Datasheet H11AG1M, H11AG2M, H11AG3M Datasheet (Fairchild)

H11AG1M — Phototransistor Optocoupler
September 2009
Features
High efficiency low degradation liquid epitaxial IRED Logic level compatible, input and output currents,
with CMOS and LS/TTL
High DC current transfer ratio at low input currents (as low as 200µA)
Underwriters Laboratory (UL) recognized File #E90700, Volume 2
IEC 60747-5-2 approved (ordering option V)
Applications
CMOS driven solid state reliability
Telephone ring detector Digital logic isolation
Schematic
ANODE
1
6
BASE
Description
The H11AG1M device consists of a Gallium-Aluminum­Arsenide IRED emitting diode coupled with a silicon phototransistor in a dual in-line package. This device provides the unique feature of the high current transfer ratio at both low output voltage and low input current. This makes it ideal for use in low power logic circuits, telecommunications equipment and portable electronics isolation applications.
6
1
N/C
2
3
5 COL
4 EMITTER
6
1
CATHODE
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3
6
1
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol Parameters Value Units
TOTAL DEVICE
T
STG
T
OPR
T
SOL
P
D
EMITTER
I
F
V
R
I
(pk) Forward Current – Peak (1µs pulse, 300pps) 3.0 A
F
P
D
DETECTOR
P
D
I
C
Storage Temperature -55 to +150 °C Operating Temperature -40 to +100 °C Lead Solder Temperature (Wave Solder) 260 for 10 sec °C Total Device Power Dissipation @ 25°C (LED plus detector) Derate Linearly From 25°C
260 mW
3.5 mW/°C
Continuous Forward Current 50 mA Reverse Voltage 6 V
LED Power Dissipation 25°C Ambient Derate Linearly From 25°C
Detector Power Dissipation @ 25°C Derate Linearly from 25°C
75 mW
1.0 mW/°C
150 mW
2.0 mW/°C
Continuous Collector Current 50 mA
H11AG1M — Phototransistor Optocoupler
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 2
(T
Electrical Characteristics
= 25°C unless otherwise specified.)
A
Individual Component Characteristics
Symbol Parameters Test Conditions Min. Typ.* Max. Units
EMITTER
V
I
C
DETECTOR
BV
BV
BV
I
CEO
C
*Typical values at T
Input Forward Voltage I
F
Reverse Leakage Current V
R
Capacitance V = 0, f = 1.0MHz 100 pF
J
Breakdown Voltage, Collector to Emitter I
CEO
Collector to Base I
CBO
Emitter to Collector I
ECO
Leakage Current, Collector to Emitter V
Capacitance V
CE
= 25°C.
A
= 1mA 1.25 1.5 V
F
= 5V, T
R
= 1.0mA, I
C
= 100µA, I
C
= 100µA, I
C
CE
CE
= 25°C 10 µA
A
= 0 30 V
F
= 0 70 V
F
= 0 7 V
F
= 10V, I
= 0 5 10 µA
F
= 10V, f = 1MHz 10 pF
H11AG1M — Phototransistor Optocoupler
Isolation Characteristics
Symbol Parameter Test Conditions Min. Typ.* Max. Units
V
ISO
R
ISO
Input-Output Isolation Voltage f = 60Hz, t = 1 sec. 7500 Isolation Resistance V
Transfer Characteristics
= 500VDC, T
I-O
(T
= 25°C Unless otherwise specified.)
A
= 25°C 10
A
11
V
AC
Symbol Characteristics Test Conditions Min. Typ.* Max. Units
DC CHARACTERISTICS
CTR Current Transfer Ratio I
V
CE(SAT)
Saturation Voltage I
AC CHARACTERISTICS
Non-Saturated Switching Times
t
on
t
off
*Typical values at T
Tu r n-On Time R Tu r n-Off Time R
= 25°C
A
= 1mA, V
F
I
= 1mA, V
F
I
= 0.2mA, V
F
= 2.0mA, I
F
= 100 , I
L
= 100 , I
L
= 5V 300 %
CE
= 0.6V 100
CE
= 1.5V 100
CE
= 0.5mA .40 V
C
= 1mA, V
F
= 1mA, V
F
= 5V 5 µs
CC
= 5V 5 µs
CC
PEAK
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 3
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol Parameter Min. Typ. Max. Unit
H11AG1M — Phototransistor Optocoupler
Installation Classifications per DIN VDE 0110/1.89
Ta ble 1 For Rated Main Voltage < 150Vrms I-IV For Rated Main voltage < 300Vrms I-IV Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2
CTI Comparative Tracking Index 175
V
PR
Input to Output Test Voltage, Method b,
V
x 1.875 = V
IORM
, 100% Production Test
PR
1594 V
peak
with tm = 1 sec, Partial Discharge < 5pC
Input to Output Test Voltage, Method a, V
IORM
x 1.5 = V
, Type and Sample Test
PR
1275 V
peak
with tm = 60 sec, Partial Discharge < 5pC
V
V
IORM
IOTM
Max. Working Insulation Voltage 850 V Highest Allowable Over Voltage 6000 V
peak
peak
External Creepage 7 mm External Clearance 7 mm
Insulation Thickness 0.5 mm
RIO Insulation Resistance at Ts, V
= 500V 10
IO
9
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 4
Typical Performance Curves
H11AG1M — Phototransistor Optocoupler
Figure 1. LED Forward Voltage vs. Forward Current
2.0
1.8
1.6
- FORWARD VOLTAGE (V)
F
V
1.4
1.2
= -55oC
T
A
= 25
T
A
= 100oC
T
A
o
C
1.0
0.8
0.1 1 10 100
IF - LED FORWARD CURRENT (mA)
Figure 3. Normalized CTR vs. Temperature
1.6
NORMALIZED TO:
I
= 5mA
F
= 5V
V
CE
o
T
= 25
C
A
= 1mA
I
F
I
= 0.5mA
F
IF = 0.2mA
-60 -40 -20 0 20 40 60 80 100
T
- AMBIENT TEMPERATURE -
A
o
C
CE
NORMALIZED CTR
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
I
= 10mA
F
IF = 2mA
= 5mA
I
F
Figure 2. Normalized Current Transfer Ratio vs. Forward Current
1.2
1.0
CE
0.8
CTR
0.6
0.4
NORMALIZED
NORMALIZED TO:
= 5mA
I
0.2
F
V
= 5V
CE
o
= 25
T
C
A
0.1 1 10 100
IF - FORWARD CURRENT - mA
Figure 4. Normalized Collector vs. Collector - Emitter Voltage
10
ENT
1
0.1
0.01
- COLLECTOR - EMITTER CURR
CE
0.001
0.0001
NORMALIZED I
0.1 1 10
V
- COLLECTOR - EMITTER VOLTAGE - V
CE
= 10mA
I
F
I
= 5mA
F
= 2mA
I
F
= 1mA
I
F
= 0.5mA
I
F
I
= 0.2mA
F
NORMALIZED TO: I
= 5mA
F
V
= 5V
CE
T
= 25oC
A
Figure 5. Normalized Collector Base
Photocurrent Ratio vs. Forward Current
30
25
20
Figure 6. Normalized Collector - Base Current vs. Temperature
10
= 10mA
I
F
1
IF = 5mA
IF = 2mA
IF = 1mA
15
10
NORMALIZED TO: I
= 5mA
5
0
NORMALIZED ICB - COLLECTOR BASE PHOTOCURRENT
0102030405060708090100
F
V
CB
T = 25
A
= 5V
o
C
IF - FORWARD CURRENT - mA
0.1 = 0.5mA
I
F
IF = 0.2mA
0.01 NORMALIZED TO:
I
= 5mA
F
V
= 5V
CB
= 25oC
T
NORMALIZED COLLECTOR - BASE CURRENT
A
0.001
-60 -40 -20 0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - oC
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 5
H11AG1M — Phototransistor Optocoupler
Typical Performance Curves
Figure 7. Collector-Emitter Dark Current vs. Ambient Temperature
10000
1000
100
10
- DARK CURRENT (nA)
CEO
I
0.1
R
AC
INPUT
VOLTAGE
1
1N4148
C
1
H11AG1M
4.7M
(Continued)
IF = 0mA
= 10V
V
CE
1
0102030405060708090100
TA - AMBIENT TEMPERATURE (oC)
3V VCC 10V
47K
C
0.1
4093 or 74HC14
4.7K
2
Input R1 C1 Z
40-90 VRMS
20Hz
95-135 VRMS
60Hz
200-280 VRMS
50/60Hz
DC component of input voltage is ignored due to C1
75K
1/10W
180K
1/10W
390K 1/4W
0.1µF 100V
12 ηF 200 V
6.80 ηF
400 V
109K
285K
550K
Figure 8. Telephone Ring Detector/A.C. Line CMOS Input Isolator
The H11AG1M uses less input power than the neon bulb traditionally used to monitor telephone and line voltages. Additionally. response time can be tailored to ignore telephone dial tap, switching transients and other undesired signals by modifying the value of C2. The high impedance to line voltage also can simply board layout spacing requirements.
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 6
Package Dimensions
Through Hole 0.4" Lead Spacing
8.13–8.89
64
8.13–8.89
64
H11AG1M — Phototransistor Optocoupler
6.10–6.60
5.08 (Max.)
3.28–3.53
0.38 (Min.)
(0.86)
1.02–1.78
Pin 1
13
0.41–0.51
0.25–0.36
0.76–1.14
2.54–3.81
2.54 (Bsc)
Surface Mount
7.62 (Typ.)
15° (Typ.)
8.13–8.89
64
0.20–0.30
6.10–6.60
5.08 (Max.)
3.28–3.53
0.38 (Min.)
(0.86)
1.02–1.78
Pin 1
13
0.41–0.51
(1.78)
0.25–0.36
0.76–1.14
2.54–3.81
2.54 (Bsc)
(1.52)
0.20–0.30
10.16–10.80
(2.54)
(0.76)
8.43–9.90
6.10–6.60
Pin 1
(7.49)
(10.54)
13
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.38 (Min.)
(0.86)
1.02–1.78
0.41–0.51
0.76–1.14
2.54 (Bsc)
0.16–0.88
(8.13)
0.20–0.30
Note:
All dimensions in mm.
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 7
Ordering Information
Suffix Example Option
No Suffix H11AG1M Standard Through Hole Device (50 units per tube)
S H11AG1SM Surface Mount Lead Bend
SR2 H11AG1SR2M Surface Mount; Tape and Reel (1,000 units per reel)
T H11AG1TM 0.4" Lead Spacing
V H11AG1VM VDE 0884 TV H11AG1TVM VDE 0884, 0.4" Lead Spacing SV H11AG1SVM VDE 0884, Surface Mount
SR2V H11AG1SR2VM VDE 0884, Surface Mount, Tape & Reel (1,000 units per reel)
Marking Information
H11AG1M — Phototransistor Optocoupler
1
H11AG1
V X YY Q
43
5
2
6
Definitions
1Fairchild logo 2Device number 3 VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table) 4 One digit year code, e.g., ‘7’ 5Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 8
Tape Dimensions
4.5 ± 0.20
21.0 ± 0.1
0.1 MAX
0.30 ± 0.05
User Direction of Feed
4.0 ± 0.1
10.1 ± 0.20
12.0 ± 0.1
2.0 ± 0.05
1.5 MIN
Ø
11.5 ± 1.0
9.1 ± 0.20
1.5 ± 0.1/-0
Ø
1.75 ± 0.10
24.0 ± 0.3
H11AG1M — Phototransistor Optocoupler
Note:
All dimensions are in inches (millimeters)
Reflow Soldering Profile
300 280 260 240 220 200 180 160
°C
140 120 100
80 60 40 20
0
0 60 180120 270
1.822°C/Sec Ramp up rate
33 Sec
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
360
Time (s)
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 9
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H11AG1M — Phototransistor Optocoupler
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As used herein:
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary
First Production
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I40
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11AG1M Rev. 1.0.3 10
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