Dual N & P-Channel 2.5V Specified PowerTrenchTM MOSFET
FDC6327C
July 2000
General Description
These N & P-Channel 2.5V specified MOSFETs are
produced using Fairchild Semiconductor's advanced
PowerTrench process that has been especially tailored
to minimize on-state resistance and yet maintain low gate
charge for superior switching performance.
These devices have been designed to offer exceptional power
dissipation in a very small footprint for applications where
the bigger more expensive SO-8 and TSSOP-8 packages
are impractical.
Applications
• DC/DC converter
• Load switch
• Motor driving
D2
S1
D1
G2
SuperSOT -6
TM
S2
G1
Features
• N-Channel 2.7A, 20V . R
R
• P-Channel -1.6A, -20V .R
R
= 0.08Ω@ V
DS(on)
= 0.12Ω@ V
DS(on)
= 0.17Ω@ V
DS(on)
= 0.25Ω@ V
DS(on)
= 4.5V
GS
= 2.5V
GS
= -4.5V
GS
= -2.5V
GS
• Fast switching speed.
• Low gate charge.
• High performance trench technology for extremely
low R
• SuperSOT
than SO-8); low profile (1mm thick).
.
DS(ON)
TM
-6 package: small footprint (72% smaller
4
5
6
3
2
1
Absolute Maximum Ratings
TA = 25°C unless otherwise noted
SymbolParameterN-ChannelP-ChannelUnits
V
DSS
V
GSS
I
D
P
D
TJ, T
stg
Drain-Source Voltage20-20V
Gate-Source Voltage
Drain Current - Continuous
- Pulsed8-8
Power Dissipation
Operating and Storage Junction Temperat ure Range-55 to +150
Drain-Source Diode Characteristics and Maximum Ratings
I
S
V
SD
Notes:
1: R
θJA
R
θJC
equally.
Maximum Continuous Drain-Source Diode Forward CurrentN-Ch
P-Ch
Drain-Source Diode Forward
Voltage
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
is guaranteed by design while R
is determined by the user's board design. Both devices are assumed to be operating and sharing the dissipated heat energy
θJA
VGS = 0 V, IS = 0.8 A
VGS = 0 V, IS = - 0.8 A
(Note 2)
(Note 2)
N-Ch
P-Ch
0.76
-0.79
Max Units
1514ns
1825ns
2225ns
9
ns
9
4.5
nC
4.0
nC
nC
0.8
-0.8
1.2
-1.2
A
V
a) 130 °C/W when
mounted on a 0.125 in
pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
2: Pulse T est: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
2
b) 140 °C/W when
mounted on a 0.005 in
pad of 2 oz. copper.
2
c) 180 °C/W when
mounted on a 0.0015 in
pad of 2 oz. copper.
2
FDC6327C, Rev. E
Typical Characteristics: N-Channel
FDC6327C
10
VGS = 4.5V
3.0V
8
6
4
2
0
01234
2.5V
2.0V
, DRAIN-SOURCE VOLTAGE (V)
V
DS
1.5V
2.4
2.2
2
1.8
1.6
1.4
1.2
0.8
VGS = 2.0V
2.5V
3.0V
1
0246810
, DRAIN CURRENT (A)
I
D
3.5V
Figure 1. On-Region Characteristics.Figure 2. On-Resistance V ariation
with Drain Current and Gate V olt age.
1.6
ID = 2.7A
1.5
V
= 4.5V
GS
1.4
1.3
1.2
1.1
1
ON-RESISTANCE
0.9
, NORMALIZED DRAIN-SOURCE
0.8
DS(ON)
R
0.7
-50-25 0 255075100125150
, JUNCTION TEMPERATURE (oC)
T
J
0.25
0.2
0.15
0.1
0.05
0
12345
V
, GATE TO SOURCE VOLTAGE (V)
GS
TA = 125oC
TA = 25oC
4.5V
ID = 1.3A
Figure 3. On-Resistance V ariation
with Temperature.
10
VDS = 5V
8
6
4
2
0
01234
V
GS
TA = -55oC
, GATE TO SOURCE VOLTAGE (V)
25oC
125oC
Figure 5. Transfer Characteristics.
Figure 4. On-Resistance V ariation
with Gate-to-Source V oltage.
10
VGS = 0V
1
0.1
0.01
0.001
0.0001
TA = 125oC
00.40.81.21.6
V
SD
25oC
-55oC
, BODY DIODE FORWARD VOLTAGE (V)
Figure 6. Body Diode Forward Volt age
Variation with Source Current
and Temperature.
FDC6327C, Rev. E
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