© 1999 Fairchild Semiconductor Corporation DS012016 www.fairchildsemi.com
September 1999
Revised October 1999
74LVT374 • 74LVTH374 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
74LVT374 • 74LVTH374
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT374 and LVTH374 are high-speed, low-power
octal D-type flip-flop s featuring separat e D-type inputs f or
each flip-flop and 3- STATE outputs for bus-o riented applications. A buffered Clock (CP) and Output Enable (OE
) are
common to all flip-flops.
The LVTH374 data inputs include bush old, eliminati ng the
need for external pull-up resistors to hold unused inputs.
These octal flip-flops are designed for low-voltage (3.3V )
V
CC
applications, but with the capability to provide a TTL
interface to a 5V environme nt. The LVT374 and LVTH374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining low power dissipation.
Features
■ Input and output interface capability to systems at
5V V
CC
■ Bus-Hold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH374),
also available without bushold feature (74LVT374).
■ Live insertion/extraction per mitt ed
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink −32 mA/+64 mA
■ Functionally compatible with the 74 series 374
■ Latch-up performance exceeds 500 mA
Ordering Code:
Device also available in Tape and Reel. Specify by appending s uffix let te r “X” to the ordering code.
Logic Symbols
IEEE/IEC
Order Number Package Number Package Description
74LVT374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
74LVT374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide
74LVTH374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide