Fairchild FQPF3N60 service manual

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FQPF3N60

FQPF3N60

600V N-Channel MOSFET

April 2000

QFET

QFET

QFETQFET

TM

General Description

These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supply.

GSD

Absolute Maximum Ratings

Symbol Parameter FQPF3N60 Units

V

DSS

I

D

I

DM

V

GSS

E

AS

I

AR

E

AR

dv/dt Peak Diode Recovery dv/dt
P

D

T

, T

J

STG

T

L

Drain-Source Voltage 600 V
Drain Current

Drain Current - Pulsed
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy

Power Dissipation (TC = 25°C)

Operating and Storage Temperature Range -55 to +150 °C
Maximum lead temperature for soldering purposes,
1/8 from case for 5 seconds

- Continuous (T

- Continuous (T

- Derate above 25°C 0.27 W/°C

TO-220F

FQPF Series



TC = 25°C unless otherwise noted

= 25°C)

C

= 100°C)

C

Features

• 2.0A, 600V, R

• Low gate charge ( typical 10 nC)

• Low Crss ( typical 5.5 pF)

• Fast switching

• 100% avalanche tested

• Improved dv/dt capability

G

(Note 1)

(Note 2)
(Note 1)
(Note 1)
(Note 3)

= 3.6Ω @VGS = 10 V

DS(on)

D

!

!

"

"

"

"

!

!

"

!

!

"
"

"

!

!

S

2.0 A

1.26 A

8.0 A

±

200 mJ

2.0 A

3.4 mJ

4.5 V/ns

300 °C

30 V

34 W

Thermal Characteristics

Symbol Parameter Typ Max Units

R

θ

JC

R

θ

CS

R

θ

JA

©2000 Fairchild Semiconductor International

Thermal Resistance, Junction-to-Case -- 3.68 °CW
Thermal Resistance, Case-to-Sink 0.5 -- °CW
Thermal Resistance, Junction-to-Ambient -- 62.5 °CW

Rev. A, April 2000

FQPF3N60

Electrical Characteristics



TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV

∆

BV
/ ∆T
I

DSS

I

GSSF

I

GSSR

Drain-Source Breakdown Voltage

DSS

Breakdown Voltage Temperature

DSS

Coefficient

J

Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward

Gate-Body Leakage Current, Reverse

= 0 V, ID = 250 µA

V

GS

= 250 µA, Referenced to 25°C

I

D

V

= 600 V, VGS = 0 V

DS

V

= 480 V, TC = 125°C

DS

= 30 V, VDS = 0 V

V

GS

V

= -30 V, VDS = 0 V

GS

600 -- -- V

-- 0.6 -- V/°C

-- -- 10

-- -- 100

-- -- 100 nA

-- -- -100 nA

On Characteristics

V
R

g

FS

GS(th)

DS(on)

Gate Threshold Voltage
Static Drain-Source

On-Resistance
Forward Transconductance

= VGS, ID = 250 µA

V

DS

= 10 V, ID = 1.0 A

V

GS

= 50 V, ID = 1.0 A

V

DS

(Note 4)

3.0 -- 5.0 V

-- 2.8 3.6

-- 2.2 -- S

Dynamic Characteristics

C

iss

C

oss

C

rss

Input Capacitance
Output Capacitance -- 50 65 pF
Reverse Transfer Capacitance -- 5.5 7.5 pF

= 25 V, VGS = 0 V,

V

DS

f = 1.0 MHz

-- 350 450 pF

Switching Characteristics

t

d(on)

t

r

t

d(off)

t

f

Q
Q
Q

g
gs
gd

Turn-On Delay Time
Turn-On Rise Time -- 30 70 ns
Turn-Off Delay Time -- 20 50 ns
Turn-Off Fall Time -- 30 70 ns
Total Gate Charge
Gate-Source Charge -- 2.7 -- nC
Gate-Drain Charge -- 4.9 -- nC

= 300 V, ID = 3.0 A,

V

DD

Ω

= 25

R

G

V

= 480 V, ID = 3.0 A,

DS

V

GS

= 10 V

(Note 4, 5)

(Note 4, 5)

-- 10 30 ns

-- 10 13 nC

µ

A

µ

A

Ω

Drain-Source Diode Characteristics and Maximum Ratings

I

S

I

SM

V

SD

t

rr

Q

rr

Notes:

1. Repetitive Rating : Pulse width limited by maximum junction temperature

2. L = 92mH, I

3. ISD  3.0A, di/dt  200A/µs, V

4. Pulse Test : Pulse width 300µs, Duty cycle 2%

5. Essentially independent of operating temperature

©2000 Fairchild Semiconductor International

Maximum Continuous Drain-Source Diode Forward Current -- -- 2.0 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 8.0 A

= 0 V, IS = 2.0 A

Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 1.2 --

= 2.0A, VDD = 50V, RG = 25

AS

DD



BV

DSS,

Ω,

Starting TJ = 25°C

Starting TJ = 25°C

V

GS

= 0 V, IS = 3.0 A,

V

GS

/ dt = 100 A/µs

dI

F

(Note 4)

-- -- 1.4 V

-- 210 -- ns

µ

Rev. A, April 2000

C

Typical Characteristics

FQPF3N60

V

GS

Top : 1 5 .0 V

10.0 V

8.0 V

7.0 V

6.5 V

6.0 V

0

Bottom : 5.5 V

10

-1

10

, Dra in Curre n t [A ]

D

I

-2

10

-1

10

0

10



Note s :

1. 250s Pulse Test



2. T

= 25

C

1

10

VDS, Drain-Source Voltage [V]

12

10

8

],



[

6

DS(ON)

R

4

Drain-Source On-Resistance

2

0

01234567

VGS = 20V

VGS = 10V



Note : T

ID, Drain Current [A]



0

10

, Dra in C u rre n t [A]

D

I

-1

10

246810

150



25



-55

VGS , Gate-Source Voltage [V]



Note s :

= 50V

1. V

DS

2. 250s Pulse Test

Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s

0



= 25

J

10



, Reverse Drain Current [A]

DR

I

-1

10

150

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6



25



Note s :

1. V

= 0V

GS

2. 250s Pulse Tes t

VSD , So u rc e- D ra in Voltag e [V ]

Figure 3. On-Resistance Variati on vs.

Drain Current and Gate Voltage

600

500

400

300

200

Capacitance [pF]

100

0

-1

10

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics

©2000 Fairchild Semiconductor International

C
C
C

C

iss

C

oss

C

rss

0

10

VDS, Drain-Source Voltage [V]

= Cgs + Cgd (Cds = shorted)

iss

= Cds + C

oss

gd

= C

rss

gd



Note s :

1. V

= 0 V

GS

2. f = 1 MHz

1

10

Figure 4. Body Diode Forward Voltage

Variation vs. Source Current

and Temperature

12

10

8

6

4

, Gate-Source Voltage [V]

GS

2

V

0

0246810

QG, Total Gate Ch a rg e [nC]

VDS = 120V

VDS = 300V

VDS = 480V



Note : I

= 3.0 A

D

Rev. A, April 2000