Fairchild ISL9R860PF2 service manual

ISL9R860PF2
8A, 600V Stealth™ Diode
ISL9R860PF2
April 2003
General Description
The ISL9R860PF2 is a Stealt h™ di ode optimized for low loss performance in high frequency hard switched applications. The Stealth™ family exhibits low reverse recovery current (I under typical operating conditions.
This device is intended for use as a free wheeling or boost diode in power supplies and other power switching applications. The low I reduce loss in switching transistor s. The so f t recover y minimizes ringing, expanding the rang e of con di tions under which the diode may be operated without the use of additional snubber circuitry. Consider using the Stealth™ diode with an SMPS IGBT to provide the most efficient and highest power density design at lower cost.
Formerly developmental type TA49409.
) and exceptionally soft recovery
RRM
and short ta phase
RRM
Features
• Soft Recovery. . . . . . . . . . . . . . . . . . . . . .tb / ta > 1.2
• Fast Recovery. . . . . . . . . . . . . . . . . . . . . . .t
< 25ns
rr
• Operating Temperature. . . . . . . . . . . . . . . . . . 150
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . 600V
• Internally Isolated . . . . . . . . . . . . . . . . . . . . . . . . 1kV
• Avalanche Energy Rated
Applications
• Switch Mode Power Supplies
• Hard Switched PFC Boost Diod e
• UPS Free Wheeling Diode
• Motor Drive FWD
• SMPS FWD
• Snubber Diode
Package Symbol
TO-220F
K
A
o
C
CATHODE
Device Maximum Ratings T
Symbol Parameter Ratings Units
V
RRM
V
RWM
V
R
I
F(AV)
I
FRM
I
FSM
P
D
E
AVL
, T
T
J
STG
T
L
CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2003 Fairchild Semiconductor Corporation
ANODE
= 25°C unless otherwise noted
C
Peak Repetitive Reverse Voltage 600 V Working Peak Reverse Voltage 600 V DC Blocking Voltage 600 V Average Rectified Forw ard Current (TC = 75oC) 8 A Repetitive Peak Surge Current (20kHz Square Wave) 16 A Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz) 100 A Power Dissipation 26 W Avalanche Energy (1A, 40mH) 20 mJ Operating and Storage Temperature Range -55 to 150 °C Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s 300 °C
ISL9R860PF2 Rev. A
Package Marking and Ordering Information
Device Marking Device Package Tape Width Quantity
R860PF2 ISL9R860PF2 TO-220F N/A 50 Units
ISL9R860PF2
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off State Characteristics
I
Instantaneous Reverse Current VR = 600V TC = 25°C - - 100 µA
R
T
= 125°C--1.0mA
C
On State Characteristics
V
Instantaneous Forward Voltage IF = 8A TC = 25°C-2.02.4V
F
= 125°C-1.62.0V
T
C
Dynamic Characteristics
C
Junction Capacitance VR = 10V, IF = 0A - 30 - pF
J
Switching Characteristics
t
Reverse Recovery Time IF = 1A, dIF/dt = 100A/µs, VR = 30V - 18 25 ns
rr
Reverse Recovery Time IF = 8A,
t
rr
I
RRM
Q
Maximum Reverse Recovery Current - 3.2 - A Reverse Recovery Charge - 50 - nC
RR
t
Reverse Recovery Time IF = 8A,
rr
S Softness Factor (t
I
RRM
Q
Maximum Reverse Recovery Current - 3.4 - A Reverse Recovery Charge - 150 - nC
RR
Reverse Recovery Time IF = 8A,
t
rr
S Softness Factor (t
I
Q
dI
RRM
Maximum Reverse Recovery Current - 6.5 - A Reverse Recovery Charge 195 - nC
RR
/dt Maximum di/dt during t
M
)-3.7-
b/ta
)-2.5-
b/ta
b
= 8A, dIF/dt = 100A/µs, VR = 30V - 21 30 ns
I
F
-28-ns
/dt = 200A/µs,
dI
F
V
= 390V, TC = 25°C
R
-77-ns
/dt = 200A/µs,
dI
F
V
= 390V,
R
= 125°C
T
C
-53-ns
/dt = 600A/µs,
dI
F
V
= 390V,
R
= 125°C
T
C
- 500 - A/µs
Thermal Characteristics
R R
©2003 Fairchild Semiconductor Corporation ISL9R860PF2 Rev. A
Thermal Resistance Junction to Case - - 4.8 °C/W
θJC
Thermal Resistance Junction to Ambient TO-220F - - 70 °C/W
θJA
Typical Performance Curves
ISL9R860PF2
16
14
12
10
8
6
, FORWARD CURRENT (A)
4
F
I
2
0
0 0.5 0.75 1 2.50.25 1.5 2 2.25
VF, FORWARD VOLTAGE (V)
175oC
150oC
125oC
25oC
100oC
1.751.25
2.75
100
10
1
, REVERSE CURRENT (µA)
R
I
0.1 100 200 300 500 600400
VR, REVERSE VOLTAGE (V)
175oC
150oC
125oC
100oC
25oC
Figure 1. Forward Current vs Forward Voltage Figure 2. Reverse Current vs Reverse Voltage
80
VR = 390V, TJ = 125°C
70
60
50
40
30
t, RECOVERY TIMES (ns)
20
10
0
0
Figure 3. t
tb AT dIF/dt = 200A/µs, 500A/µs, 800A/µs
ta AT dIF/dt = 200A/µs, 500A/µs, 800A/µs
2 4 6 8 12 14
IF, FORWARD CURRENT (A)
and tb Curves vs Forward Current Figure 4. ta and tb Curves vs dIF/dt
a
10 16
90
80
70
60
50
40
30
t, RECOVERY TIMES (ns)
20
10
0
100
VR = 390V, TJ = 125°C
tb AT IF = 16A, 8A, 4A
ta AT IF = 16A, 8A, 4A
200 300 400 500 600 800 900
dIF/dt, CURRENT RATE OF CHANGE (A/µs)
700 1000
11
VR = 390V, TJ = 125°C
10
9 8 7 6 5 4 3
, MAX REVERSE RECOVERY CURRENT (A)
RRM
2
I
0
2 4 6 8 10 12 14
IF, FORWARD CURRENT (A)
dIF/dt = 800A/µs
dIF/dt = 500A/µs
dIF/dt = 200A/µs
16
Figure 5. Maximum Reverse Recovery Current vs
Forward Current
©2003 Fairchild Semiconductor Corporation ISL9R860PF2 Rev. A
14
VR = 390V, TJ = 125°C
12
10
8
6
4
2
, MAX REVERSE RECOVERY CURRENT (A)
RRM
I
0
200 300 400 500 600 800 900
100
IF = 8A
dI
/dt, CURRENT RATE OF CHANGE (A/µs)
F
IF = 16A
IF = 4A
700 1000
Figure 6. Maximum Reverse Recovery Current vs
dI
/dt
F
Typical Performance Curves (Continued)
ISL9R860PF2
6
VR = 390V, TJ = 125°C
5
350
VR = 390V, TJ = 125°C
300
IF = 16A
250
4
IF = 16A
IF = 8A
200
IF = 8A
3
150
2
S, REVERSE RECOVERY SOFTNESS FACTOR
1
100
IF = 4A
200 300 400 500 600 800 900
700 1000
dIF/dt, CURRENT RATE OF CHANGE (A/µs)
, REVERSE RECOVERY CHARGE (nC)
100
RR
Q
50
100 700 1000200 300 400 500 600 800 900
dIF/dt, CURRENT RATE OF CHANGE (A/µs)
IF = 4A
Figure 7. Reverse Recovery Softness Factor vs dIF/dt Figure 8. Rever s e Recovery Charge vs dIF/dt
, JUNCTION CAPACITANCE (pF)
J
C
1200
1000
800
600
400
200
0
0.1 100101 VR, REVERSE VOLTAGE (V)
10
8
6
4
2
, AVERAGE FORWARD CURRENT (A)
F(AV)
0
I
T
, CASE TEMPERATURE (oC)
C
10050 150
12575
Figure 9. Junction Capacitance vs Reverse Voltage Figure 10. DC Current Derating Curve
2.0 DUTY CYCLE - DESCENDING ORDER
1.0
0.5
0.2
0.1
0.05
0.02
0.1
, NORMALIZED Z
0.01
θJA
0.01
THERMAL IMPEDANCE
SINGLE PULSE
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
P
DM
t
1
t
2
1/t2
x R
+ T
θJA
θJA
A
0.001
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
t, RECTANGULAR PULSE DURATION (s)
Figure 11. Normalized Maximum Transient Thermal Impedance
©2003 Fairchild Semiconductor Corporation ISL9R860PF2 Rev. A
Test Circuits and Waveforms
VGE AMPLITUDE AND RG CONTROL dIF/dt t
AND t2 CONTROL I
1
V
GE
t
1
F
RG
t
2
L
DUT
MOSFET
CURRENT
SENSE
ISL9R860PF2
dI
F
I
F
dt
0
+
V
DD
-
t
rr
t
a
t
b
0.25 I
RM
I
RM
Figure 12. trr Test Circuit
I = 1A L = 40mH R < 0.1
= 50V
V
DD
= 1/2LI2 [V
E
AVL
Q
= IGBT (BV
1
R(AVL)
CES
/(V
R(AVL)
> DUT V
Q1
R(AVL)
- VDD)] )
CURRENT
SENSE
LR
DUT
Figure 14. Avalanche Energy Test Circuit
Figure 13. t
Waveforms and Definitions
rr
V
AVL
+
I
V
DD
IV
L
I
L
­t
0
t
1
t
2
t
Figure 15. Avalanche Current and Voltage
Waveforms
©2003 Fairchild Semiconductor Corporation ISL9R860PF2 Rev. A
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1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or In Design
First Production
Full Production
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I2
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