Fairchild FQH44N10 service manual

FQH44N10_F133

100V N-Channel MOSFET

FQH44N10_F133
Octorber 2008
®
QFET
General Description
G
D
S
Absolute Maximum Ratings T
Symbol Parameter FQH44N10_F133 Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt P
D
T
, T
J
STG
T
L
Drain-Source Voltage 100 V
Drain Current
Drain Current - Pulsed
Gate-Source Voltage ± 25 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Power Dissipation (TC = 25°C)
Operating and Storage Temperature Range -55 to +175 °C
Maximum lead temperature for soldering purposes, 1/8 from case for 5 seconds
- Continuous (T
- Continuous (T
- Derate above 25°C 1.2 W/°C
TO-247
FQH Series
= 25°C unless otherwise noted
C
= 25°C)
C
= 100°C)
C
Features
• 48A, 100V, R
• Low gate charge ( typical 48 nC)
• Low Crss ( typical 85 pF)
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating
G
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
= 0.039Ω @VGS = 10 V
DS(on)
D
S
48 A
34 A
192 A
530 mJ
48 A
18 mJ
6.0 V/ns
180 W
300 °C
Thermal Characteristics
Symbol Parameter Typ Max Units
R
θJC
R
θCS
R
θJA
©2008 Fairchild Semiconductor Corporation Rev. A, October 2008
Thermal Resistance, Junction-to-Case -- 0.83 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
1
FQH44N10_F133
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
ΔBV / ΔT
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
DSS
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 μA
V
GS
I
= 250 μA, Referenced to 25°C
D
V
= 100 V, VGS = 0 V
DS
V
= 80 V, TC = 150°C
DS
= 25 V, VDS = 0 V
V
GS
= -25 V, VDS = 0 V
V
GS
100 -- -- V
-- 0.1 -- V/°C
-- -- 1 μA
-- -- 10 μA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
= VGS, ID = 250 μA
V
DS
V
= 10 V, ID = 24 A
GS
= 40 V, ID = 24 A (Note 4)
V
DS
2.0 -- 4.0 V
-- 0.03 0.039 Ω
-- 31 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance -- 425 550 pF
Reverse Transfer Capacitance -- 85 110 pF
V
= 25 V, VGS = 0 V,
DS
f = 1.0 MHz
-- 1400 1800 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time -- 190 390 ns
Turn-Off Delay Time -- 90 190 ns
Turn-Off Fall Time -- 100 210 ns
Total Gate Charge
Gate-Source Charge -- 9.0 -- nC
Gate-Drain Charge -- 24 -- nC
= 50 V, ID = 43.5 A,
V
DD
R
= 25 Ω
G
(N ote 4 , 5)
V
= 80 V, ID = 43.5 A,
DS
= 10 V
V
GS
(Note 4, 5)
-- 19 45 ns
-- 48 62 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 0.345mH, I
3. I
SD
4. Pulse Test : Pulse width 300μs, Duty cycle 2%
5. Essentially independent of operating temperature
©2008 Fairchild Semiconductor Corporation
Maximum Continuous Drain-Source Diode Forward Current -- -- 48 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 192 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 360 -- nC
= 48A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C
43.5A, di/dt 300A/μs, VDD BV
AS
Starting TJ = 25°C
DSS,
= 0 V, IS = 48 A
V
GS
V
= 0 V, IS = 43.5 A,
GS
/ dt = 100 A/μs (Not e 4)
dI
F
2
-- -- 1.5 V
-- 98 -- ns
Rev. A, October 2008
Typical Characteristics
FQH44N10_F133
V
GS
Top : 15.0 V
2
10.0 V
10
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V Bottom : 4.5 V
1
10
, Drain Current [A]
D
I
0
10
-1
10
0
10
1. 250レs Pulse Test
2. T
VDS, Drain-Source Voltage [V]
0.15
0.12
0.09
[Ω],
DS(on)
R
0.06
Drain-Source On-Resistance
0.03
0.00 0 30 60 90 120 150 180
VGS = 10V
VGS = 20V
ID , Drain Current [ A]
Notes :
= 25
C
10
1
Note : TJ = 25
2
10
1
10
175
25
0
10
, Drain Current [A]
D
I
-1
10
246810
-55
Notes :
1. VDS = 40V
2. 250
s Pulse Test
VGS , Gate-Source Voltage [V]

Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics

2
10
1
10
0
10
, Reverse Drain Current [A]
DR
I
-1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
175
25
Notes :
1. VGS = 0V
2. 250
s Pulse Test
VSD , Source-Drai n Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
4000
3500
3000
2500
2000
1500
Capacitance [pF]
1000
500
0
-1
10
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
gd
C
= C
rss
gd
C
iss
C
oss
C
rss
0
10
10
1
Notes :
1. VGS = 0 V
2. f = 1 MHz
VDS, Drai n-Source Vol tage [ V]
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
0 1020304050
QG, Total Gate Charge [nC]
VDS = 50V
VDS = 80V

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

3
Note : ID = 43.5A
Rev. A, October 2008©2008 Fairchild Semiconductor Corporation
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