Fairchild FQP15P12, FQPF15P12 service manual

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FQP15P12/FQPF15P12
120V P-Channel MOSFET
FQP15P12/FQPF15P12
®
QFET
General Description
Features
• -15A, -120V, R
• Low gate charge ( typical 29 nC)
• Low Crss ( typical 110 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating
= 0.2 @VGS = -10 V
DS(on)
high efficiency switching DC/DC converters, and DC motor control.
S
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D
G
D
S
TO-220
FQP Series
Absolute Maximum Ratings T
GSD
= 25°C unless otherwise noted
C
TO-220F
FQPF Series
G
!!!!
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Symbol Parameter FQP15P12 FQPF15P12 Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt P
D
Drain-Source Voltage -120 V Drain Current
- Continuous (T
- Continuous (T
Drain Current - Pulsed
= 25°C)
C
= 100°C)
C
(Note 1)
-15 -15 * A
-10.6 -10.6 * A
-60 -60 * A Gate-Source Voltage ± 30 V Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy
Power Dissipation (TC = 25°C)
(Note 2) (Note 1) (Note 1) (Note 3)
1157 mJ
-15 A 10 mJ
-5.0 V/ns
100 41 W
- Derate above 25°C 0.67 0.27 W/°C
T
, T
J
STG
T
L
* Drain current limited by maximum junction temperature.
Operating and Storage Temperature Range -55 to +175 °C Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
300 °C
Thermal Characteristics
Symbol Parameter FQP15P12 FQPF15P12 Units
R
θJC
R
θJS
R
θJA
©2003 Fairchild Semiconductor Corporation Rev. A, December 2003
Thermal Resistance, Junction-to-Case 1.5 3.66 °C/W Thermal Resistance, Case-to-Sink Typ. 40 -- °C/W Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W
FQP15P12/FQPF15P12
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
BV / ∆T I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 µA
V
GS
I
= -250 µA, Referenced to 25°C
D
V
= -120 V, VGS = 0 V
DS
V
= -96 V, TC = 150°C
DS
V
= -30 V, VDS = 0 V
GS
= 30 V, VDS = 0 V
V
GS
-120
-- -- V
-- -0.13 -- V/°C
-- -- -1 µA
-- -- -10 µA
-- -- -100 nA
-- -- 100 nA
On Characteristics
V R
g
FS
GS(th)
DS(on)
Gate Threshold Voltage Static Drain-Source
On-Resistance Forward Transconductance
V
= VGS, ID = -250 µA
DS
= -10 V, ID = -7.5 A
V
GS
= -40 V, ID = -7.5 A
V
DS
(Note 4)
-2.0 -- -4.0 V
-- 0.17 0.2
-- 9.5 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance -- 310 400 pF Reverse Transfer Capacitance -- 110 140 pF
= -25 V, VGS = 0 V,
V
DS
f = 1.0 MHz
-- 850 1100 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q Q Q
g gs gd
Turn-On Delay Time Turn-On Rise Time -- 100 210 ns Turn-Off Delay Time -- 80 170 ns Turn-Off Fall Time -- 8 0 170 ns Total Gate Charge Gate-Source Charge -- 5.1 -- nC Gate-Drain Charge -- 15 -- nC
= -60 V, ID = -15 A,
V
DD
= 25
R
G
(Note 4, 5)
V
= -96 V, ID = -15 A,
DS
V
GS
(Note 4, 5)
= -10 V
-- 15 40 ns
-- 29 38 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 6.0mH, IAS = -15A, VDD = -50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD -15A, di/dt 300A/µs, VDD BV
4. Pulse Test : Pulse width 300µs, Duty cycle 2%
5. Essentially independent of operating temperature
Maximum Continuous Drain-Source Diode Forward Current -- -- -15 A Maximum Pulsed Drain-Source Diode Forward Current -- -- -60 A
= 0 V, IS = -15 A
Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge -- 0.61 -- µC
Starting TJ = 25°C
DSS,
V
GS
= 0 V, IS = -15 A,
V
GS
/ dt = 100 A/µs
dI
F
(Note 4)
-- -- -4.0 V
-- 126 -- ns
Rev. A, December 2003©2003 Fairchild Semiconductor Corporation
Typical Characteristics
FQP15P12/FQPF15P12
2
10
V
GS
Top : -15 .0 V
-10.0 V
-8.0 V
-7.0 V
-6.0 V
-5.5 V
1
10
-5.0 V Botto m : -4.5 V
0
10
, Drain Current [A]
D
-I
-1
10
-1
10
0
10
$
Notes :
1. 250%s Pulse Test
&
2. TC = 25
1
10
-VDS, Drain -S o urce V o lta g e [V]
1.0
0.9
0.8
0.7
],
0.6
'
[
0.5
DS(ON)
0.4
R
0.3
0.2
Drain-Source On-Resistance
0.1
0.0 0 204060
VGS = -10V
$
VGS = -20V
Note : T
&
= 25
J
-ID, Drain C urrent [A ]
2
10
1
10
175oC
25oC
0
10
, Drain Current [A]
D
-I
-1
10
246810
-55oC
$
Notes :
1. V
= -40V
DS
2. 250%s Pulse Test
-VGS, Gate-Source Voltage [V]
Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i stic s
1
10
&
&
175
0
10
, Reverse Drain Current [A]
DR
-I
-1
10
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
25
$
Notes :
1. V
= 0V
GS
2. 250%s Pulse Test
-VSD, Source-Drain voltage [V]
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
VDS = -30V
$
Note : I
2200 2000 1800 1600 1400 1200 1000
800
Capacitance [pF]
600 400 200
0
10
C
oss
C
iss
C
-1
C
= Cgs + Cgd (Cds = shorted)
iss
C
= Cds + C
oss
gd
C
= C
rss
gd
$
Notes ;
1. V
= 0 V
GS
2. f = 1 MHz
rss
0
10
1
10
-VDS, Drain-Source Voltage [V]
12
10
VDS = -60V
8
VDS = -96V
6
4
, Ga te -S o u rc e V o lta g e [V]
2
GS
-V
0
0 10203040
QG, Tot al Ga te C h ar g e [n C]
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Ch a ra ct eristics
= -15A
D
Rev. A, December 2003©2003 Fairchild Semiconductor Corporation
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