※

= 25

Note : T

2

02468

J

ID, Drain Current [A]

1

10

0

10

150

, Reverse Drain Current [A]

DR

I

-1

10

0.2 0.4 0.6 0.8 1.0 1.2

VSD, Sou r c e-Drain voltage [V]

℃

℃

25

※

Notes :

= 0V

1. V

GS

2. 250μs Pulse Test

Figure 3. On-Resistance Variation vs

Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage

Variation with Source Current

and Temperature

900

800

700

600

500

400

300

Capacitance [pF]

200

100

0

-1

10

C

= Cgs + Cgd (Cds = shorted)

iss

= Cds + C

C

oss

gd

C

= C

rss

10

gd

1

※

Note s :

1. V

= 0 V

GS

2. f = 1 MHz

C

iss

C

oss

C

rss

0

10

VDS, Drain-Source Voltage [V]

12

10

8

6

4

, Gate-Source Voltage [V]

2

GS

V

0

0 2 4 6 810121416

QG, Tota l Gate Ch arge [nC]

VDS = 160V

VDS = 400V

VDS = 640V

※

Note : I

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics

= 3.0A

D

Rev. A, September 2000©2000 Fairchild Semiconductor International