Fairchild FDS8978 service manual

FDS8978 N-Channel PowerTrench
30V, 7.5A, 18m
®
MOSFET
FDS8978 Dual N-Channel PowerTrench
January 2011
Features
r
r
High performance trench technology for extremely low
Low gate charge
High power and current handling capability
100% Rg Tested
RoHS Compliant
= 18mΩ, V
DS(on)
= 21mΩ, V
DS(on)
r
DS(on)
SO-8
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DSS
V
GS
I
D
E
AS
P
D
, T
T
J
STG
= 10V, ID = 7.5A
GS
= 4.5V, ID = 6.9A
GS
D2
D2
D1
D1
G2
G1
Pin 1
Drain to Source Voltage 30 V
Gate to Source Voltage ±20 V
Drain Current
Continuous (T
Continuous (T
Pulsed 49 A
Single Pulse Avalanche Energy (Note 1) 57 mJ
Power dissipation 1.6 W
Derate above 25
Operating and Storage Temperature -55 to 150
= 25oC, VGS = 10V, R
A
= 25oC, VGS = 4.5V, R
A
o
C13mW/
= 25°C unless otherwise noted
A
θJA
θJA
General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low r
and fast switching speed.
DS(on)
Applications
DC/DC converters
D2
5
6
D2
D1
D1
= 50oC/W)
= 50oC/W) 6.9 A
7
8
Q2
Q1
7.5 A
4
3
2
1
G2
G1
o
®
MOSFET
o
C
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
Thermal Resistance, Junction to Case (Note 2) 40
Thermal Resistance, Junction to Ambient (Note 2a) 78
Thermal Resistance, Junction to Ambient (Note 2c) 135
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDS8978 FDS8978 SO-8 330mm 12mm 2500 units
©2011 Fairchild Semiconductor Corporation FDS8978 Rev. B1
1
o
C/W
o
C/W
o
C/W
www.fairchildsemi.com
FDS8978 Dual N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B
VDSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V 30 - - V
V
= 24V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TJ = 150oC - - 250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(on)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA 1.2 - 2.5 V
ID = 7.5A, VGS = 10V - 14 18
Drain to Source On Resistance
ID = 6.9A, VGS = 4.5V - 17 21
I
= 7.5A, VGS = 10V,
D
TJ = 150oC
- 22 29
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
R
G
Q
g(TOT)
Q
g(5)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance - 191 - pF
Reverse Transfer Capacitance - 11 2 - pF
VDS = 15V, VGS = 0V, f = 1MHz
- 907 1270 pF
Gate Resistance VGS = 0.5V, f = 1MHz - 1.2 4.0
Total Gate Charge at 10V VGS = 0V to 10V
Total Gate Charge at 5V VGS = 0V to 5V - 9 14 nC
VDD = 15V ID = 7.5A
- 17 26 nC
Gate to Source Gate Charge - 2.3 - nC
Gate Charge Threshold to Plateau - 1.5 - nC
Gate to Drain “Miller” Charge - 3.3 - nC
µA
m
®
MOSFET
Switching Characteristics (V
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time - 7 10.5 ns
Rise Time - 37 55.5 ns
Turn-Off Delay Time - 48 72 ns
Fall Time - 24 36 ns
Turn-Off Time - 72 108 ns
GS
= 10V)
- 44 66 ns
VDD = 15V, ID = 7.5A VGS = 10V, RGS = 16
Drain-Source Diode Characteristics
I
= 7.5A - - 1.25 V
V
SD
t
rr
Q
RR
Notes:
1: Starting TJ = 25°C, L = 1mH, IAS = 7.5A, VDD = 30V, VGS = 10V. 2: R
θJA
drain pins. R
a) 78°C/W when mounted on a 0.5 in
b) 125°C/W when mounted on a 0.02 in2 pad of 2 oz copper. c) 135°C/W when mounted on a minimun pad.
Source to Drain Diode Voltage
Reverse Recovery Time ISD = 7.5A, dISD/dt = 100A/µs - 19 25 ns
Reverse Recovered Charge ISD = 7.5A, dISD/dt = 100A/µs - 10 13 nC
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
is guaranteed by design while R
θJC
2
pad of 2 oz copper.
is determined by the user’s board design.
θJA
SD
I
= 2.1A - - 1.0 V
SD
©2011 Fairchild Semiconductor Corporation FDS8978 Rev. B1
www.fairchildsemi.com2
FDS8978 Dual N-Channel PowerTrench
Typical Characteristics T
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
TA, AMBIENT TEMPERATURE (oC)
Figure 1.
Normalized Power Dissipation vs
= 25°C unless otherwise noted
J
Ambient Temperature
2
1
θJA
Z
0.1
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
125
8
7
6
5
V
= 10V
GS
4
V
= 4.5V
3
, DRAIN CURRENT (A)
2
D
I
1
R
= 78oC/W
θJA
0
25 50 75 100 125 150
, AMBIENT TEMPERATURE (
T
A
Figure 2.
Maximum Continuous Drain Current vs
GS
Ambient Temperature
o
C)
®
MOSFET
NORMALIZED THERMAL
IMPEDANCE,
0.001
1000
, PEAK TRANSIENT POWER (W)
(PK)
P
0.01
100
10
0.5
SINGLE PULSE
R
= 135oC/W
θJA
-4
10
-3
10
Figure 3.
-2
10
t, RECTANGULAR PULSE DURATION (s)
-1
10
0
10
1
10
Normalized Maximum Transient Thermal Impedance
VGS = 10V
2
10
SINGLE PULSE
R
= 135oC/W
θJA
= 25oC
T
A
3
10
1
-4
10
-3
10
Figure 4.
-2
10
-1
10
t, PULSE WIDTH (s)
0
10
10
Single Pulse Maximum Power Dissipation
1
2
10
3
10
©2011 Fairchild Semiconductor Corporation FDS8978 Rev. B1
www.fairchildsemi.com3
Typical Characteristics T
= 25°C unless otherwise noted
J
FDS8978 Dual N-Channel PowerTrench
100
If R = 0 tAV = (L)(IAS)/(1.3*RATED BV
If R 0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
10
, AVALANCHE CURRENT (A)
AS
I
1
STARTING TJ = 150oC
0.01 0.1 1 10 100
tAV, TIME IN AVALANCHE (ms)
- VDD)
DSS
- VDD) +1]
DSS
STARTING TJ = 25oC
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 5.
Unclamped Inductive Switching
Capability
50
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
40
30
20
, DRAIN CURRENT (A)
10
D
I
VGS = 10V
VGS = 5V
VGS = 4.5V
VGS = 3.5V
VGS = 3V
50
PULSE DURATION = 80µs DUTY CYCLE = 0.5%MAX
40
V
= 5V
DS
30
20
, DRAIN CURRENT (A)
10
D
I
0
12345
50
40
30
20
, DRAIN TO SOURCE
ON RESISTANCE (mW)
DS(ON)
r
10
TJ = 25oC
TJ = 150oC
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 6.
ID = 10.2A
ID = 1A
TJ = -55oC
Transfer Characteristics
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
®
MOSFET
0
0.0 0.2 0.4 0.6 0.8 1.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Saturation Characteristics
1.6 PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
1.4
1.2
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.8
-80 -40 0 40 80 120 160
Figure 9.
TJ, JUNCTION TEMPERATURE (oC)
Normalized Drain to Source On
Resistance vs Junction Temperature
©2011 Fairchild Semiconductor Corporation FDS8978 Rev. B1
VGS = 10V, ID = 10.2A
0
246810
Figure 8.
1.2
1.0
0.8
NORMALIZED GATE
THRESHOLD VOLTAGE
0.6
-80 -40 0 40 80 120 160
Figure 10.
, GATE TO SOURCE VOLTAGE (V)
V
GS
Drain to Source On Resistance vs Gate
Voltage and Drain Current
VGS = VDS, ID = 250µA
TJ, JUNCTION TEMPERATURE (oC)
Normalized Gate Threshold Voltage vs
Junction Temperature
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