Fairchild FQB44N10, FQI44N10 service manual

FQB44N10 / FQI44N10
100V N-Channel MOSFET
October 2008
QFET
®
General Description
These N-Channel enhancement mode power field effect
FQB44N10 / FQI44N10
transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as audio amplifier, high efficiency switching DC/DC converters, and DC motor
Features
• 43.5A, 100V, R
• Low gate charge ( typical 48 nC)
• Low Crss ( typical 85 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating
• RoHS Compliant
= 0.039Ω @VGS = 10 V
DS(on)
control.
D
!
!
G
S
D2-PAK
FQB Series
G
D
Absolute Maximum Ratings T
S
= 25°C unless otherwise noted
C
I2-PAK
FQI Series
G
Symbol Parameter FQB44N10 / FQI44N10 Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt P
D
Drain-Source Voltage 100 V Drain Current
- Continuous (T
- Continuous (T
Drain Current - Pulsed
= 25°C)
C
= 100°C)
C
(Note 1)
43.5 A
30.8 A 174 A
Gate-Source Voltage ± 25 V Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy
Power Dissipation (TA = 25°C) * Power Dissipation (T
= 25°C)
C
(Note 2) (Note 1) (Note 1) (Note 3)
530 mJ
43.5 A
14.6 mJ
6.0 V/ns
3.75 W 146 W
- Derate above 25°C 0.97 W/°C
, T
T
J
STG
T
L
Operating and Storage Temperature Range -55 to +175 °C Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
300 °C
!
!
D
!
!
"
"
"
"
"
" "
"
!
!
S
Thermal Charac teristics
Symbol Parameter Typ Max Units
R
θJC
R
θJA
R
θJA
* When mounted on the minimum pad size recommended (PCB Mount)
©2008 Fairchild Semiconductor International Rev. A1, Oct 2008
Thermal Resistance, Junction-to-Case -- 1.03 °C/W Thermal Resistance, Junction-to-Ambient * -- 40 °C/W Thermal Resistance, Junction-to-Ambient -- 62.5 °C/W
FQB44N10 / FQI44N10
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter T e s t Conditions Min Typ Max Units
Off Characteristics
BV BV / ∆T I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
DSS
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
V
= 0 V, ID = 250 µA
GS
= 250 µA, Referenced to 25°C
I
D
V
= 100 V, VGS = 0 V
DS
= 80 V, TC = 150°C
V
DS
V
= 25 V, VDS = 0 V
GS
V
= -25 V, VDS = 0 V
GS
100 -- -- V
-- 0.1 -- V/°C
-- -- 1 µA
-- -- 10 µA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V R
g
FS
GS(th)
DS(on)
Gate Threshold Voltage Static Drain-Source
On-Resistance Forward Transconductance
V
= VGS, ID = 250 µA
DS
= 10 V, ID = 21.75 A
V
GS
V
= 40 V, ID = 21.75 A
DS
(Note 4)
2.0 -- 4.0 V
-- 0.03 0.039
-- 30 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance -- 425 550 pF Reverse Transfer Capacitance -- 85 110 pF
= 25 V, VGS = 0 V,
V
DS
f = 1.0 MHz
-- 1400 1800 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q Q Q
g gs gd
Turn-On Delay Time Turn-On Rise Time -- 190 390 ns Turn-Off Delay Time -- 90 190 ns Turn-Off Fall Time -- 100 21 0 n s Total Gate Charge Gate-Source Charge -- 9.0 -- nC Gate-Drain Charge -- 24 -- nC
V
= 50 V, ID = 43.5 A,
DD
R
= 25
G
V
= 80 V, ID = 43.5 A,
DS
V
GS
= 10 V
(Note 4, 5)
(Note 4, 5)
-- 19 45 ns
-- 48 62 nC
Drain-So urce Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 0.42mH, IAS = 43.5A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C
3. ISD 43.5A, di/dt 300A/µs, VDD BV
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
©2008 Fairchild Semiconductor International
Maximum Continuous Drain-Source Diode Forward Current -- -- 43.5 A Maximum Pulsed Drain-Source Diode Forward Current -- -- 174 A
V
Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge -- 360 -- nC
Starting TJ = 25°C
DSS,
= 0 V, IS = 43.5 A
GS
= 0 V, IS = 43.5 A,
V
GS
dI
/ dt = 100 A/µs
F
-- -- 1.5 V
-- 98 -- ns
(Note 4)
Rev. A1, Oct 2008
Typical Characteristics
V
GS
Top : 15.0 V
2
10
10.0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V Bottom : 4.5 V
1
10
FQB44N10 / FQI44N10
, Drain Current [A]
D
I
0
10
-1
10
0
10
Notes :
1. 250μs Pulse Test
2. T
= 25
C
1
10
VDS, Drain-Source Voltage [V]
2
10
1
10
10
, Dra in Curre n t [A ]
D
I
10
175
25
0
-1
246810
VGS , Gate-Source Voltage [V]
-55
Note s :
1. V
= 40V
DS
2. 250μs Pulse Test
Figure 2. Transfer CharacteristicsFigure 1. On-Region Char act er i st ics
0.15
0.12
],
0.09
[
DS(on)
R
0.06
Drain-Source On-Resistance
0.03
0.00 0 30 60 90 120 150 180
VGS = 10V
VGS = 20V
ID , Drain Curren t [A ]
Note : T
2
10
1
10
0
10
, Reverse Drain Current [A]
DR
I
= 25
J
175
-1
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
25
VSD , Source-Drain Voltage [V]
Notes :
1. V
= 0V
GS
2. 250μs Pulse Te st
Figure 3. On-Resistance Variati on vs .
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
4000
3500
3000
2500
2000
1500
Capacitance [pF]
1000
500
0
-1
10
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
gd
C
= C
rss
gd
C
iss
C
oss
C
rss
0
10
10
1
Notes :
1. V
= 0 V
GS
2. f = 1 MH z
VDS, Drain-Source Voltage [V]
12
10
8
6
4
, Gate-Source Voltage [V]
2
GS
V
0
01020304050
QG, Tota l Gate Charge [n C]
VDS = 50V
VDS = 80V
Note : I
Figure 5. Capacitance C haracteristics Figure 6. Gate Charge Characteristics
= 43.5A
D
Rev. A1, Oct 2008©2008 Fairchild Semiconductor International
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