Fairchild FDZ8040L, FDZ8040L Schematic [ru]

April 2013

FDZ8040L — Integrated Load Switch

Figure 1. Bottom View

Figure 2. Top View

Part

Number

Device

Mark

Ball

Pitch

Operating

Temperature Range

Switch

Package

Packing

Method

FDZ8040L

ZM

0.4 mm

-40 to 85°C

80 m, P-Channel

MOSFET

0.8 x 0.8 x

0.5 mm3 WLCSP

Tape & Reel

Pin 1

VOUT

GND

ON

VIN

FDZ8040L
Integrated Load Switch

Features

 Optimized for Low-Voltage Core ICs in

Portable Systems

 Very Small Package Dimension: WLCSP

0.8 X 0.8 X 0.5 mm3

 Current = 1.2 A, V
 Current = 2 A, V
 R
 R
 R
 R
 R

= 80 mΩ at VON = VIN = 4 V

DS(on)

= 85 mΩ at VON = VIN = 3.6 V

DS(on)

= 90 mΩ at VON = VIN = 3 V

DS(on)

= 360 mΩ at VON = VIN = 0.9 V

DS(on)

= 1000 mΩ at VON = VIN = 0.8 V

DS(on)

Max. = 4 V

IN

Max. = 4 V (Pulsed)

IN

 RoHS Compliant

Description

This device is particularly suited for compact power
management in portable applications needing 0.8 V to
4 V input and 1.2 A output current capability. This load
switch integrated a level-shifting function that drives a P­channel power MOSFET in a very small 0.8 X 0.8 X

0.5 mm3 WLCSP package.

Applications

 Load Switch
 Power Management in Portable Applications

Ordering Information

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FDZ8040L • Rev. C1

FDZ8040L — Integrated Load Switch

OFF

ON

VIN

VOUT

ON

GND

VIN = 0.8 -4 V C

IN

C

OUT

FDZ8040L

Figure 5. Top View (Bumps Down)

Figure 6. Bottom View (Bumps Up)

Pin #

Name

Description

A1

VIN

Supply Input: Input to the load switch

A2

VOUT

Switch Output: Output of the load switch

B1

ON

ON/OFF Control Input

B2

GND

Ground

Typical Application

Figure 3. Typical Application

Block Diagram

Pin Configuration

Pin Descriptions

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FDZ8040L • Rev. C6 2

Figure 4. Internal Block Diagram

FDZ8040L — Integrated Load Switch

Symbol

Parameter

Min.

Max.

Unit

VIN

Voltage on VIN, VOUT, ON to GND

-0.3

4.2

V

I

OUT_C

I

OUT

-Load Current (Continuous)

(1a)

1.2

A

I

OUT_P

I

OUT

-Load Current (Pulsed)

2 A

PD

Power Dissipation at TA = 25°C

(1a)

0.9

W

TA

Operating Temperature Range

-40

85

°C

T

STG

Storage Temperature

-65

150

°C

R

ΘJA

Thermal Resistance, Junction to Ambient

(1a)

135

°C/W

ESD

Electrostatic Discharge Capability
Human Body Model, JESD22-A114

8

kV

Charged Device Model, JESD22-C101

2

a. 135°C/W when mounted on a

1-inch square pad of 2-oz copper.

b. 360°C/W when mounted on a

minimum pad of 2-oz copper.

Symbol

Parameter

Min.

Max.

Unit

VIN

Voltage on VIN Pin

0.8

4.0

V

VON

Voltage on ON Pin

0.7

4.0

V

TA

Operating Temperature
Range

1 V to 4 V

-40

85

°C

0.8 V to 4 V

-10

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.

Notes:

1. RΘJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal
reference is defined as the solder mounting surface of the drain pins. RΘJC is guaranteed by design, while RΘJA
is determined by the board design.

2. Pulse test: pulse width < 300 µs; duty cycle < 2.0%.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FDZ8040L • Rev. C6 3

FDZ8040L — Integrated Load Switch

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VIN

Operation Voltage

0.8 4.0

V

VIL

ON Input Logic Low Voltage

1.6 V ≤ VIN ≤ 4.0 V

0.35

V

0.8 V ≤ VIN ≤ 1.6 V

0.25

VIH

ON Input Logic High Voltage

1.6 V ≤ VIN ≤ 4.0 V

1.0

V

0.8 V ≤ VIN ≤ 1.6 V

0.7

IQ

Quiescent Current

I

OUT

= 0 mA, VIN = VON = 1.8 V

2.1

μA

I

Q(off)

Off Supply Current

I

OUT

= 0 mA, VIN = 1.8 V, VON = GND

1

μA

I

SD(off)

Off Switch Current

VON = GND, V

OUT

= 0 V, VIN = 1.8 V

100

nA

ION

ON Input Leakage

VON = VIN or GND

1

μA

RPD

Output Discharge Pull-Down
Resistance

200 Ω

R

DS(ON)

Static Drain-Source
On-Resistance

VON = VIN = 4 V, I

OUT

= 300 mA

50

80

mΩ

VON = VIN = 3.6 V, I

OUT

= 300 mA

51

85

VON = VIN = 3 V, I

OUT

= 300 mA

54

90

V

ON

= 0.7 V, V

IN

= 1.6 V, I

OUT

= 300 mA

73

110

V

ON

= 0.7 V, V

IN

= 1 V, I

OUT

= 300 mA

140

309

V

ON

= V

IN

= 0.9 V, I

OUT

= 10 mA

186

360

V

ON

= V

IN

= 0.8 V, I

OUT

= 10 mA

348

1000

V

ON

= V

IN

= 0.9 V, I

OUT

= 10 mA,

T

J

= 10 ~ 85°C

194

370

V

ON

= V

IN

= 0.8 V, I

OUT

= 10 mA,

T

J

= 10 ~ 85°C

268

750

V

IN

= 3.6 V, I

OUT

= 300 mA, T

J

= 85°C

59

102

Electrical Characteristics

TJ = 25°C and VIN=1.8 V, unless otherwise noted.

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FDZ8040L • Rev. C6 4