ISL9R460PF2
4A, 600V Stealth™ Diode
ISL9R460PF2
April 2009
General Description
The ISL9R460PF2 is a Stealth™ diode optimized for low
loss performance in high frequency hard switched
applications. The Stealth™ family exhibits low reverse
recovery current (I
under typical operating conditions.
This device is intended for use as a free wheeling or boost
diode in power supplies and other power switching
applications. The low I
in switching transistors. The soft recovery minimizes
ringing, expanding the range of conditions under which the
diode may be operated without the use of additional
snubber circuitry. Consider using the Stealth™ diode with
an SMPS IGBT to provide the most efficient and highest
power density design at lower cost.
Formerly developmental type TA49408.
) and exceptionally soft recovery
RRM
and shor t ta phase reduce loss
RRM
Features
• Soft Recovery . . . . . . . . . . . . . . . . . . . . . . . . . tb / ta > 3
• Fast Recovery . . . . . . . . . . . . . . . . . . . . . . . . . t
< 20ns
rr
• Operating Temperature . . . . . . . . . . . . . . . . . . . . 150
• Reverse Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 600V
• Avalanche Energy Rated
Applications
• Switch Mode Power Supplies
• Hard Switched PFC Boost Diode
• UPS Free Wheeling Diode
• Motor Drive FWD
•SMPS FWD
• Snubber Diode
Package Symbol
TO-220F
K
o
C
A
CATHODE
Device Maximum Ratings T
ANODE
= 25°C unless otherwise noted
C
Symbol Parameter Ratings Units
V
RRM
V
RWM
V
I
F(AV)
I
FRM
I
FSM
P
E
AV L
T
, T
J
T
T
PKG
CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2009 Fairchild Semiconductor Corporation
Peak Repetitive Reverse Voltage 600 V
Working Peak Reverse Voltage 600 V
DC Blocking Voltage 600 V
R
Average Rectified Forward Current (TC = 108°C) 4 A
Repetitive Peak Surge Current (20kHz Square Wave) 8 A
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz) 50 A
Power Dissipation 22 W
D
Avalanche Energy (0.5A, 80mH) 10 mJ
Operating and Storage Temperature Range -55 to 150 °C
STG
Maximum Temperature for Soldering
L
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Techbrief TB334
300
260
°C
°C
ISL9R 460PF2 R ev. A1
Package Marking and Ordering Information
Device Marking Device Package Tape Width Quantity
R460PF2 ISL9R460PF2 TO-220F N/A 50 Units
ISL9R460PF2
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off State Characteristics
Instantaneous Reverse Current VR = 600V TC = 25°C--100µA
I
R
T
= 125°C--1.0mA
C
On State Characteristics
Instantaneous Forward Voltage IF = 4A TC = 25°C-2.02.4V
V
F
T
= 125°C-1.62.0V
C
Dynamic Characteristics
C
Junction Capacitance VR = 10V, IF = 0A - 19 - pF
J
Switching Characteristics
t
Reverse Recovery Time IF = 1A, dIF/dt = 100A/µs, VR = 30V - 17 20 ns
rr
I
= 4A, dIF/dt = 100A/µs, VR = 30V - 19 22 ns
F
t
Reverse Recovery Time IF = 4A,
rr
I
Q
Maximum Reverse Recovery Current - 2.6 - A
RRM
Reverse Recovered Charge - 22 - nC
RR
t
Reverse Recovery Time IF = 4A,
rr
S Softness Factor (t
I
Q
Maximum Reverse Recovery Current - 2.8 - A
RRM
Reverse Recovered Charge - 100 - nC
RR
t
Reverse Recovery Time IF = 4A,
rr
S Softness Factor (t
I
Q
dI
Maximum Reverse Recovery Current - 4.3 - A
RRM
Reverse Recovered Charge 110 - nC
RR
/dt Maximum di/dt during t
M
dI
/dt = 200A/µs,
F
= 390V, TC = 25°C
V
R
dI
/dt = 200A/µs,
)-4.2-
b/ta
)-3.5-
b/ta
b
F
= 390V,
V
R
= 125°C
T
C
dI
/dt = 400A/µs,
F
= 390V,
V
R
= 125°C
T
C
-17-ns
-77-ns
-54-ns
-500-A/µs
Thermal Characteristics
R
R
©2009 Fairchild Semiconductor Corporation ISL9R 460PF2 R ev. A1
Thermal Resistance Junction to Case - - 5.7 °C/W
θJC
Thermal Resistance Junction to Ambient TO-220F - - 70 °C/W
θJA
Typical Performance Curves T
= 25°C unless otherwise noted
C
ISL9R460PF2
8
7
6
5
4
3
, FORWARD CURRENT (A)
2
F
I
1
0
00.511.522.5
VF, FORWARD VOLTAGE (V)
150oC
25oC
100oC
3
600
100
10
1
, REVERSE CURRENT (µA)
R
I
0.1
100 200 300 500 600400
VR, REVERSE VOLTAGE (V)
150oC
125oC
100oC
75oC
25oC
Figure 1. Forward Current vs Forward Voltage Figure 2. Reverse Current vs Reverse Voltage
90
VR = 390V, TJ = 125oC
80
tb AT d IF/dt = 200A/µs, 500A/µs, 800A/µs
70
60
50
40
30
t, RECOVERY TIMES (ns)
20
10
0
Figure 3. t
ta AT d IF/dt = 200A/µs, 500A/µs, 800A/µs
1234 67
IF, FORWARD CURRENT (A)
and tb Curves vs Forward Current Figure 4. ta and tb Curves vs dIF/dt
a
58
120
VR = 390V, TJ = 125oC
100
80
60
40
t, RECOVERY TIMES (ns)
ta AT IF = 8A, 4A, 2A
20
0
100
tb AT IF = 8A, 4A, 2A
200 300 400 500 600 800 900
dIF/dt, CURRENT RATE OF CHANGE (A/µs)
700 1000
8
VR = 390V, TJ = 125oC
7
6
5
4
3
, MAX REVERSE RECOVERY CURRENT (A)
RRM
I
2
1
2345678
IF, FORWARD CURRENT (A)
dIF/dt = 800A/µs
dIF/dt = 500A/µs
dIF/dt = 200A/µs
Figure 5. Maximum Reverse Recovery Current vs
Forward Current
©2009 Fairchild Semiconductor Corporation ISL9R 460PF2 R ev. A1
8
VR = 390V, TJ = 125oC
7
6
5
4
3
2
, MAX REVERSE RECOVERY CURRENT (A)
RRM
I
1
100
200 300 400 500 600 800 900
IF = 4A
dIF/dt, CURRENT RATE OF CHANGE (A/µs)
IF = 8A
IF = 2A
700 1000
Figure 6. Maximum Reverse Recovery Current vs
dIF/dt