Fairchild FQPF20N06 service manual

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FQPF20N06

60V N-Channel MOSFET

FQPF20N06

May 2001

TM

QFET

General Description

These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as automotive, DC/

Features

• 15A, 60V, R

• Low gate charge ( typical 11.5 nC)

• Low Crss ( typical 25 pF)

• Fast switching

• 100% avalanche tested

• Improved dv/dt capability

• 175°C maximum junction temperature rating

= 0.06Ω @VGS = 10 V

DS(on)

DC converters, and high efficiency switching for power
management in portable and battery operated products.

D

!

!

"

"

"

"

!

!

"

"
"

"

!

!

S

D

G

S

Absolute Maximum Ratings T

TO-220F

FQPF Series

= 25°C unless otherwise noted

C

!

!

G

Symbol Parameter FQPF20N06 Units

V

DSS

I

D

I

DM

V

GSS

E

AS

I

AR

E

AR

dv/dt Peak Diode Recovery dv/dt
P

D

Drain-Source Voltage 60 V
Drain Current

- Continuous (T

- Continuous (T

Drain Current - Pulsed

= 25°C)

C

= 100°C)

C

(Note 1)

15 A

10.7 A
60 A

Gate-Source Voltage ± 25 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy

Power Dissipation (TC = 25°C)

(Note 2)
(Note 1)
(Note 1)
(Note 3)

155 mJ

15 A

3.0 mJ

7.0 V/ns
30 W

- Derate above 25°C 0.2 W/°C

T

, T

J

STG

T

L

Operating and Storage Temperature Range -55 to +175 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds

300 °C

Thermal Characteristics

Symbol Parameter Typ Max Units

R

θJC

R

θJA

©2001 Fairchild Semiconductor Corporation Rev. A1. May 2001

Thermal Resistance, Junction-to-Case -- 5.00 °C/W
Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W

FQPF20N06

Electrical Characteristics T

= 25°C unless otherwise noted

C

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV
∆BV
/ ∆T
I

DSS

I

GSSF

I

GSSR

Drain-Source Breakdown Voltage

DSS

Breakdown Voltage Temperature

DSS

Coefficient

J

Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward

Gate-Body Leakage Current, Reverse

= 0 V, ID = 250 µA

V

GS

I

= 250 µA, Referenced to 25°C

D

V

= 60 V, VGS = 0 V

DS

V

= 48 V, TC = 150°C

DS

V

= 25 V, VDS = 0 V

GS

= -25 V, VDS = 0 V

V

GS

60 -- -- V

-- 0.07 -- V/°C

-- -- 1 µA

-- -- 10 µA

-- -- 100 nA

-- -- -100 nA

On Characteristics

V
R

g

FS

GS(th)

DS(on)

Gate Threshold Voltage
Static Drain-Source

On-Resistance
Forward Transconductance

V

= VGS, ID = 250 µA

DS

= 10 V , ID = 7.5 A

V

GS

= 25 V, ID = 7.5 A

V

DS

(Note 4)

2.0 -- 4.0 V

-- 0.048 0.06 Ω

-- 10 -- S

Dynamic Characteristics

C

iss

C

oss

C

rss

Input Capacitance
Output Capacitance -- 170 220 pF
Reverse Transfer Capacitance -- 25 35 pF

= 25 V, VGS = 0 V,

V

DS

f = 1.0 MHz

-- 450 590 pF

Switching Characteristics

t

d(on)

t

r

t

d(off)

t

f

Q
Q
Q

g
gs
gd

Turn-On Delay Time
Turn-On Rise Time -- 45 100 ns
Turn-Off Delay Time -- 20 50 ns
Turn-Off Fall Time -- 25 60 ns
Total Gate Charge
Gate-Source Charge -- 3 -- nC
Gate-Drain Charge -- 4.5 -- nC

= 30 V, ID = 10 A,

V

DD

= 25 Ω

R

G

V

= 48 V, ID = 20 A,

DS

V

GS

= 10 V

(Note 4, 5)

(Note 4, 5)

-- 5 20 ns

-- 11.5 15 nC

Drain-Source Diode Characteristics and Maximum Ratings

I

S

I

SM

V

SD

t

rr

Q

rr

Notes:

1. Repetitive Rating : Pulse width limited by maximum junction temperature

2. L = 800µH, IAS = 15A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C

3. ISD ≤ 20A, di/dt ≤ 300A/µs, VDD ≤ BV

4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%

5. Essentially independent of operating temperature

Maximum Continuous Drain-Source Diode Forward Current -- -- 15 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 60 A

= 0 V, IS = 15 A

Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 50 -- nC

Starting TJ = 25°C

DSS,

V

GS

= 0 V, IS = 20 A,

V

GS

/ dt = 100 A/µs

dI

F

-- -- 1.5 V

-- 43 -- ns

(Note 4)

Rev. A1. May 2001©2001 Fairchild Semiconductor Corporation

Typical Characteristics

FQPF20N06

V

GS

Top : 15.0 V

10.0 V

8.0 V

7.0 V

6.0 V

5.5 V
Botto m : 5 .0 V

1

10

, Drain Current [A]

D

I

"

Note s :

1. 250#s Pulse Test

!

= 25

2. T

0

10

-1

10

C

0

10

VDS, Drain-Source Voltage [V]

100

80

],

60

$

VGS = 20V

VGS = 10V

[m

40

DS(ON)

R

20

Drain-Source On-Resistance

0

0 102030405060

"

Note : T

ID, Drain Current [A]

1

10

0

10

!

175

, Drain Current [A]

D

I

!

25

!

-55

-1

1

10

10

246810

"

Notes :

= 25V

1. V

DS

2. 250#s Pulse Test

VGS, Gate-Source Voltage [V]

Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s

1

10

0

10

, Reverse Drain Current [A]

DR

!

= 25

J

I

10

!

175

-1

0.2 0.4 0.6 0.8 1.0 1.2 1.4

!

25

"

Notes :

= 0V

1. V

GS

2. 250#s Pulse Test

VSD, Source-Drain voltage [V]

Figure 3. On-Resistance Variati on vs.

Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage

Variation vs. Source Current

and Temperature

VDS = 30V

VDS = 48V

"

Note : I

D

= 20A

Capacitance [pF]

1200

C

= Cgs + Cgd (Cds = shorted)

iss

C

= Cds + C

oss

gd

C

= C

rss

gd

800

400

0

-1

10

C

oss

C

iss

C

rss

0

10

10

"

1. V

2. f = 1 M H z

1

Notes :

= 0 V

GS

VDS, Drain-Source Voltage [V]

12

10

8

6

4

2

, Gate-Source Voltage [V]

GS

V

0

024681012

QG, Total Gate Charge [nC]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics

©2001 Fairchild Semiconductor Corporation Rev. A1. May 2001