Thermal Resistance Junction to Case TO-2521.11
Thermal Resistance Junction to Ambient TO-252100
Thermal Resistance Junction to Ambient TO-252, 1 in2 copper pad area52
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be fou nd a t: http://ww w.f airc hilds e m i.co m /pr oduc ts/dis c rete/reliab ility/ind ex.html.
FDD10AN 06A0FDD10AN06A0TO-252AA330m m16mm 2500 units
FDD10AN06A0
Electrical Characteristics
TC = 25°C unless otherwise noted
SymbolParameterTest Con ditionsMinTypMaxUnits
Off Characteristics
B
I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down VoltageID = 250µA, VGS = 0V60--V
V
= 50V--1
Zero Gate Voltage Drain Current
DS
= 0VTC = 150oC- -250
V
GS
Gate to Source Leakage CurrentVGS = ±20V--±100nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold VoltageVGS = VDS, ID = 250µA2-4V
I
= 50A, VGS = 10V -0.0094 0.0105
D
I
= 25A, VGS = 6V -0.0150.027
Drain to S ou r c e On Re si st ance
D
I
= 50A, VGS = 10V,
D
T
= 175oC
J
-0.0200.023
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(TH)
gs
gs2
gd
Input Capacitance
Output Capacitance-340-pF
Reverse Transfer Capacitance-110-pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10VVGS = 0V to 10V
Threshold Gate ChargeVGS = 0V to 2V-3.54.6nC
Gate to Source Gate Charg e-9.8-nC
Gate Charge Threshold to Plateau-6.4-nC
V
DD
I
= 50A
D
I
= 1.0m A
g
= 30V
Gate to Drain “Miller” Charge-7.8-nC
-1840-pF
2837nC
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time-8-ns
Rise Time-79-ns
Turn-Off D elay Time-32-ns
Fall Time-32-ns
Turn-Off Time--97ns