FQA28N15
{
{
{
z
z
z
{
{
{
z
z
z
150V N-Channel MOSFET
FQA28N15 150V N-Channel MOSFET
April 2011
TM
QFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as audio amplifire,
Features
• 33A, 150V, R
• Low gate charge ( typical 40 nC)
• Low Crss ( typical 50 pF)
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• 175°C maximum junction temperature rating
= 0.09Ω @VGS = 10 V
DS(on)
high efficiency switching for DC/DC converters, and DC
motor control, uninterrupted power supply.
D
G
TO-3PN
GSD
Absolute Maximum Ratings T
= 25°C unless otherwise noted
C
Symbol Parameter FQA28N15 Units
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt
P
D
Drain-Source Voltage 150 V
Drain Current
- Continuous (T
- Continuous (T
Drain Current - Pulsed
= 25°C)
C
= 100°C)
C
(Note 1)
Gate-Source Voltage ± 25 V
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Power Dissipation (TC = 25°C)
- Derate above 25°C 1.52 W/°C
T
, T
J
STG
T
L
Operating and Storage Temperature Range -55 to +175 °C
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
S
33 A
23.3 A
132 A
300 mJ
33 A
22.7 mJ
5.5 V/ns
227 W
300 °C
Thermal Characteristics
Symbol Parameter Typ Max Units
R
θJC
R
θCS
R
θJA
©2011 Fairchild Semiconductor Corporation
FQA28N15 Rev. A1
Thermal Resistance, Junction-to-Case -- 0.66 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
1
www.fairchildsemi.com
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FQA28N15 FQA28N15 TO-3PN - - 30
FQA28N15 150V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
ΔBV
DSS
/ ΔT
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
J
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
= 0 V, ID = 250 μA
V
GS
I
= 250 μA, Referenced to 25°C
D
V
= 150 V, VGS = 0 V
DS
V
= 120 V, TC = 150°C
DS
= 25 V, VDS = 0 V
V
GS
= -25 V, VDS = 0 V
V
GS
150 -- -- V
-- 0.17 -- V/°C
-- -- 1 μA
-- -- 10 μA
-- -- 100 nA
-- -- -100 nA
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
= VGS, ID = 250 μA
V
DS
= 10 V, ID = 16.5 A
V
GS
= 40 V, ID = 16.5 A
V
DS
2.0 -- 4.0 V
-- 0.067 0.09 Ω
-- 20 -- S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance -- 260 340 pF
Reverse Transfer Capacitance -- 50 65 pF
V
= 25 V, VGS = 0 V,
DS
f = 1.0 MHz
(Note 4)
-- 1250 1600 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
g
gs
gd
Turn-On Delay Time
Turn-On Rise Time -- 180 370 ns
= 75 V, ID = 28 A,
V
DD
= 25 Ω
R
G
-- 17 45 ns
Turn-Off Delay Time -- 100 210 ns
Turn-Off Fall Time -- 115 240 ns
Total Gate Charge
Gate-Source Charge -- 7.9 -- nC
Gate-Drain Charge -- 20 -- nC
V
= 120 V, ID = 28 A,
DS
= 10 V
V
GS
(Note 4,5)
(Note 4,5)
-- 40 52 nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 0.46mH, IAS = 33A, VDD = 25V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 28A, di/dt ≤ 300A/us, VDD ≤ BV
4. Pulse Test : Pulse width ≤ 300μs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
FQA28N15 Rev. A1
Maximum Continuous Drain-Source Diode Forward Current -- -- 33 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 132 A
= 0 V, IS = 33 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge -- 0.4 -- μC
Starting TJ = 25°C
DSS,
V
GS
V
= 0 V, IS = 28 A,
GS
/ dt = 100 A/μs (Note 4)
dI
F
2
-- -- 1.5 V
-- 100 -- ns
www.fairchildsemi.com
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
10
-1
10
0
10
1
10
2
175∩
Notes :∝
1. VGS = 0V
2. 250
レs Pulse Test
25∩
I
DR
, Reverse Drain Current [A]
VSD, Source- Drain vol tage [V]
246810
10
-1
10
0
10
1
10
2
175∩
25∩
-55∩
Notes :∝
1. VDS = 40V
2. 250
レs Pulse Test
I
D
, Drain Current [A]
VGS, Gate-Source Voltage [V]
10
-1
10
0
10
1
10
0
10
1
10
2
V
GS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
Notes :∝
1. 250レs Pulse Test
2. T
C
= 25∩
I
D
, Drain Current [A]
VDS, Drai n-Source Vol tage [V]
0 9 18 27 36 45
0
2
4
6
8
10
12
VDS = 75V
VDS = 30V
VDS = 120V
Note : I∝D = 28 A
V
GS
, Gate-Source Voltage [V]
QG, Total Gate Charge [nC]
10
-1
10
0
10
1
0
500
1000
1500
2000
2500
3000
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
Notes :∝
1. VGS = 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capacitance [pF]
VDS, Drai n-Source Volt age [V]
0 20406080100
0
60
120
180
240
300
Note : T∝J = 25∩
VGS = 20V
VGS = 10V
R
DS(ON)
[mヘ
],
Drain-Source On-Resistance
ID , Drain Curr ent [A]
Typical Characteristics
FQA28N15 150V N-Channel MOSFET
Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
FQA28N15 Rev. A1
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
3
www.fairchildsemi.com