FDPF680N10T
N-Channel PowerTrench® MOSFET
100V, 12A, 68mΩ
FDPF680N10T N-Channel PowerTrench
November 2008
Features
•R
• Fast Switching Speed
• Low Gate Charge
• High Performance Trench Technology for Extremely Low
• High Power and Current Handling Capability
• RoHS Compliant
Application
• DC to AC Converters / Synchronous Rectification
MOSFET Maximum Ratings T
V
DSS
V
GSS
I
D
I
DM
E
AS
dv/dt Peak Diode Recovery dv/dt (Note 3) 13.0 V/ns
P
D
, T
T
J
T
L
= 54mΩ ( Typ.)@ VGS = 10V, ID = 6A
DS(on)
R
DS(on)
D
G
S
Symbol Parameter Ratings Units
Drain to Source Voltage 100 V
Gate to Source Voltage ±20 V
Drain Current
Drain Current - Pulsed (Note 1) 48 A
Single Pulsed Avalanche Energy (Note 2) 50.4 mJ
Power Dissipation
STG
Operating and Storage Temperature Range -55 to +150
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
TO-220F
= 25oC unless otherwise noted*
C
-Continuous (T
-Continuous (T
(T
= 25oC) 24 W
C
- Derate above 25
Description
This N-Channel MOSFET is produced using Fairchild Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet
maintain superior switching performance.
D
G
S
= 25oC) 12
C
= 100oC) 7.6
C
o
C0.19W/
300
o
o
®
MOSFET
A
o
C
C
C
Thermal Characteristics
Symbol Parameter Ratings Units
R
θJC
R
θJA
©2008 Fairchild Semiconductor Corporation
FDPF680N10T Rev. A
Thermal Resistance, Junction to Case 5.2
Thermal Resistance, Junction to Ambient 62.5
o
C/W
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Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDPF680N10T FDPF680N10T TO-220F - - 50
FDPF680N10T N-Channel PowerTrench
Electrical Characteristics T
= 25oC unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV
ΔBV
ΔT
I
DSS
I
GSS
DSS
DSS
J
Drain to Source Breakdown Voltage ID = 250μA, VGS = 0V, TC = 25oC 100 - - V
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Body Leakage Current VGS = ±20V, V
I
= 250μA, Referenced to 25oC-0.1-V/
D
V
= 100V, V
DS
= 100V, V
V
DS
= 0V - - 1
GS
= 0V, TC = 150oC - - 500
GS
= 0V - - ±100 nA
DS
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage VGS = VDS, ID = 250μA2.53.54.5V
Static Drain to Source On Resistance VGS = 10V, ID = 6A - 54 68 mΩ
Forward Transconductance VDS = 10V, ID = 12A (Note 4) -26-S
Dynamic Characteristics
C
C
C
Q
Q
Q
iss
oss
rss
g(tot)
gs
gd
Input Capacitance
Output Capacitance - 60 80 pF
Reverse Transfer Capacitance - 25 40 pF
Total Gate Charge
Gate to Source Gate Charge - 4 - nC
Gate to Drain “Miller” Charge - 4 - nC
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Turn-On Delay Time
Turn-On Rise Time - 19 48 ns
Turn-Off Delay Time - 18 46 ns
Turn-Off Fall Time - 6 22 ns
= 50V, VGS = 0V
V
DS
f = 1MHz
V
= 80V, ID = 12A
DS
V
= 10V
GS
( Note 4 , 5)
= 50V, ID = 12A
V
DD
V
= 10V, R
GS
( Note 4 , 5)
GEN
= 10Ω
- 750 1000 pF
-1317nC
-1336ns
μA
o
C
®
MOSFET
Drain-Source Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 0.7mH, I
≤ 12A, di/dt ≤ 200A/μs, VDD ≤ BV
3. I
SD
4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
FDPF680N10T Rev. A
Maximum Continuous Drain to Source Diode Forward Current - - 12 A
Maximum Pulsed Drain to Source Diode Forward Current - - 48 A
Drain to Source Diode Forward Voltage V
Reverse Recovery Time
Reverse Recovery Charge - 35 - nC
= 12A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
AS
, Starting TJ = 25°C
DSS
= 0V, I
GS
V
= 0V, I
GS
dI
/dt = 100A/μs (Note 4)
F
= 12A - - 1.3 V
SD
= 12A
SD
2
-29-ns
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Typical Performance Characteristics
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
60
V
=
15.0 V
GS
10.0 V
8.0 V
7.0 V
10
6.5 V
6.0 V
5.5 V
1
,Drain Current[A]
D
I
*Notes:
μ
s Pulse Test
1. 250
= 25oC
2. T
0.1
0.01 0.1 1 10
C
VDS,Drain-Source Voltage[V]
60
150oC
10
25oC
,Drain Current[A]
D
I
1
45678
-55oC
*Notes:
1. V
2. 250
VGS,Gate-Source Voltage[V]
= 20V
DS
μ
s Pulse Test
FDPF680N10T N-Channel PowerTrench
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
0.20
0.15
,
[Ω]
0.10
DS(ON)
R
VGS = 10V
VGS = 20V
0.05
Drain-Source On-Resistance
0
0 102030405060
*Note: TC = 25oC
ID, Drain Current [A]
200
100
150oC
10
25oC
1
, Reverse Drain Current [A]
S
I
0.1
0.0 0.5 1.0 1.5
*Notes:
1. VGS = 0V
2. 250
μ
s Pulse Test
VSD, Body Diode Forward Voltage [V]
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
5000
1000
C
= Cgs + Cgd (Cds = shorted)
iss
= Cds + C
C
oss
C
C
rss
iss
= C
gd
gd
10
VDS = 25V
= 50V
V
8
DS
= 80V
V
DS
®
MOSFET
100
Capacitances [pF]
10
0.01 0.1 1 10 50
FDPF680N10T Rev. A
C
oss
C
rss
*Note:
1. V
= 0V
GS
2. f = 1MHz
VDS, Drain-Source Voltage [V]
6
4
, Gate-Source Voltage [V]
GS
V
2
0
03691215
*Note: ID = 12A
Qg, Total Gate Charge [nC]
3
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