Fairchild Semiconductor 74F374MSA, 74F374CW, 74F374SJX, 74F374SJ, 74F374SCX Datasheet

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© 1999 Fairchild Semiconductor Corporation DS009524 www.fairchildsemi.com
May 1988 Revised August 1999
74F374 Octal D-Type Flip-Flop with 3-STATE Outputs
74F374 Octal D-Type Flip-Flop with 3-STATE Outputs
General Description
The 74F374 is a high-speed, low-power octal D-type flip­flop featuring separate D-type inputs for each flip- flop and 3-STATE outputs for bus-oriented applications. A buffered Clock (CP) and Output Enable (OE
) are common to all flip-
flops.
Features
Edge-triggered D-type inputs
Buffered positive edge-triggered clock
3-STATE outputs for bus-oriented applications
Guarante ed 4000V minimum ESD protection
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
Logic Symbols
IEEE/IEC
Connection Diagram
Order Number Package Number Package Description
74F374SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F374MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74F374PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
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74F374
Unit Loading/Fan Out
Functional Description
The 74F374 con sists of eig ht edge- triggered flip-flops with individual D-type inputs and 3-STATE true outputs. The buffered clock and buffered Outp ut Enable are com mon to all flip-flops. The eight flip-flops will store th e state of their individual D inputs that meet the setup and hold time requirements on the LOW-to-HIGH Clock (CP) transition. With the Output Enable (OE
) LOW, the contents of the
eight flip-flops are available at the outputs. When the OE
is HIGH, the outputs go to th e high impeda nce state. Op era­tion of the OE
input does not affected the sta te of the flip-
flops.
Tr uth Table
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
= LOW-to-HIGH Clock Transition
Logic Diagram
Please note that this diagram is provided o nly f or t he understanding of lo gic operations and should not be used to estimate propagation delays.
Pin Names Description
U.L.
Input I
IH/IIL
HIGH/LOW
Output I
OH/IOL
D0–D
7
Data Inputs 1.0/1.0 20 µA/−0.6 mA CP Clock Pulse Input (Active Rising Edge) 1.0/1.0 20 µA/−0.6 mA OE
3-STATE Output Enable Input (Active LOW) 1.0/1.0 20 µA/−0.6 mA O
0–O7
3-STATE Outputs 150/40 (33.3) 3 mA/24 mA (20 mA)
Inputs Internal Output
D
n
CP OE
Register
O
n
H
LH H
L
LL L
XXH X Z
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74F374
Absolute Maximum Ratings(Note 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyon d which the device
may be damaged or have its useful life impaired . Functional operation under these condit ions is not implied.
Note 2: Either voltage limit or curren t limit is sufficient to protect in puts.
DC Electrical Characteristics
Storage Temperature 65°C to +150°C Ambient Temperature under Bias 55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin 0.5 V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Output
in HIGH State (with V
CC
= 0V)
Standard Output 0.5V to V
CC
3-STATE Output 0.5V to +5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
ESD Last Passing Voltage (Min) 4000V
Free Air Ambi ent Temperature 0°C to +70°C Supply Voltage +4.5V to +5.5V
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized as a HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min IIN = 18 mA
V
OH
Output HIGH 10% V
CC
2.5
VMin
IOH = 1 mA
Voltage 10% V
CC
2.4 IOH = 3 mA
5% V
CC
2.7 IOH = 1 mA
5% V
CC
2.7 IOH = 3 mA
V
OL
Output LOW 10% V
CC
0.5 V Min IOL = 24 mA
Voltage
I
IH
Input HIGH
5.0 µAMaxVIN = 2.7V
Current
I
BVI
Input HIGH Current
7.0 µAMaxVIN = 7.0V
Breakdown Test
I
CEX
Output HIGH
50 µAMaxV
OUT
= V
CC
Leakage Current
V
ID
Input Leakage
4.75 V 0.0
IID = 1.9 µA
Test All Other Pins Grounded
I
OD
Output Leakage
3.75 µA0.0
V
IOD
= 150 mV
Circuit Current All Other Pins Grounded
I
IL
Input LOW Current −0.6 mA Max VIN = 0.5V
I
OZH
Output Leakage Current 50 µAMaxV
OUT
= 2.7V
I
OZL
Output Leakage Current −50 µAMaxV
OUT
= 0.5V
I
OS
Output Short-Circuit Current 60 150 mA Max V
OUT
= 0V
I
ZZ
Bus Drainage Test 500 µA0.0VV
OUT
= 5.25V
I
CCZ
Power Supply Current 55 86 mA Max VO = HIGH Z
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