FQH44N10_F133
100V N-Channel MOSFET
FQH44N10_F133
Octorber 2008
®
QFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as audio amplifier,
high efficiency switching DC/DC converters, and DC motor
control.
G
D
S
Absolute Maximum Ratings T
Symbol Parameter FQH44N10_F133 Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
T
, T
J
STG
T
L
Drain-Source Voltage 100 V
Drain Current
Drain Current - Pulsed
Gate-Source Voltage ± 25 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Power Dissipation (TC = 25°C)
Operating and Storage Temperature Range -55 to +175 °C
Maximum lead temperature for soldering purposes,
1/8∀ from case for 5 seconds
- Continuous (T
- Continuous (T
- Derate above 25°C 1.2 W/°C
TO-247
FQH Series
= 25°C unless otherwise noted
C
= 25°C)
C
= 100°C)
C
Features
• 48A, 100V, R
• Low gate charge ( typical 48 nC)
• Low Crss ( typical 85 pF)
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating
G
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
= 0.039Ω @VGS = 10 V
DS(on)
D
S
48 A
34 A
192 A
530 mJ
48 A
18 mJ
6.0 V/ns
180 W
300 °C
Thermal Characteristics
Symbol Parameter Typ Max Units
R
θJC
R
θCS
R
θJA
©2008 Fairchild Semiconductor Corporation Rev. A, October 2008
Thermal Resistance, Junction-to-Case -- 0.83 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
1
FQH44N10_F133
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
ΔBV
/ ΔT
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
DSS
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 μA
V
GS
I
= 250 μA, Referenced to 25°C
D
V
= 100 V, VGS = 0 V
DS
V
= 80 V, TC = 150°C
DS
= 25 V, VDS = 0 V
V
GS
= -25 V, VDS = 0 V
V
GS
100 -- -- V
-- 0.1 -- V/°C
-- -- 1 μA
-- -- 10 μA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Forward Transconductance
= VGS, ID = 250 μA
V
DS
V
= 10 V, ID = 24 A
GS
= 40 V, ID = 24 A (Note 4)
V
DS
2.0 -- 4.0 V
-- 0.03 0.039 Ω
-- 31 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance -- 425 550 pF
Reverse Transfer Capacitance -- 85 110 pF
V
= 25 V, VGS = 0 V,
DS
f = 1.0 MHz
-- 1400 1800 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time -- 190 390 ns
Turn-Off Delay Time -- 90 190 ns
Turn-Off Fall Time -- 100 210 ns
Total Gate Charge
Gate-Source Charge -- 9.0 -- nC
Gate-Drain Charge -- 24 -- nC
= 50 V, ID = 43.5 A,
V
DD
R
= 25 Ω
G
(N ote 4 , 5)
V
= 80 V, ID = 43.5 A,
DS
= 10 V
V
GS
(Note 4, 5)
-- 19 45 ns
-- 48 62 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 0.345mH, I
3. I
SD
4. Pulse Test : Pulse width ≤ 300μs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
©2008 Fairchild Semiconductor Corporation
Maximum Continuous Drain-Source Diode Forward Current -- -- 48 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 192 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 360 -- nC
= 48A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C
≤ 43.5A, di/dt ≤ 300A/μs, VDD ≤ BV
AS
Starting TJ = 25°C
DSS,
= 0 V, IS = 48 A
V
GS
V
= 0 V, IS = 43.5 A,
GS
/ dt = 100 A/μs (Not e 4)
dI
F
2
-- -- 1.5 V
-- 98 -- ns
Rev. A, October 2008
Typical Characteristics
FQH44N10_F133
V
GS
Top : 15.0 V
2
10.0 V
10
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
1
10
, Drain Current [A]
D
I
0
10
-1
10
0
10
1. 250レs Pulse Test
2. T
VDS, Drain-Source Voltage [V]
0.15
0.12
0.09
[Ω],
DS(on)
R
0.06
Drain-Source On-Resistance
0.03
0.00
0 30 60 90 120 150 180
VGS = 10V
VGS = 20V
ID , Drain Current [ A]
Notes :∝
= 25∩
C
10
1
Note : T∝J = 25∩
2
10
1
10
175∩
25∩
0
10
, Drain Current [A]
D
I
-1
10
246810
-55∩
Notes :∝
1. VDS = 40V
2. 250
レs Pulse Test
VGS , Gate-Source Voltage [V]
Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics
2
10
1
10
0
10
, Reverse Drain Current [A]
DR
I
-1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
175∩
25∩
Notes :∝
1. VGS = 0V
2. 250
レs Pulse Test
VSD , Source-Drai n Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
4000
3500
3000
2500
2000
1500
Capacitance [pF]
1000
500
0
-1
10
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
gd
C
= C
rss
gd
C
iss
C
oss
C
rss
0
10
10
1
Notes :∝
1. VGS = 0 V
2. f = 1 MHz
VDS, Drai n-Source Vol tage [ V]
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
0 1020304050
QG, Total Gate Charge [nC]
VDS = 50V
VDS = 80V
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
3
Note : I∝D = 43.5A
Rev. A, October 2008©2008 Fairchild Semiconductor Corporation