Fairchild Semiconductor FDD6030BL Datasheet

FDD6030BL
(
)
N-Channel PowerTrenchTM MOSFET
FDD6030BL
April 1999
ADV ANCE INFORMATION
General Description
This N-Channel Logic level MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize the on­state resistance and yet maintain low gate charge for superior switching performance.
Features
35 A, 30 V. R
R
Low gate charge.
= 0.018 @ V
= 0.025 @ V
= 10 V
GS
= 4.5 V.
GS
Fast switching speed.
Applications
DC/DC converter
High performance trench technology for extremely
low R
.
Motor drives
D
D
G
G
S
TO-252
T
=25oC unless otherwise noted
Absolute Maximum Ratings
Symbol Parameter Ratings Units
V
DSS
V
GSS
I
D
P
D
TJ, T
stg
Drain-Source Voltage 30 V Gate-Source Voltage Maximum Drain Current -Continuous
Maximum Drain Current -Pulsed 100 Maximum Power Dissipation @ TC = 25oC
TA = 25oC Operating and Storage Junction Temperature Range -55 to +150
C
TA = 25oC
Note 1
(Note 1a)
(Note 1) (Note 1a) (Note 1b)
S
20 V
±
35
9
44
2.8
1.3
A
W
C
°
Thermal Characteristics
R
JC
θ
R
JA
θ
Thermal Resistance, Junction-to- Case Thermal Resistance, Junction-to- Ambient
(Note 1)
(Note 1b)
2.8 96
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
FDD6030BL FDD6030BL 13’’ 16mm 2500
1999 Fairchild Semiconductor Corporation
C/W
°
C/W
°
FDD6030BL Rev. A
FDD6030BL
yp
Electrical Characteristics
TC=25oC unless otherwise noted
Symbol Parameter Test Conditions Min T
OFF CHARACTERISTICS
BV
DSS
I
DSS
I
GSSF
I
GSSR
ON CHARACTERISTICS
V
GS(TH)
R
DS(ON)
Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA30 V Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 1 Gate-Body Leakage, Forward VGS = 20 V, VDS = 0 V 100 nA Gate-Body Leakage, Reverse VGS = -20 V, VDS = 0 V -100 nA
(Note 2)
Gate Threshold Voltage VDS = VGS, ID = 250 µA1 3V Static Drain-Source
On-Resistance
VGS = 10 V, ID = 9 A V
= 4.5 V, ID = 7.5 A
GS
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
V
SD
Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward
VGS = 0 V, IS = 2.3 A
Voltage
Notes:
1. R
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the drain tab.
θJA
R
is guaranteed by design while R
θJC
is determined by the user's board design.
θJA
a) R
= 45oC/W when mounted on a
θJA
1in2 pad of 2oz copper.
1.3 V
b) R
= 96oC/W when mounted on a
θJA
minimum pad.
Max Units
A
µ
0.018
0.025
2.3 A
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
FDD6030BL Rev. A
Loading...
+ 3 hidden pages