Fairchild FQA28N15 service manual

{
{
{
z
z
z
{
{
{
z
z
z

150V N-Channel MOSFET

FQA28N15 150V N-Channel MOSFET
April 2011
TM
QFET

General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for low voltage applications such as audio amplifire,

Features

• 33A, 150V, R
• Low gate charge ( typical 40 nC)
• Low Crss ( typical 50 pF)
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating
= 0.09Ω @VGS = 10 V
DS(on)
high efficiency switching for DC/DC converters, and DC motor control, uninterrupted power supply.
D
G
TO-3PN
GSD
Absolute Maximum Ratings T
= 25°C unless otherwise noted
C
Symbol Parameter FQA28N15 Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt P
D
Drain-Source Voltage 150 V
Drain Current
- Continuous (T
- Continuous (T
Drain Current - Pulsed
= 25°C)
C
= 100°C)
C
(Note 1)
Gate-Source Voltage ± 25 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Power Dissipation (TC = 25°C)
- Derate above 25°C 1.52 W/°C
T
, T
J
STG
T
L
Operating and Storage Temperature Range -55 to +175 °C
Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds
S
33 A
23.3 A
132 A
300 mJ
33 A
22.7 mJ
5.5 V/ns
227 W
300 °C

Thermal Characteristics

Symbol Parameter Typ Max Units
R
θJC
R
θCS
R
θJA
©2011 Fairchild Semiconductor Corporation FQA28N15 Rev. A1
Thermal Resistance, Junction-to-Case -- 0.66 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
1
www.fairchildsemi.com
Package Marking and Ordering Information

Device Marking Device Package Reel Size Tape Width Quantity

FQA28N15 FQA28N15 TO-3PN - - 30
FQA28N15 150V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV
DSS
ΔBV
DSS
/ ΔT
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 μA
V
GS
I
= 250 μA, Referenced to 25°C
D
V
= 150 V, VGS = 0 V
DS
V
= 120 V, TC = 150°C
DS
= 25 V, VDS = 0 V
V
GS
= -25 V, VDS = 0 V
V
GS
150 -- -- V
-- 0.17 -- V/°C
-- -- 1 μA
-- -- 10 μA
-- -- 100 nA
-- -- -100 nA

On Characteristics

V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
= VGS, ID = 250 μA
V
DS
= 10 V, ID = 16.5 A
V
GS
= 40 V, ID = 16.5 A
V
DS
2.0 -- 4.0 V
-- 0.067 0.09 Ω
-- 20 -- S

Dynamic Characteristics

C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance -- 260 340 pF
Reverse Transfer Capacitance -- 50 65 pF
V
= 25 V, VGS = 0 V,
DS
f = 1.0 MHz
(Note 4)
-- 1250 1600 pF

Switching Characteristics

t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time -- 180 370 ns
= 75 V, ID = 28 A,
V
DD
= 25 Ω
R
G
-- 17 45 ns
Turn-Off Delay Time -- 100 210 ns
Turn-Off Fall Time -- 115 240 ns
Total Gate Charge
Gate-Source Charge -- 7.9 -- nC
Gate-Drain Charge -- 20 -- nC
V
= 120 V, ID = 28 A,
DS
= 10 V
V
GS
(Note 4,5)
(Note 4,5)
-- 40 52 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 0.46mH, IAS = 33A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C
3. ISD 28A, di/dt 300A/us, VDD BV
4. Pulse Test : Pulse width ≤ 300μs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
FQA28N15 Rev. A1
Maximum Continuous Drain-Source Diode Forward Current -- -- 33 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 132 A
= 0 V, IS = 33 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 0.4 -- μC
Starting TJ = 25°C
DSS,
V
GS
V
= 0 V, IS = 28 A,
GS
/ dt = 100 A/μs (Note 4)
dI
F
2
-- -- 1.5 V
-- 100 -- ns
www.fairchildsemi.com
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
10
-1
10
0
10
1
10
2
175
Notes :
1. VGS = 0V
2. 250
s Pulse Test
25
I
DR
, Reverse Drain Current [A]
VSD, Source- Drain vol tage [V]
246810
10
-1
10
0
10
1
10
2
175
25
-55
Notes :
1. VDS = 40V
2. 250
s Pulse Test
I
D
, Drain Current [A]
VGS, Gate-Source Voltage [V]
10
-1
10
0
10
1
10
0
10
1
10
2
V
GS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V Bottom : 4.5 V
Notes :
1. 250レs Pulse Test
2. T
C
= 25
I
D
, Drain Current [A]
VDS, Drai n-Source Vol tage [V]
0 9 18 27 36 45
0
2
4
6
8
10
12
VDS = 75V
VDS = 30V
VDS = 120V
Note : ID = 28 A
V
GS
, Gate-Source Voltage [V]
QG, Total Gate Charge [nC]
10
-1
10
0
10
1
0
500
1000
1500
2000
2500
3000
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
Notes :
1. VGS = 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capacitance [pF]
VDS, Drai n-Source Volt age [V]
0 20406080100
0
60
120
180
240
300
Note : TJ = 25
VGS = 20V
VGS = 10V
R
DS(ON)
[m
],
Drain-Source On-Resistance
ID , Drain Curr ent [A]

Typical Characteristics

FQA28N15 150V N-Channel MOSFET

Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics

Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
FQA28N15 Rev. A1

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
3
www.fairchildsemi.com
Loading...
+ 5 hidden pages