MMBF5103
N-Channel Switch
• This device is designed for low level analog switching, sample and
hold circuits and chopper st
abilized amplifiers.
• Sourced from Process 51.
• See J111 for characteristics.
Absolute Maximum Ratings*
Ta=25°C unless otherwise noted
Symbol Parameter Value Units
V
DG
V
GS
I
GF
T
, T
J
STG
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations
Drain-Gate Voltage 40 V
Gate-Source Voltage -40 V
Forward Gate Current 50 mA
Operating and Storage Junction Temperature Range - 55 ~ 150 °C
G
D
1. Drain 2. Source 3. Gate
S
SOT-23
Mark: 66A
MMBF5103
Electrical Characteristics
Ta=25°C unless otherwise noted
Symbol Parameter Test Condition Min. Max. Units
Off Characteristics
V
(BR)GSS
I
GSS
V
GS(off)
V
GS(f)
Gate-Source Breakdown Voltage IG = 1.0µA, VDS = 0 -40 V
Gate Reverse Current VGS = -15V, VDS = 0
= -15V, VDS = 0, Ta = 125°C
V
Gate-Source Cutoff Voltage V
GS
= 20V, ID = 1.0nA -1.2 -2.7 V
DS
-200
-500
Gate-Source Forward Voltage IG = 1.0mA, VDS = 0 1.0 V
On Characteristics
I
DSS
Zero-Gate Voltage Drain Current * VDS = 15V, VGS = 0 10 40 mA
Small Signal Characteristics
C
ISS
C
rss
* Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 1.0%
Thermal Characteristics
Input Capacitance VDS = 15V, VGS = 0, f = 1.0MHz 16 pF
Reverse Transfer Capacitance VGS = -15V, f = 1.0MHz 6.0 pF
Ta=25°C unless otherwise noted
Symbol Parameter Max. Units
P
D
R
θJA
Total Device Dissipation
Derate above 25°C
350
2.8
mW
mW/°C
Thermal Resistance, Junction to Ambient 556 °C/W
pA
nA
©2003 Fairchild Semiconductor Corporation Rev. A, September 2003
Package Dimensions
0.40
±0.03
MMBF5103
SOT-23
0.20 MIN
0.45~0.60
0.95
2.90
±0.03
1.90
±0.10
0.95
±0.03
±0.03
±0.10
0.40
±0.03
0.97REF 1.30
0.508REF
±0.10
2.40
0.96~1.14
0.03~0.10
0.38 REF
+0.05
0.12
–0.023
Dimensions in Millimeters
©2003 Fairchild Semiconductor Corporation Rev. A, September 2003
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As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2003 Fairchild Semiconductor Corporation Rev. I5
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