Fairchild MMSZ4688 service manual

MMSZ4688
5% TOLERANCE
General Description:
Half watt, General purpose, Medium Current Surface Mount Zener in the SOD-123 package. The SOD-123 package has the same footprint as the glass mini-melf (LL-34) package & provides a convenient alternative to the Leadless package.
Absolute Maximum Ratings (note 1) TA = 25
Features:
Compact surface mount with same footprint as mini-melf
500 mW rating on FR-4 or FR-5 board.
Class 3 ESD rating (>16 kV) per Human Body Model Ordering:
7 inch reel (178 mm); 8 mm Tape; 3,000 units per reel.
O
C unless otherwise noted
Parameter Value Units
T
- Storage Temperature -55 to +150
STG
TJ- Maximum Junction Temperature -55 to +150 OC PD - Total Power Dissipation at 25OC 500 mW
Derate above 25OC 6.7 mW/OC
R
- Thermal Resistance Junction to Ambient 340 OC/W
ØJA
R
- Thermal Resistance Junction to Lead 150 OC/W
ØJL
O
C
VZ- Maximum Voltage Change (Note 2) 990 mV Lead Solder Temperature (Max 10 second duration) 260 OC Nominal Zener Voltage (VZ) at 50 uA 4.7 V
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired Note 2: Voltage change is equal to the difference between V
at 100 uA and VZ at 10 uA.
Z
Top Mark: CT
1: Cathode
1
2
2: Anode
Electrical Characteristics TA = 25
O
C unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
V I
Zener Voltage 4.47 4.94 V IZT= 50.0 uA D.C
Z
Reverse Leakage 10 uA VR= 3.0 V
R
V
Forward Voltage 900 mV IF= 10 mA
F
VZDelta Zener Voltage 990 mV IF= 100 uA to 10 uA
© 1997 Fairchild Semiconductor Corporation
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ Bottomless™ CoolFET™ CROSSVOL T™ DenseTrench™ DOME™ EcoSPARK™ E2CMOS EnSigna
TM
TM
FACT™ FACT Quiet Series™
STAR*POWER is used under license
FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MICROWIRE™ OPTOLOGIC™
OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench
QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER
SMART ST ART™
ST AR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET
VCX™
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORA TION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STA TUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or In Design
First Production
Full Production
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. H3
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