Fairchild Semiconductor 74LCX16501MTDX, 74LCX16501MTD, 74LCX16501MEAX, 74LCX16501MEA, 74LCX16501CW Datasheet

October 1995
Revised April 1999

74LCX16501 18-Bit Universal Bus Transceivers with 5V Tolerant Inputs and Outputs

© 1999 Fairchild Semiconductor Corporation DS012550.prf www.fairchildsemi.com

74LCX16501
18-Bit Universal Bus Transceivers with 5V Tolerant

Inputs and Outputs

General Description

The LCX16501 is an 18-bit un iversal bus tra nsceiver com­bining D-type latches and D-type flip-flops to allow data
flow in transparent, latched, and clocked modes.

Data flow in each dir ection is controlled by o utput-enable
(OEAB and OEBA

), latch-enable (LEAB and LEBA), and

clock (CLKAB and CLKBA) inputs.
The LCX16501 is desi gned for low vol tage (2.5V or 3.3V )

V

CC

applications with capability of interfacing to a 5V signal
environment.
The LCX16501 is fabricated with an advanced CMOS tech-

nology to achieve high spee d operation while mai ntaining
CMOS low power.

Features

■ 5V tolerant inputs and outputs

■ 2.3V–3.6V V

CC

specifications provided

■ 6.0 ns t

PD

max (VCC = 3.3V), 20 µA ICC max

■ Power down high impedance inputs and outputs

■ Supports live insertion/withdrawal (Note 1)

■ ±24 mA Output Drive (V

CC

= 3.0V)

■ Implements patented noise/EMI reduction circuitry

■ Latch-up performance exceeds 500 mA

■ ESD performance:

Human body model > 2000V
Machine model < 200V

Note 1: To ensure the high-impedan c e state during power up or down, OE
should be tied to VCC and OE tied to GND through a resistor: the minimum

value or the resis tor i s dete rmin ed by the cur ren t-sour cing cap ab ility of the
driver.

Ordering Code:

Devices also availab le on Tape and Reel. Specify by appendin g t he s uffix letter “X” to the orderin g c ode.

Order Number Package Number Package Description

74LCX16501MEA MS56A 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
74LCX16501MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

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74LCX16501

Connection Diagram Tr uth Table (Note 2)

Note 2: A-to-B data flow is shown: B-to-A flow is si milar but uses OE BA,

LEBA, and CLKBA.
Note 3: Output level before the indicated steady-state inp ut conditions

were established, provided that CLKAB was HIGH before LEAB went LOW.
Note 4: Output level before the indicated steady-state inp ut conditions

were established.

Functional Description

For A-to-B data flow, the LCX16501 operates in the tran s­parent mode when L EAB is HIGH. When LEAB is LOW,
the A data is latched if CLKAB is held at a high or low logic
level. If LEAB is LOW, the A bus data is stored in the latch/
flip-flop on the LOW-to-HIGH transition of CLKAB. When

OEAB is HIGH, the outputs are active. When OEAB is
LOW, the outputs are in the high impedance state.

Data flow for B to A is similar to th at of A to B but uses
OEBA

, LEBA, and CLKBA. The output ena bles are com-

plementary (OEAB is active HIGH and OEBA

is active

LOW).

Logic Diagram

Inputs Output

OEAB LEAB CLKAB

A

n

B

n

LXXX Z
HHXL L
HHXH H
HL↑ LL
HL↑ HH
HLHXB

0

(Note 3)

HLLXB

0

(Note 4)

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74LCX16501

Absolute Maximum Ratings(Note 5)

Recommended Operating Conditions (Note 7)

Note 5: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated

at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom­mended Operating C onditions” table will def ine the conditions for act ual device operation.

Note 6: I

O

Absolute Maximum Rating must be observed.

Note 7: Unused (inputs or I/Os) must be held HIGH or LOW. They may not float.

DC Electrical Characteristics

Symbol Parameter Value Conditions Units

V

CC

Supply Voltage −0.5 to +7.0 V

V

I

DC Input Voltage −0.5 to +7.0 V

V

O

DC Output Voltage −0.5 to +7.0 Output in 3-STATE

V

−0.5 to V

CC

+ 0.5 Output in HIGH or LOW State (Note 6)

I

IK

DC Input Diode Current −50 VI < GND mA

I

OK

DC Output Diode Current −50 VO < GND

mA

+50 V

O

> V

CC

I

O

DC Output Source/Sink Current ±50 mA

I

CC

DC Supply Current per Supply Pin ±100 mA

I

GND

DC Ground Current per Ground Pin ±100 mA

T

STG

Storage Temperature −65 to +150 °C

Symbol Parameter Min Max Units

V

CC

Supply Voltage Operating 2.0 3.6

V

Data Retention 1.5 3.6

V

I

Input Voltage 0 5.5 V

V

O

Output Voltage HIGH or LOW State 0 V

CC

V

3-STATE 0 5.5

I

OH/IOL

Output Current VCC = 3.0V − 3.6V ±24

mAV

CC

= 2.7V − 3.0V ±12

V

CC

= 2.3V − 2.7V ±8

T

A

Free-Air Operating Temperature −40 85 °C

∆t/∆V Input Edge Rate, V

IN

= 0.8V–2.0V, VCC = 3.0V 0 10 ns/V

Symbol Parameter Conditions

V

CC

TA = −40°C to +85°C

Units

(V) Min Max

V

IH

HIGH Level Input Voltage 2.3 − 2.7 1.7

V

2.7 − 3.6 2.0

V

IL

LOW Level Input Voltage 2.3 − 2.7 0.7

V

2.7 − 3.6 0.8

V

OH

HIGH Level Output Voltage IOH = −100 µA2.3 − 3.6 VCC − 0.2

V

IOH = −8 mA 2.3 1.8
IOH = −12 mA 2.7 2.2
IOH = −18 mA 3.0 2.4
IOH = −24 mA 3.0 2.2

V

OL

LOW Level Output Voltage IOL = 100 µA2.3 − 3.6 0.2

V

IOL = 8 mA 2.3 0.6
IOL = 12 mA 2.7 0.4
IOL = 16 mA 3.0 0.4
IOL = 24 mA 3.0 0.55

I

I

Input Leakage Current 0 ≤ VI ≤ 5.5V 2.3 − 3.6 ±5.0 µA

I

OZ

3-STATE I/O Leakage 0 ≤ VO ≤ 5.5V 2.3 − 3.6 ±5.0

µA

VI = VIH or V

IL

I

OFF

Power-Off Leakage Current VI or VO = 5.5V 0 10 µA