This device is designed for use as general purpose amplifiers
and switches requiring collector currents to 300 mA. Sourced
from Process 68. See PN200 for characteristics.
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
SymbolParameterValueUnits
V
CEO
V
CBO
V
EBO
I
C
TJ, T
stg
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics TA = 25°C unless otherwise noted
Collector-Emitter Voltage60V
Collector-Base Voltage60V
Emitter-Base Voltage5.0V
Collector Current - Continuous500mA
Operating and Storage Junction Temperature Range-55 to +150
°C
SymbolCharacteristi cMaxUnits
PN4250A
P
D
R
θ
JC
R
θ
JA
1997 Fairchild Semiconductor Corporation
Total Device Dissipation
Derate above 25°C
Thermal Resistance, Junction to Case83.3°
Thermal Resistance, Junction to Ambient200
625
5.0
mW
mW/°C
C/W
°C/W
Page 2
PNP General Purpose Amplifier
(continued)
Electrical Characteristics TA = 25°C unless otherwise noted
IC = 5.0 mA, IB = 060V
Voltage*
Co llecto r-E mit te r Bre a k d o wn
Voltage*
Collector-Base Breakdown Voltage
Emitter-Base Breakdown Voltage
I
= 10 µA, IB = 0
C
= 10 µA, IE = 0
I
C
= 10 µA, IC = 0
I
E
60V
60V
5.0V
Co llecto r-C utoff Curr e ntVCB = 50 V, IE = 010nA
Emitte r-C u toff Curren tVEB = 3.0 V, IC = 020nA
DC Current Gain
Collector-Emitter Sat uration VoltageIC = 10 mA , IB = 0. 5 mA0.25V
)
VCE = 5.0 V, IC = 100 µA
250700
Output CapacitanceVCB = 5.0 V, f = 1.0 MHz6.0pF
Small-signal Current Gai nVCE = 5.0 V, IC = 1. 0 m A,250800
Input Impedancef = 1.0 kHz6.020
Output Adm ittance5.050
Voltage F eedback Ratio10
= 5.0 V, IC = 250 µA,
V
CE
RS = 1. 0 kΩ, f = 1.0 kHz,
B
= 150 Hz
W
V
= 5.0 V, IC = 20 µA,
CE
RS = 10 kΩ , f = 1.0 kHz,
B
= 150 Hz
W
2.0
2.0
kΩ
µmhos
x10
dB
dB
PN4250A
-4
Page 3
TO-92 Tape and Reel Data
TO-92 Packaging
Configuration: Figure 1.0
FSCINT Label sample
FAIRCHILD SEMICONDUCTOR CORPORATION
LOT:
CBVK741B019
NSID:
PN2222N
D/C1:
SPEC REV:
D9842
QA REV:
HTB:B
QTY:
10000
SPEC:
B2
(FSCINT)
F63TNR Label sample
LOT: CBVK741B019
FSID: PN222N
D/C1: D9842 QTY1: SPEC REV:
D/C2: QTY2: CPN:
QTY: 2000
SPEC:
N/F: F (F63TNR)3
TO-92 TNR/AMMO PACKING INFROMATION
PackingStyleQuantityE OL code
ReelA2,000D26Z
AmmoM2,000D74Z
Unit w eight = 0.22 gm
Reel weight with components = 1.04 kg
Amm o weight with components = 1.02 kg
Max q uantity per in te rme d iate box = 10,000 units
TO-92 Radial Ammo Packaging
Configuration: Figure 3.0
FIRST WIRE OFF IS COLLECTOR
ADHESIVE TAPE IS ON THE TOP SIDE
FLAT OF TRANSISTOR IS ON TOP
ORDER STYLE
D74Z (M)
Machine Option “E” (J)
Style “E”, D27 Z, D71 Z (s/ h)
FIRST WIRE OFF IS EMITTER
ADHESIVE TAPE IS ON THE TOP SIDE
FLAT OF TRANSISTOR IS ON BOTTOM
ORDER STYLE
D75Z (P)
FIRST WIRE OFF IS EMITTER (ON PKG. 92)
ADHESIVE TAPE IS ON BOTTOM SIDE
FLAT OF TRANSISTOR IS ON BOTTOM
FIRST WIRE OFF IS COLLECTOR (ON PKG. 92)
ADHESIVE TAPE IS ON BOTTOM SIDE
FLAT OF TRANSISTOR IS ON TOP
September 1999, Rev. B
Page 5
TO-92 Tape and Reel Data, continued
TO-92 Tape and Reel Taping
Dimension Configuration: Figure 4.0
PPd
Ha
H1
HO
P1 F1
User Direc tion of Feed
TO-92 Reel
Configuration: Figure 5.0
Hd
b
d
L1
P2
PO
DO
S
L
W1
WO
ITEM DESCRIPTION
Base of Package to Lead Bend
Compon en t He ig ht
Lead Clinch Height
Compon en t Ba s e Heig ht
Compon en t Al ig nm e nt ( sid e/s id e )
Compon en t Al ig nm e nt ( fron t /b ac k )
Compon en t Pi tc h
Feed Hole Pitch
Hole Center to First Lead
Hole Center to Component Center
Lead Spread
Lead Thickness
Cut Lead Length
Taped Lead Length
Taped Lead Thickness
Carrier Tape Thickness
Carrier Tape Width
Hold - down Tape Width
Hold - down Tape position
Feed Hole Position
Sprocket Hole Diameter
Lead Spring Out
t
W2
W
t1
SYMBOL
b
Ha
HO
H1
Pd
Hd
P
PO
P1
P2
F1/F2
d
L
L1
t
t1
W
WO
W1
W2
DO
S
DIMENSION
0.098 (m ax )
0.928 (+ /- 0.025)
0.630 (+ /- 0.020)
0.748 (+ /- 0.020)
0.040 (m ax )
0.031 (m ax )
0.500 (+ /- 0.020)
0.500 (+ /- 0.008)
0.150 (+ 0 .00 9, -0.010 )
0.247 (+ /- 0.007)
0.104 (+ /- 0 .010)
0.018 (+ 0 .00 2, -0.003 )
0.429 (m ax )
0.209 (+ 0 .05 1, -0.052 )
0.032 (+ /- 0.006)
0.021 (+ /- 0.006)
0.708 (+ 0 .02 0, -0.019 )
0.236 (+ /- 0.012)
0.035 (m ax )
0.360 (+ /- 0.025)
0.157 (+ 0 .00 8, -0.007 )
0.004 (m ax )
F63TNR Label
Customized Label
W2
ELECTROSTATIC
SENSITIVE DEVICES
D3
Note : All dimensions are in inches.
D4
D1
ITEM DESCRIPTIONSYSMBOL MINIMUM MAXIMUM
D2
W1
W3
Reel Diame t erD113.9 7514.025
Arbor Hol e Di am et er ( Standard)D 21.1601.200
Core DiameterD33.1003.300
Hub Recess Inner DiameterD42.7003.100
Hub Recess DepthW10.3700.570
Flange to Flange Inner WidthW21.6301.690
Hub to Hub Center WidthW32.090
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
Quiet Series™
SILENT SWITCHER
SMART ST ART™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PA TENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet IdentificationProduct StatusDefinition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. G
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