•Fast switching
technology and features low gate charge while maintaining
low on-resistance.
Optim ized for swit ch ing appl icat ions , t his devi ce i mpr ove s
the overall efficiency of DC/DC converters and allows
operation to higher switching frequencies.
Applications
• DC/DC converters
DRAIN (FLANGE)
DRAIN
GATE
SOURCE
(FLANGE)
TO-252
MOSFET Maximum RatingsT
= 25°C unless otherwise noted
A
•r
•r
•Q
•Q
•C
TO-251
= 0.0052Ω (Typ), VGS = 10V
DS(ON)
= 0.0085Ω (Typ), VGS = 4.5V
DS(ON)
(Typ) = 30nC, VGS = 5V
g
(Typ) = 11nC
gd
(Typ) = 3400pF
ISS
SOURCE
DRAIN
GATE
D
G
S
SymbolParameterRatingsUnits
V
DSS
V
GS
Drain to Sou r c e Voltage30V
Gate to Source Voltage±20V
Drain Curr e nt
Continuous (T
I
D
Continuous (T
Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 4.5V) 50A
C
= 25oC, VGS = V, R
C
= 52oC/W) 16A
θJC
50A
PulsedFigure 4A
P
D
T
, T
J
STG
Power dissipation
Derate above 25
o
C
Operating and Storage Temperature-55 to 175
125
0.83
W
W/oC
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
Thermal Resistance Junction to Case TO-251, TO-2521.2
Thermal Resistance Junction to Ambient TO-251, TO-252100
Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad ar ea52
Drain to Sou r c e Br ea kd ow n VoltageID = 250µA, VGS = 0V30--V
V
= 25V--1
Zero Gate Voltage Drain Current
DS
= 0VTC = 150
V
GS
o
--250
Gate to Source Leakage CurrentVGS = ±20V--±100nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold VoltageVGS = VDS, ID = 250µA1-3V
I
= 50A, VGS = 10V -0.0052 0.0060
Drain to S ou r c e On Re si st ance
D
= 50A, VGS = 4.5V-0.0085 0.0095
I
D
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(5)
g(TH)
gs
gd
Input Capacitance
Output Capacitance-650-pF
Reverse Transfer Capacitance-300-pF
Total Gate Charge at 10VVGS = 0V to 10V
Total Gate Charge at 5VVGS = 0V to 5V-3045nC
Threshold Gate ChargeVGS = 0V to 1V-3.04.5nC
Gate to Source Gate Charg e-10-n C
Gate to Drain “Miller” Charge-11-nC
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time-16-ns
Rise Time-70-ns
Turn-Off Delay Time-34-ns
Fall Time-30-ns
Turn-Off T ime--97ns
(VGS = 4.5V)
= 15V, VGS = 0V,
V
DS
f = 1MHz
V
= 15V, ID = 16A
DD
V
= 4.5V, RGS = 4.3Ω
GS
= 15V
V
DD
I
= 50A
D
I
= 1.0mA
g
-3400- pF
-6090nC
--131ns
µA
Ω
Switching Characteristics (V
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time-10-ns
Rise Time-43-ns
Turn-Off Delay Time-62-ns
Fall Time-29-ns
Turn-Off T ime--137ns
The maximum rated junction temperature, TJM, and the
thermal resistance of the heat dissipating path determines
the maxi mum al lowab le de vice p ower di ssip ation, P
application. Therefore the application’s ambient
temperature, T
must be reviewed to ensure that T
Equation 1 mathematically represents the relationship and
(oC), and th ermal res istance R
A
is never exceeded.
JM
serve s as the basis for establ ishing the rating of the part.
TJMTA–()
P
----------------- ------------=
DM
Z
θJA
DM
(oC/W)
θJA
(EQ. 1)
, in an
100
C/W)
o
(
θJA
R
ISL9N306AD3 / ISL9N306AD3ST
R
= 33.32 + 23.84/(0.268+Area)
θJA
75
50
In using surface mount devices such as the TO-252
package, the environment in which it is applied will have a
significant influence on the part’s current and maximum
power d issipati on rating s. Precise d etermin ation of P
comple x and influenced by many factors:
DM
is
1. Mou nting pad area ont o which the device is attached and
whet her the re is copp er on one s ide or both side s of the
board.
2. The number of copper layers and the thickness of the
board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For no n steady state applic ations, th e pulse widt h, the
duty cycle and the transient thermal response of the part,
the boa rd and the environment they are in.
Fairchild provides thermal information to assist the
designer’s preliminary application evaluation. Figure 21
defines the R
copper (component side) area. This is for a horizontally
for the device as a function of the top
θJA
positi on ed FR-4 bo ar d with 1 oz c o pp er af t er 1000 se c on ds
of stea dy st ate pow er w ith n o air flow . Th is gr aph prov ides
the necessary inf ormation for calculation of the steady state
junction temperature or power dissipation. Pulse
applications can be evaluated using the Fairchild device
Spice t hermal model or manu ally utilizin g the normal ized
maximum transient thermal impedance curve.
25
0.010.1110
AREA, TOP COPPER AREA (in2)
Figure 21. Thermal Resistance vs Mounting
Pad Area
Displayed on the curve are R
Electrical Specifications table. The points were chosen to
values listed in the
θJA
depict the compromise between the copper board area, the
thermal resistance and ultimately the power dissipation,
P
.
DM
Therma l resi stances correspondi ng to other copper are as
can be obtained from Figure 21 or by calculation using
Equation 2. R
times a coefficient added to a constant. The area, in square
is defined as the natural log of the area
θJA
inches is the top copp er area incl uding the gate and source
pads.
The following are registe red and unr egistered trademarks Fairchild Semiconductor owns or is aut horized to use and is not
intended to be an exhaustive list of all such trademarks.
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) ar e int ende d fo r s urgic al i mpla nt into the bo dy,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A c r it ic al c om ponent i s an y c om ponent o f a life s u pp or t
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet IdentificationProduct StatusDefinition
Adva nce InformationFormative or I n
Design
PreliminaryFirst ProductionThis datasheet contains preliminary data, and
No Identification NeededFull ProductionThis datasheet contains final specifications. Fairchild
ObsoleteNot In ProductionThis datasheet contains specifications on a prod uct
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
supple m entary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
Semiconductor reserves the righ t to make chan ges at
any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I2
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