Fairchild Semiconductor FDB045AN08A0 Datasheet

FDB045AN08A0
N-Channel UltraFET® Trench MOSFET 75V, 80A, 4.5m
FDB045AN08A0
April 2002
Features
•r
•Q
• Low Miller Charge
• Low Qrr Body Diode
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
Formerly developmental type 82684
MOSFET Maximum Ratings T
= 3.9mΩ (Typ.), V
DS(ON)
(tot) = 92nC (Typ.), V
g
GA TE
SOURCE
= 10V, ID = 80A
GS
= 10V
GS
TO-263AB
FDB SERIES
DRAIN
(FLANGE)
= 25°C unless otherwise noted
C
Applications
• 42V Automotiv e Load Control
• Starter / Alternator Systems
• Electronic Power Steering Systems
• Electronic Valve Train Systems
• DC-DC converter s and Off-line UPS
• Distributed P ower Arc hitectures and VRMs
• Primary Switch for 24V and 48V systems
D
G
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Sou r c e Voltage 75 V Gate to Source Voltage ±20 V Drain Curr e nt
I
D
Continuous (T Continuous (T
< 145oC, VGS = 10V)
C
= 25oC, VGS = 10V, with R
amb
= 43oC/W) 19 A
θJA
80 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 600 mJ Power dissipation 310 W Derate above 25
o
C2.0W/
Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
This product ha s been des igned to me et the e xtr eme test c ondit ions and envir onment deman ded by the automot ive indus t ry. For a
All Fairchild Semiconductor prod ucts are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
©2002 Fairchild Semiconductor Corporation
Thermal Resistance Junction to Case TO-263 0.48 Thermal Resistance Junction t o Ambient TO-263 (No te 2) 62 Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea 43
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
certification.
FDB045AN08A0 Rev. A
o
C/W
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB045 AN08A0 FDB045AN08A0 TO-263AB 330mm 24mm 800 uni ts
FDB045AN08A0
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Con ditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltage ID = 250µA, VGS = 0V 75 - - V
V
= 60V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- -250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
I
= 80A, VGS = 10V - 0.0039 0.0045
D
I
= 37A, VGS = 6V - 0.005 6 0.0084
Drain to S ou r c e On Re si st ance
D
I
= 80A, VGS = 10V,
D
T
= 175oC
J
- 0.008 0.011
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 1000 - pF Reverse Transfer Capacitance - 240 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 11 17 nC Gate to Source Gate Charg e - 2 7 - nC Gate Charge Threshold to Plateau - 16 - nC
V
DD
I
= 80A
D
I
= 1.0m A
g
= 40V
Gate to Drain “Miller” Charge - 21 - nC
- 6600 - pF
92 138 nC
µA
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 18 - ns Rise Time - 88 - ns Turn-Off Delay Time - 40 - ns Fall Time - 45 - ns Turn-Off Time - - 128 ns
(VGS = 10V)
= 40V, ID = 80A
V
DD
V
= 10V, RGS = 3.3
GS
--160ns
Drain-Source Diode Characteristics
I
= 80A - - 1.25 V
V
SD
t
rr
Q
RR
Notes: 1: Starting T 2: Pulse Width = 100s
©2002 Fairchild Semiconductor Corporation FDB045AN08A0 Rev. A
Source to Drain Diode V oltage Reverse Recovery Time ISD = 75A, dISD/dt = 100A/µs- -53ns
Reverse Recovered Charge ISD = 75A, dISD/dt = 100A/µs- -54nC
= 25°C, L = 0.48mH, IAS = 50A.
J
SD
= 40A - - 1.0 V
I
SD
FDB045AN08A0
Typical Characteristics T
= 25°C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
10
200
160
120
80
, DRAIN CURRENT (A)
D
I
40
150
0
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
t, RECTANGULAR PULSE DURATION (s)
-2
10
CURRENT LIMITED BY PACKAGE
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES: DUTY FACTOR: D = t PEAK TJ = PDM x Z
-1
10
θJC
10
1/t2
0
x R
θJC
t
+ T
1
t
2
C
1
10
Figure 3. Normalized Maximum Transient Thermal Impedance
2000
1000
VGS = 10V
, PEAK CURRENT (A)
DM
I
100
50
10
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-5
-4
10
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2002 Fairchild Semiconductor Corporation FDB045AN08A0 Rev. A
FDB045AN08A0
Typical Characteristics T
2000
1000
100
10
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
, DRAIN CURRENT (A)
D
I
1
SINGLE PULSE
TJ = MAX RATED T
= 25oC
C
0.1
0.1 1 10 100
DS(ON)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
= 25°C unless otherwise noted
C
10µs
100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
150
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX V
= 15V
DD
120
90
TJ = 175oC
60
, DRAIN CURRENT (A) I
TJ = 25oC
D
30
0
4.0 4.5 5.0 5.5 6.0 VGS, GATE TO SOURCE VOLTAGE (V)
TJ = -55oC
500
If R = 0 tAV = (L)(IAS)/(1.3*RATED BV
If R ≠ 0 t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
100
10
, AVALANCHE CURRENT (A)
AS
STARTING TJ = 150oC
I
1
.01 0.1 1 10 100
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
150
VGS = 10V VGS = 7V
120
VGS = 6V
90
60
, DRAIN CURRENT (A)
D
I
30
0
0 0.5 1.0 1.5
VDS, DRAIN TO SOURCE VOLTAGE (V)
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
VGS = 5V
TC = 25oC
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
7
VGS = 6V
6
5
VGS = 10V
4
DRAIN TO SOURCE ON RESISTANCE(mΩ)
3
0 20406080
I
, DRAIN CURRENT (A)
D
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
©2002 Fairchild Semiconductor Corporation FDB045AN08A0 Rev. A
2.5
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200 TJ, JUNCTION TEMPERATURE (oC)
VGS = 10V, ID =80A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
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