Fairchild Semiconductor FDC6329L Datasheet

FDC6329L

Integrated Load Switch

General Description Features

This device is particularly suited for compact power
management in portable electronic equipment where

2.5V to 8V input and 2.5A output current capability are
needed. This load switch integrates a small N-Channel
power MOSFET (Q1) which drives a large P-Channel
power MOSFET (Q2) in one tiny SuperSOTTM-6
package.

V

DROP

@ VIN=2.5V, IL=1.9A. R
Control MOSFET (Q1) includes Zener protection for ESD

ruggedness (>6KV Human Body Model).
High performance trench technology for extremely low

on-resistance.
SuperSOTTM-6 package design using copper lead frame for

superior thermal and electrical capabilities.

=0.2V @ VIN=5V, IL=2.8A. R

= 0.105Ω.

(ON)

November 1998

= 0.07Ω V

(ON)

DROP

=0.2V

SOT-23

SuperSOTTM-6

SuperSOTTM-8

SO-8

SOT-223

SOIC-16

EQUIVALENT CIRCUIT

V , C

3

2

Q1

1

OUT

V , C

OUT

R

2

1

V

DROP

+

IN

1

ON/OFF

-

.329

pin 1

SuperSOT -6

TM

V , R

IN

V

ON/OFF

R , C

1

4

1

5

6

1

See Application Circuit

Q2

Absolute Maximum Ratings T

Symbol Parameter FDC6329L Units

V

IN

V

ON/OFF

I

L

P

D

TJ,T
ESD Electrostatic Discharge Rating MIL-STD-883D Human Body

THERMAL CHARACTERISTICS

R

JA

θ

R

JC

θ

Input Voltage Range (Note 1) 2.5 - 8 V
On/Off Voltage Range 1.5 - 8 V
Load Current - Continuous (Note 2) 2.5 A

- Pulsed 10
Maximum Power Dissipation (Note 2) 0.7 W
Operating and Storage Temperature Range -55 to 150 °C

STG

Model (100pf/1500Ohm)

Thermal Resistance, Junction-to-Ambient (Note 2) 180 °C/W
Thermal Resistance, Junction-to-Case (Note 2) 60 °C/W

= 25°C unless otherwise noted

A

6 kV

OUT

FDC6329L Rev.C

Electrical Characteristics (T

= 25°C unless otherwise noted)

A

Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS

I

FL

Forward Leakage Current VIN = 8 V, V

= 0 V 1 µA

ON/OFF

ON CHARACTERISTICS (Note 3)

V

DROP

R

(ON)

Conduction Voltage VIN = 5 V, V

VIN = 2.5 V, V

= 3.3 V, IL = 2.8 A 0.12 0.2 V

ON/OFF

= 3.3 V, IL = 1.9 A

ON/OFF

0.14 0.2

Q2 - Static On-Resistance VGS = -5 V, ID = -2.5 A 0.047 0.07

VGS = -2.5 V, ID = -2.0 A 0.073 0.105

I

L

Notes:

1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V.

2. R
design while R

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

Load Current V

is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R

JA

θ

is determined by the user's board design.

CA

θ

= 0.2 V, VIN = 5 V, V

DROP

V

= 0.2 V, VIN = 2.5V, V

DROP

= 3.3 V 2.8 A

ON/OFF

= 3.3 V 1.9

ON/OFF

is guaranteed by

JC

θ

FDC6329L Load Switch Application

Ω

External Component Recommendation:

For applications where Co ≤ 1µF.
For slew rate control, select R2 in the range of 1k - 4.7kΩ .

For additional in-rush current control, C1 ≤ 1000pF can be added.

Select R1 so that the R1/R2 ratio ranges from 10 - 100. R1 is required to turn Q2 off.

FDC6329L Rev.C

Typical Electrical Characteristics (T

= 25 OC unless otherwise noted )

A

0.2

V = 5V

IN

V = 1.5 - 8V

ON/OFF

PW =300us, D≤ 2%

0.15

T = 125°C

J

0.1

DROP

V ,(V)

0.05

0

0 0.6 1.2 1.8 2.4 3

I , (A)

T = 25°C

J

L

Figure 1. Conduction Voltage Drop

Variation with Load Current.

0.2

0.16

0.12

(ON)

0.08

R ,(Ohm)

0.04

I = 1A

L

V = 1.5 - 8V

ON/OFF

PW =300us, D≤ 2%

T = 125°C

J

25°C

0.2

T = 125°C

0.15

0.1

DROP

V , (V)

0.05

0

0 0.6 1.2 1.8 2.4 3

J

T = 25°C

J

V = 2.5V

IN

V = 1.5 - 8V

ON/OFF

PW =300us, D≤ 2%

I , (A)

L

Figure 2. Conduction Voltage Drop

Variation with Load Current.

0

1 2 3 4 5

V , (V)

IN

Figure 3. On-Resistance Variation

with Input Voltage.

1

D = 0.5

0.5

R (t) = r(t) * R

JA

0.2

0.1

0.05

0.02

r(t), NORMALIZED EFFECTIVE

0.01

TRANSIENT THERMAL RESISTANCE

0.005

0.2

0.1

0.05

0.02

0.01

Single Pulse

θ

R = See Note 2

JA

θ

P(pk)

t

1

t

2

T - T = P * R (t)

J

A

Duty Cycle, D = t / t

JA

θ

1

0.00001 0.0001 0.001 0.01 0.1 1 10 100 300
t , TIME (sec)

1

Figure 4. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 2.
Transient thermal response will change depending on the circuit board design.

JA

θ

2

FDC6329L Rev.C