Fairchild FQP70N10 service manual

FQP70N10

FQP70N10

100V N-Channel MOSFET

August 2000

QFET

QFET

QFETQFET

TM

General Description

These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as audio amplifier,
high efficiency switching DC/DC converters, and DC motor
control.

G

SD

Absolute Maximum Ratings T

Symbol Parameter FQP70N10 Units

V

DSS

I

D

I

DM

V

GSS

E

AS

I

AR

E

AR

dv/dt Peak Diode Recovery dv/dt
P

D

T

, T

J

STG

T

L

Drain-Source Voltage 100 V
Drain Current

Drain Current - Pulsed
Gate-Source Voltage ± 25 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy

Power Dissipation (TC = 25°C)

Operating and Storage Temperature Range -55 to +175 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds

- Continuous (T

- Continuous (T

- Derate above 25°C 1.06 W/°C

TO-220

FQP Series

= 25°C unless otherwise noted

C

= 25°C)

C

= 100°C)

C

Features

• 57A, 100V, R

• Low gate charge ( typical 85 nC)

• Low Crss ( typical 150 pF)

• Fast switching

• 100% avalanche tested

• Improved dv/dt capability

• 175°C maximum junction temperature rating

(Note 1)

(Note 2)
(Note 1)
(Note 1)
(Note 3)

= 0.023Ω @VGS = 10 V

DS(on)

D

!

!

"

"

"

"

!

!

"

!

!

G

"
"

"

!

!

S

57 A

40.3 A
228 A

1300 mJ

57 A
16 mJ

6.0 V/ns

160 W

300 °C

Thermal Characteristics

Symbol Parameter Typ Max Units

R

θJC

R

θCS

R

θJA

©2000 Fairchild Semiconductor International

Thermal Resistance, Junction-to-Case -- 0.94 °C/W
Thermal Resistance, Case-to-Sink 0.5 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W

Rev. B, August 2000

FQP70N10

Electrical Characteristics T

= 25°C unless otherwise noted

C

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV

DSS

∆BV

DSS

/ ∆T
I

DSS

I

GSSF

I

GSSR

Drain-Source Breakdown Voltage
Breakdown Voltage Temperature

Coefficient

J

Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward

Gate-Body Leakage Current, Reverse

= 0 V, ID = 250 µA

V

GS

I

= 250 µA, Referenced to 25°C

D

V

= 100 V, VGS = 0 V

DS

V

= 80 V, TC = 150°C

DS

V

= 25 V, VDS = 0 V

GS

= -25 V, VDS = 0 V

V

GS

100 -- -- V

-- 0.1 -- V/°C

-- -- 1 µA

-- -- 10 µA

-- -- 100 nA

-- -- -100 nA

On Characteristics

V
R

g

FS

GS(th)

DS(on)

Gate Threshold Voltage
Static Drain-Source

On-Resistance
Forward Transconductance

V

= VGS, ID = 250 µA

DS

= 10 V, ID = 28.5 A

V

GS

= 40 V, ID = 28.5 A

V

DS

(Note 4)

2.0 -- 4.0 V

-- 0.019 0.023 Ω

-- 45 -- S

Dynamic Characteristics

C

iss

C

oss

C

rss

Input Capacitance
Output Capacitance -- 720 940 pF
Reverse Transfer Capacitance -- 150 200 pF

= 25 V, VGS = 0 V,

V

DS

f = 1.0 MHz

-- 2500 3300 pF

Switching Characteristics

t

d(on)

t

r

t

d(off)

t

f

Q
Q
Q

g
gs
gd

Turn-On Delay Time
Turn-On Rise Time -- 470 950 ns
Turn-Off Delay Time -- 130 270 ns
Turn-Off Fall Time -- 160 330 n s
Total Gate Charge
Gate-Source Charge -- 16 -- nC
Gate-Drain Charge -- 42 -- nC

= 50 V, ID = 70 A,

V

DD

= 25 Ω

R

G

V

= 80 V, ID = 70 A,

DS

V

GS

= 10 V

(Note 4, 5)

(Note 4, 5)

-- 30 70 ns

-- 85 110 nC

Drain-Source Diode Characteristics and Maximum Ratings

I

S

I

SM

V

SD

t

rr

Q

rr

Notes:

1. Repetitive Rating : Pulse width limited by maximum junction temperature

2. L = 0.6mH, IAS = 57A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C

3. ISD ≤ 70A, di/dt ≤ 300A/µs, VDD ≤ BV

4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%

5. Essentially independent of operating temperature

©2000 Fairchild Semiconductor International

Maximum Continuous Drain-Source Diode Forward Current -- -- 57 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 228 A

= 0 V, IS = 57 A

Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 430 -- nC

Starting TJ = 25°C

DSS,

V

GS

= 0 V, IS = 70 A,

V

GS

/ dt = 100 A/µs

dI

F

-- -- 1.5 V

-- 110 -- ns

(Note 4)

Rev. B, August 2000

Typical Characteristics

FQP70N10

V

GS

Top : 15.0 V

10.0 V

2

10

8.0 V

7.0 V

6.0 V

5.5 V

5.0 V
Bottom : 4.5 V

1

10

, Drain Current [A]

D

I

0

10

-1

10

0

10

※

Notes :

1. 250μs Pulse Test

2. T

10

VDS, Drain-Source Voltage [V]

80

64

],

Ω

48

[m

DS(ON)

32

R

Drain-Source On-Resistance

16

0

0 60 120 180 240 300

VGS = 10V

VGS = 20V

※

ID , Drai n Curren t [A]

= 25

C

1

Note : T

2

10

1

10

℃

175

℃

25

0

10

, Dra in Curre n t [A ]

D

I

℃

-1

10

246810

℃

-55

※

Note s :

1. V

= 40V

DS

2. 250μs Pulse Test

VGS , Gate-Source Voltage [V]

Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s

2

10

1

10

0

10

, Reverse Drain Current [A]

DR

℃

I

= 25

J

-1

10

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

℃

℃

25

175

※

Notes :

1. V

= 0V

GS

2. 250μs Pulse Tes t

VSD , Source-Drain Voltage [V]

Figure 3. On-Resistance Variati on vs.

Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage

Variation vs. Source Current

and Temperature

VDS = 50V

VDS = 80V

※

Note : I

7000

6000

5000

4000

3000

2000

Capacitance [pF]

1000

0

-1

10

C

= Cgs + Cgd (Cds = shorted)

iss

= Cds + C

C

oss

gd

C

= C

rss

gd

C

iss

C

oss

C

rss

0

10

10

1

※

Notes :

= 0 V

1. V

GS

2. f = 1 MHz

VDS, Drain-Source Voltage [V]

12

10

8

6

4

, Gate-Source Voltage [V]

2

GS

V

0

01020

30 40 50 60 70 80 90 100

QG, Tota l Gate Charge [n C]

Figure 5. Capacitance C haracteristics Figure 6. Gate Charge Characteristics

D

= 70A

Rev. B, August 2000©2000 Fairchild Semiconductor International