January 2003
FDV305N
20V N-Channel PowerTrench MOSFET
FDV305N
General Description
This 20V N-Channel MOSFET uses Fairchild’s high
voltage PowerTrench process. It has been optimized for
power management applications.
Applications
• Load switch
• Battery protection
• Power management
Features
• 0.9 A, 20 V R
R
• Low gate charge
• Fast switching speed
• High performance trench technology for extremely
DS(ON)
low R
= 220 mΩ @ VGS = 4.5 V
DS(ON)
= 300 mΩ @ VGS = 2.5 V
DS(ON)
D
D
S
G
SOT-23
Absolute Maximum Ratings T
G
o
=25
C unless otherwise noted
A
Symbol Parameter Ratings Units
V
Drain-Source Voltage 20 V
DSS
V
Gate-Source Voltage
GSS
ID Drain Current – Continuous 0.9 A
– Pulsed 2
PD
TJ, T
STG
Maximum Power Dissipation 0.35
Operating and Storage Junction Temperature Range –55 to +150
± 12
S
V
W
°C
Thermal Characteristics
R
θJA
Thermal Resistance, Junction-to-Ambient
357
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
305 FDV305N 7’’ 8mm 3000 units
2003 Fairchild Semiconductor Corporation
°C/W
FDV305N Rev D (W)
FDV305N
Electrical Characteristics T
= 25°C unless otherwise noted
A
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
Drain–Source Breakdown Voltage
DSS
∆BVDSS
∆T
I
Zero Gate Voltage Drain Current VDS = 16 V, VGS = 0 V 1
DSS
I
GSSF
I
GSSR
Breakdown Voltage Temperature
Coefficient
J
Gate–Body Leakage, Forward VGS = 12 V, VDS = 0 V 100 nA
Gate–Body Leakage, Reverse VGS = –12 V, VDS = 0 V –100 nA
= 0 V, ID = 250 µA
V
GS
I
= 250 µA,Referenced to 25°C
D
20 V
15
mV/°C
µA
On Characteristics (Note 2)
V
Gate Threshold Voltage
GS(th)
∆VGS(th)
∆TJ
R
DS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
I
On–State Drain Current VGS = 4.5V, VDS = 5 V 1 A
D(on)
= VGS, ID = 250 µA
V
DS
I
= 250 µA,Referenced to 25°C
D
= 4.5 V, ID = 0.9 A
V
GS
= 2.5 V, ID = 0.7 A
V
GS
= 4.5V, ID = 0.9 A, TJ = 125°C
V
GS
gFS Forward Transconductance VDS = 5V, ID = 0.9 A 3 S
0.6 1 1.5 V
–3
164
235
220
220
300
303
mV/°C
mΩ
Dynamic Characteristics
C
Input Capacitance 109 pF
iss
C
Output Capacitance 30 pF
oss
C
Reverse Transfer Capacitance
rss
V
= 10 V, V
DS
f = 1.0 MHz
= 0 V,
GS
14 pF
Switching Characteristics (Note 2)
t
Turn–On Delay Time 4.5 9 ns
d(on)
tr Turn–On Rise Time 7 14 ns
t
Turn–Off Delay Time 8 16 ns
d(off)
tf Turn–Off Fall Time
Qg Total Gate Charge 1.1 1.5 nC
Qgs Gate–Source Charge 0.26 nC
Qgd Gate–Drain Charge
= 10 V, ID = 1 A,
V
DD
= 4.5 V, R
V
GS
= 10 V, ID = 0.9 A,
V
DS
= 4.5 V
V
GS
GEN
= 6 Ω
1.4 2.8 ns
0.26 nC
Drain–Source Diode Characteristics and Maximum Ratings
IS Maximum Continuous Drain–Source Diode Forward Current 0.29 A
VSD Drain–Source Diode Forward
Voltage
trr Diode Reverse Recovery Time 7.4 nS
Qrr Diode Reverse Recovery Charge
Notes:
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
VGS = 0 V, IS = 0.29 A 0.75 1.2 V
= 0.9 A,
I
F
= 100 A/µs
d
iF/dt
2.2 nC
FDV305N Rev D (W)