Fairchild Surface service manual

Surface Mount Tape and Reel Specification

General Description

Tape-and-Reel is a method for shipment of surface mount
devices. This approach simplifies the handling of semicon­ductors for automated circuit board assembly systems. A
Tape-and-Reel holds hundreds-to-thousands of surface
mount devices(as compared with less than 100 devices in a
rail), so that pick-and-place machines have to be reloaded
less frequently. This savings in labor will further reduce
manufacturing costs for automated circuit board assembly.

Features

Conductive PVC material reduces static charge buildup

•

Fully meets proposed EIA standard RS-481A (taping of

•

surface-mounted components for automatic placing)

Tape-and-Reel Diagram

April 1998

Fully compatible with Fairchild’s surface mount package

•

types
Variable code density code 39 bar code label for Auto-

•

mated Inventory Management availability
Mechanical samples of surface mount packages avail-

•

able in Tape-and-Reel for automated assembly process
development

Single Tape-and-Reel holds hundreds-to-thousands of

•

surface mount semiconductors for additional labor sav­ings

Conductive cover Tape-and-Reel availability

•

Reels individually packed

•

Surface Mount Tape and Reel Specification

MS500145-1

© 1998 Fairchild Semiconductor Corporation MS500145 www.fairchildsemi.com

Tape-and-Reel Overview

TAPE FORMAT AND DEVICE ORIENTATION

MS500145-2

Small Outline IC (SO-IC) SO-8 (Narrow) 4 Plastic Chip Carrier IC (PLCC-IC) PLCC-20 11

SO-14 (Narrow) 5 PLCC-28 12
SO-14 (Wide) 6
SO-16 (Narrow) 7
SO- 16 (Wide) 8
SO-20 (Wide) 9
SO-24 (Wide) 10

MATERIALS

Cavity Tape: Conductive PVC (less than 10
Cover Tape: Polyester 2. Conductive Fibregboard available

1. Conductive Cover available 3. Conductive Plastic (PVC) available

Page Page

5

Ω/Sq) Reel: 1. Solid 80 pt. Fibreboard (standard)

LABEL

Human and machine readable label is provided on reel. A
variable (C.P.I.)densitycode 39 is available. FSC STD Label
(7.6 C.P.I.).

Field

Lot Number
Date Code
Revision Level

MS500145-3

Fairchild Part No. I.D.
Quantity
Fields are separated by at least one blank space.
Future Tape-and-Reel packs will also include a smaller-size

bar code label (high-density code 39) at the beginning of the
tape. (This tape label is not available on current production.)

Fairchild Semiconductor will also offer additional labels con­taining information per your specific specification.

www.fairchildsemi.com 2

SO-8 (Narrow)

TAPE FORMAT

Direction (Start End) 5 (min) Empty Sealed

Tape Section # Cavities Cavity Status Cover Tape Status

Leader 5 (min) Empty Unsealed

of

Feed Trailer 2 (min) Empty Sealed

Carrier 2500 Filled Sealed

↑

(Hub End) 2 (min) Empty Unsealed

TAPE DIMENSIONS

REEL DIMENSIONS

3 www.fairchildsemi.com

MS500145-6

MS500145-7

SO-14 (Narrow)

TAPE FORMAT

Direction (Start End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Tape Section # Cavities Cavity Status Cover Tape Status

Leader 5 (min) Empty Unsealed

Carrier 2500 Filled Sealed

↑

(Hub End) 2 (min) Empty Unsealed

TAPE DIMENSIONS

REEL DIMENSIONS

www.fairchildsemi.com 4

MS500145-8

MS500145-9

SO-14 (Wide)

TAPE FORMAT

Tape Section # Cavities Cavity Status Cover Tape Status

Direction (Start End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Leader 5 (min) Empty Unsealed

Carrier 2500 Filled Sealed

↑

(Hub End) 2 (min) Empty Unsealed

TAPE DIMENSIONS

REEL DIMENSIONS

5 www.fairchildsemi.com

MS500145-10

MS500145-11

SO-16 (Narrow)

TAPE FORMAT

Direction (Start End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Tape Section # Cavities Cavity Status Cover Tape Status

Leader 5 (min) Empty Unsealed

Carrier 2500 Filled Sealed

↑

(Hub End) 2 (min) Empty Unsealed

TAPE DIMENSIONS

REEL DIMENSIONS

www.fairchildsemi.com 6

MS500145-12

MS500145-13

SO-16 (Wide)

TAPE FORMAT

Tape Section # Cavities Cavity Status Cover Tape Status

Direction (Start End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Leader 5 (min) Empty Unsealed

Carrier 1000 Filled Sealed

↑

(Hub End) 2 (min) Empty Unsealed

TAPE DIMENSIONS

REEL DIMENSIONS

7 www.fairchildsemi.com

MS500145-14

MS500145-15

SO-20 (Wide)

TAPE FORMAT

Tape Section # Cavities Cavity Status Cover Tape Status

Direction (Start End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Leader 5 (min) Empty Unsealed

Carrier 1000 Filled Sealed

↑

(Hub End) 2 (min) Empty Unsealed

TAPE DIMENSIONS

REEL DIMENSIONS

www.fairchildsemi.com 8

MS500145-16

MS500145-17

SO-24 (Wide)

TAPE FORMAT

Tape Section # Cavities Cavity Status Cover Tape Status

Direction (Starter End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Leader 5 (min) Empty Unsealed

Carrier 1000 Filled Sealed

↑

(Hub End) 2 (min) Empty Sealed

TAPE DIMENSIONS

REEL DIMENSIONS

9 www.fairchildsemi.com

MS500145-18

MS500145-19

PLCC-20

TAPE FORMAT

Tape Section # Cavities Cavity Status Cover Tape Status

Direction (Starter End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Leader 5 (min) Empty Unsealed

Carrier 1000 Filled Sealed

↑

(Hub End) 2 (min) Empty Sealed

TAPE DIMENSIONS

REEL DIMENSIONS

www.fairchildsemi.com 10

MS500145-20

MS500145-21

PLCC-28

TAPE FORMAT

Tape Section # Cavities Cavity Status Cover Tape Status

Direction (Starter End) 5 (min) Empty Sealed
of
Feed Trailer 2 (min) Empty Sealed

Leader 5 (min) Empty Unsealed

Carrier 750 Filled Sealed

↑

(Hub End) 2 (min) Empty Sealed

TAPE DIMENSIONS

REEL DIMENSIONS

MS500145-23

11 www.fairchildsemi.com

MS500145-22

Application-Total System Saving

Cost pressures today are forcing many electronics manufac­turers to automate their production lines. Surface mount
technology plays a key role in this cost-savings trend be­cause:

The mounting of devices on the PC board surface elimi-

•

nates the expense of drilling holes;
The use of pick-and-place machines to assemble the PC

•

boards greatly reduces labor costs;
The lighter and more compact assembled products re-

•

sulting from the smaller dimensions of surface mount
packages mean lower material costs.

Production processes now permit both surface mount and
insertion mount components to be assembled on the same
PC board.

MS500145-32

Automated manufacturers can improve their cost savings by
using Tape-and-Reel for surface mount devices. Simplified
handling results because hundreds-to-thousands of semi­conductors are carried on a single Tape-and-Reel pack (see
the “Ordering Information” section for the exact quantities).
With this higher device count per reel (when compared with
less than 100 devices per rail), pick-and-place machines
have to be re-loaded less frequently and lower labor costs
result.

With Tape-and-Reel, manufacturers save twice — once from
using surface mount technology for automated PC board as­sembly and again form less device handling during shipment
and machine set-up.

www.fairchildsemi.com 12

Ordering Information

When you order a surface mount semiconductor, it will be in
one of the available surface mount package types (see Ap­pendix II for the physical dimensions of the surface mount

packages). Specifying the Tape-and -Reel method of ship­ment ((Note 1)) means that you will receive your devices in
the following quantities per Tape-and-Reel pack:

Small Outline IC SO-8 (Narrow) 2500

Plastic Chip Carrier IC PLCC-20 1000

Note 1: For surface mount integrated circuits, your order will automatically be shipped in conductive rails unless you indicate “Tape-and-Reel” after the device de-

scription on your purchase order.

SO-14 (Narrow) 2500
SO-14 (Wide) 1000
SO-16 (Narrow) 2500
SO-16 (Wide) 1000
SO-20 (Wide) 1000
SO-24 (Wide) 1000

PLCC-28 750

Device Quantity

Example: You order 5,000 74AC14SC ICs shipped in
Tape-and-Reel.

All 5,000 devices have the same date code

•

You receive 2 SO-14 (Narrow) Tape-and-Reel packs,

•

each having 2500 74AC14SC ICs

13 www.fairchildsemi.com

Appendix I—Short-Form Procurement Specification

TAPE FORMAT

Trailer (Hub End) Carrier Leader (Start End)

Empty Cavities, Empty Cavities, Filled Cavities Empty Cavities, Empty Cavities,

min min min min

(Unsealed (Sealed (Sealed (Sealed (Unsealed

Cover Tape) Cover Tape) Cover Tape) Cover Tape) Cover Tape)

SMALL OUTLINE IC

SO-8 (Narrow) 2 2 2500 5 5
SO-14 (Narrow) 2 2 2500 5 5
SO-14 (Wide) 2 2 1000 5 5
SO-16 (Narrow) 2 2 2500 5 5
SO-16 (Wide) 2 2 1000 5 5
SO-20 (Wide) 2 2 1000 5 5
SO-24 (Wide) 2 2 1000 5 5

PLASTIC SHIP CARRIER IC

PLCC-20 2 2 1000 5 5
PLCC-28 2 2 750 5 5

→

Direction of Feed

www.fairchildsemi.com 14

Appendix I—Short-Form Procurement Specification (Continued)

TAPE DIMENSIONS (24 Millimeter Tape or Less)

MS500145-33

WPFEP

2

P

0

DTA

SMALL OUTLINE IC

±

SO-8
(Narrow)

SO-14
(Narrow)

SO-14
(Wide)

SO-16
(Narrow)

SO-16
(Wide)

SO-20
(Wide)

SO-24
(Wide)

.30 8.0±.10 5.5±.05 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 6.4±.10 5.2±.10 2.1±.10 1.55±.05 30

12

±

.30 8.0±.10 7.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 6.5±.10 9.0±.10 2.1±.10 1.5±.05 40

16

±

.30 12.0±.10 7.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 10.9±.10 9.5±.10 3.0±.10 1.55±.05 40

16

±

.30 8.0±.10 7.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 6.5±.10 10.3±.10 2.1±.10 1.55±.05 40

16

±

.30 12.0±.10 5.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 10.9±.10 10.76±.10 3.0±.10 1.55±.05 40

16

±

.30 12.0±.10 11.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 10.9±.10 13.3±.10 3.0±.10 2.05±.05 50

24

±

.30 12.0±.10 11.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 10.9±.10 15.85±.10 3.0±.10 2.05±.05 50

24

PLASTIC CHIP CARRIER IC

±

PLCC-20 16
PLCC-28 24

Note A: A0,B0and K0dimensions are measured 0.3 mm above the inside wall of the cavity bottom.
Note B: Tape with components shall pass around a mandril radius R without damage.
Note C: Cavity tape material shall be PVC conductive (less than 10
Note D: Cover tape material shall be polyester (30–65 grams peel-back force).
Note E: D
Note F: All dimensions are in millimeters.

.30 12.0±.10 7.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 9.3±.10 9.3±.10 4.9±.10 1.55±.05 40

±

.30 16.0±.10 11.5±.10 1.75±.10 2.0±.05 4.0±.10 1.55±.05 .30±.10 13.0±.10 13.0±.10 4.9±.10 2.05±.05 50

5

Ω/Sq).

Dimension is centered within cavity.

1

0

B

0

K

0

D

1

R

15 www.fairchildsemi.com

Appendix I—Short-Form Procurement Specification (Continued)

REEL DIMENSIONS

MS500145-35

12 mm Tape SO-8 (Narrow)

16 mm Tape SO-14

24 mm Tape SO-20 (Wide)

(Narrow)
SO-14 (Wide)
SO-16

(Narrow)
SO-16 (Wide)
PLCC-20

SO-24 (Wide)
PLCC-28

A (Max) B (Min) C D (Min) N (Min) G T (Max)

±

(13.00) 0.059 0.512

(330) 1.5 13

(13.00) 0.059 0.512

(330) 1.5 13

(13.00) 0.059 0.512

(330) 1.5 13

Units:

0.002 0.795 1.969 0.488

±

0.05 20.2 50 12.4

±

0.002 0.795 1.969 0.646

±

0.05 20.2 50 16.4

±

0.002 0.795 1.969 0.960

±

0.05 20.2 50 24.4

Inches

Millimeters

+0.045

−0.000
+2

−0

+0.078

−0.000

+2

−0

+0.078

−0.000
+2

−0

0.724

18.4

0.882

22.4

1.197

30.4

Material: Paperboard (Non-Flaking)

www.fairchildsemi.com 16

Appendix II—Physical Dimensions of Surface Mount Packages

SO-14 (Wide)

SO-16 (Narrow)

17 www.fairchildsemi.com

Appendix II—Physical Dimensions
of Surface Mount Packages

SO-16 (Wide)

(Continued)

SO-20 (Wide)

www.fairchildsemi.com 18

Appendix II—Physical Dimensions
of Surface Mount Packages

SO-24 (Wide)

PLCC-20

(Continued)

19 www.fairchildsemi.com

Appendix II—Physical Dimensions
of Surface Mount Packages

PLCC-28

Surface Mount Tape and Reel Specification

(Continued)

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and (c)
whose failure to perform when properly used in
accordance with instructions for use provided in the

2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.

labeling, can be reasonably expected to result in a
significant injury to the user.

Fairchild Semiconductor
Corporation
Americas

Customer Response Center
Tel: [phone]
Fax: [phone]

www.fairchildsemi.com

Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

Fairchild Semiconductor
Europe

Fax: [phone]

Email: [e-mail]
Deutsch Tel: [phone]
English Tel: [phone]
Italy Tel: [phone]

Fairchild Semiconductor
Hong Kong Ltd.

8/F Room 808 Empire Centre
68 Mody Road, Tsimshatsui East
Kowloon, Hong Kong
Tel: [phone]
Fax: [phone]

Fairchild Semiconductor
Japan Ltd.

4F, Natsume BI,
2-18-6 Yushima, Bunkyo-ku,
Tokyo 113-0034, Japan
Tel: [phone]
Fax: [phone]