Fairchild Semiconductor FDC6324L Datasheet

FDC6324L

Integrated Load Switch

General Description Features

These Integrated Load Switches are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage high side load switch application where low conduction loss and ease of driving are needed.

V

DROP

V

DROP

High density cell design for extremely low on-resistance. V

ON/OFF

>6KV Human Body Model. SuperSOTTM-6 package design using copper lead frame for

superior thermal and electrical capabilities.

March 1999

=0.2V @ VIN=12V, IL=1A, V =0.3V @ VIN=5V, IL=1A, V

Zener protection for ESD ruggedness.

ON/OFF

=1.5 to 8V

=1.5 to 8V.

SOT-23

SuperSOT -6

1

TM

SuperSOTTM-6

Absolute Operating Range T

SuperSOTTM-8

Vin,R1

4

ON/OFF

= 25°C unless otherwise noted

A

R1,C1

5

6

See Application Circuit

Q2

SO-8

Q1

3

2

1

Vout,C1

R2

SOT-223

EQUIVALENT CIRCUIT

IN

ON/OFF

SOIC-16

V

DROP

+

-

Symbol Parameter FDC6324L Units

V V I

L

IN

ON/OFF

Input Voltage Range 3 - 20 V ON/OFF Voltage Range 1.5 - 8 V Load Current @ V

=0.5V - Continuous (Note 1) 1.5 A

DROP

- Pulsed (Note 1 & 3) 2.5

P

D

TJ,T ESD Electrostatic Discharge Rating MIL-STD-883D Human Body

Maximum Power Dissipation (Note 2a) 0.7 W Operating and Storage Temperature Range -55 to 150 °C

STG

6 kV

Model (100pf/1500Ohm)

THERMAL CHARACTERISTICS

R

θJA

R

JC

θ

Thermal Resistance, Junction-to-Ambient (Note 2a) 180 °C/W Thermal Resistance, Junction-to-Case (Note 2) 60 °C/W

OUT

FDC6324L Rev. D

Electrical Characteristics (T

= 25°C unless otherwise noted)

A

Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS

I

FL

I

RL

Forward Leakage Current VIN = 20 V, V Reverse Leakage Current VIN = -20 V, V

= 0 V 1 µA

ON/OFF

= 0 V -1 µA

ON/OFF

ON CHARACTERISTICS (Note 3)

V

IN

V

ON/OFF

V

DROP

I

L

Notes:

1. VIN=20V, V

2. R by design while R

P

D

Typical R

Input Voltage 3 20 V On/Off Voltage 1.5 8 V Conduction Voltage Drop @ 1A VIN = 10 V, V

VIN = 5 V, V

Load Current V

=8V, V

ON/OFF

is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R

JA

θ

T

(t)

=

R

JA

θ

a. 180oC/W when mounted on a 2oz minimum copper pad.

=0.5V, TA=25oC

DROP

is determined by the user's board design.

CA

θ

−

J

θJ A

for single device operation using the board layouts shown below on FR-4 PCB in a still air environment:

−

T

A

=

(t)

R

θJ C

2

J

A

(t)

= I

×R

DS(ON)@T

D

+

(t)

R

θCA

J

= 0.2 V, VIN = 10 V, V

DROP

V

= 0.3 V, VIN = 5 V, V

DROP

= 3.3V 0.135 0.2 V

ON/OFF

= 3.3 V 0.215 0.3

ON/OFF

= 3.3 V 1 A

ON/OFF

= 3.3 V 1

ON/OFF

is guaranteed

JC

θ

2a

Scale 1 : 1 on letter size paper

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

FDC6324L Rev. D

Typical Electrical Characteristics (T

= 25 OC unless otherwise noted )

A

0.5

T = 125°C

J

0.4

T = 25°C

0.3

DROP

0.2

V , (V)

0.1

0

0 1 2 3 4

Figure 1. V

1

0.8

0.6

0.4

DROP

V (V)

0.2

0

1 2 3 4 5

DROP

I ,(A)

L

Versus IL at V

T = 125°C

J

T = 25°C

J

V (V)

IN

J

V = 12V

IN

V = 1.5 - 8V

ON/OFF

PW =300us, D≤ 2%

=12V.

IN

I = 1A

L

V = 1.5 - 8V

ON/OFF

PW =300us, D≤ 2%

0.5

T = 125°C

0.4

J

T = 25°C

J

0.3

DROP

0.2

V , (V)

V = 5V

IN

V = 1.5 - 8V

0.1

0

0 1 2 3 4

Figure 2. V

I (A)

L

Versus IL at VIN=5.0V.

DROP

0.45

0.4

)

0.35

T = 125°C

0.3

DS(ON), (Ohm

R

0.25

0.2

0.15 0 1 2 3 4 5

J

T = 25°C

J

I , (A)

L

ON/OFF

PW =300us, D≤ 2%

I = 1A

L

V = 5V

IN

PW =300us, D≤ 2%

Figure 3. V

1

0.8

0.6

0.4

(ON)

R ,(Ohm)

0.2

0

1 2 3 4 5

Versus V

DROP

T = 25°C

at IL=1A.

IN

I = 1A

L

V = 1.5 - 8V

ON/OFF

PW =300us, D≤ 2%

T = 125°C

J

V , (V)

IN

Figure 5. On Resistance Variation with

Input Voltage.

Figure 4. R

Versus IL at V

(ON)

=5.0V.

IN

FDC6324L Rev.D