Fairchild FDPC8013S service manual

PowerTrench 30 V Asymmetric Dual N-Channel MOSFET
Features
Q1: N-Channel Max r
Q2: N-Channel
Max rLow inductance packaging shortens rise/fall times, resulting in
lower switching losses
MOSFET integration enables optimum layout for lower circuit
inductance and reduced switch node ringing
RoHS Compliant
= 9.6 mΩ at VGS = 4.5 V, ID = 10 A
DS(on)
= 2.7 mΩ at VGS = 4.5 V, ID = 22 A
DS(on)
®
Power Clip
General Description
This device includes two specialized N-Channel MOSFETs in a dual package. The switch node has been internally connected to enable easy placement and routing of synchronous buck converters. The control MOSFET (Q1) and synchronous
TM
SyncFET
(Q2) have been designed to provide optimal power
efficiency.
Applications
ComputingCommunicationsGeneral Purpose Point of Load
April 2012
FDPC8013S PowerTrench
®
Power Clip
Pin 1
GND
Top
3.3 mm x 3.3 mm
MOSFET Maximum Ratings T
GND
LS
V+
V+
(HSD
GND (LSS
SW
SW
Bottom
= 25 °C unless otherwise noted
A
SW
Pin 1
HSG
HSG
SW
SW
SW
PAD9 V+(HSD)
PAD10 GND(LSS)
V+
LSG
GND
GND
HSG
SW
SW
SW
SW
Symbol Parameter Q1 Q2 Units
V
DS
V
GS
Drain to Source Voltage 30 30 V Gate to Source Voltage (Note 4) ±20 ±20 V Drain Current -Continuous (Package limited) TC = 25 °C 20 55
I
D
= 25 °C 13
A
1a
26
1b
-Pulsed 40 100
E
AS
P
D
TJ, T
STG
Single Pulse Avalanche Energy (Note 3) 21 97 mJ Power Dissipation for Single Operation TA = 25 °C 1.6 Power Dissipation for Single Operation T
= 25 °C 0.8
A
1a
1c
2.0
0.9
1b
1d
Operating and Storage Junction Temperature Range -55 to +150 °C
Thermal Characteristics
R
θJA θJA
R
θJC
Thermal Resistance, Junction to Ambient 77 Thermal Resistance, Junction to Ambient 151 Thermal Resistance, Junction to Case 5.0 3.5
1a
1c
63
135
1b
1d
Package Marking and Ordering Information
V+
LSG
GND
GND
A -Continuous T
W
°C/WR
Device Marking Device Package Reel Size Tape Width Quantity
13CF/15CF FDPC8013S Power Clip 33 13 ” 12 mm 3000 units
©2012 Fairchild Semiconductor Corporation FDPC8013S Rev.C1
1
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FDPC8013S PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Off Characteristics
BV
ΔBV ΔT
I
DSS
I
GSS
DSS
DSS J
Drain to Source Breakdown Voltage Breakdown Voltage Temperature
Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current,
Forward
= 250 μA, VGS = 0 V
D
I
= 1 mA, VGS = 0 V
D
ID = 250 μA, referenced to 25 °C I
= 10 mA, referenced to 25 °C
D
V
DS
V
DS
= 24 V, V = 24 V, V
GS GS
= 0 V = 0 V
VGS = 20 V, VDS= 0 V V
= 20 V, VDS= 0 V
GS
Q1Q230
30
Q1 Q2
Q1 Q2
Q1 Q2
V
16 20
500 100
100
mV/°C
1
I
On Characteristics
V
V
GS(th)
ΔV ΔT
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage Gate to Source Threshold Voltage
Temperature Coefficient
Drain to Source On Resistance
Forward Transconductance
= VDS, ID = 250 μA
GS
V
= VDS, ID = 1 mA
GS
ID = 250 μA, referenced to 25 °C I
= 10 mA, referenced to 25 °C
D
V
= 10 V, ID = 13 A
GS
V
= 4.5 V, ID = 10 A
GS
V
= 10 V, ID = 13 A,TJ =125 °C
GS
V
= 10 V, ID = 26 A
GS
V
= 4.5 V, ID = 22 A
GS
V
= 10 V, ID = 26 A ,TJ =125 °C
GS
V
= 5 V, ID = 13 A
DS
V
= 5 V, ID = 26 A
DS
Q1Q21.2
1.2
Q1 Q2
Q1
Q2
Q1 Q2
1.5
1.7
-5
-6
4.6
6.7
6.6
1.4
2.0
1.9 53
168
3.0
3.0 mV/°C
6.4
9.6
9.2
1.9
2.7
2.6
μA μA
nA nA
V
mΩ
S
®
Power Clip
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
Q
g
g
gs
gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge V
Total Gate Charge V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Q1:
= 15 V, VGS = 0 V, f = 1 MHZ
V
DS
Q2:
= 15 V, VGS = 0 V, f = 1 MHZ
V
DS
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
827
2785
333 997
44
128
0.5
0.5
pF
pF
pF
Ω
6
11
2 5
16 30
2 4
13 44
6
21
2.2
7.2
1.9
6.6
ns
ns
ns
ns
nC
nC
nC
nC
Q1:
= 15 V, ID = 13 A, R
V
DD
Q2: V
= 15 V, ID = 26 A, R
DD
= 0 V to 10 V
GS
= 0 V to 4.5 V
GS
= 6 Ω
GEN
= 6 Ω
GEN
Q1 V
= 15 V,
DD
I
= 13 A
D
Q2 VDD = 15 V, I
= 26 A
D
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
©2012 Fairchild Semiconductor Corporation FDPC8013S Rev.C1
2
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FDPC8013S PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Drain-Source Diode Characteristics
V
= 0 V, IS = 13 A (Note 2)
V
SD
t
rr
Q
rr
Notes:
1.R
is determined with the device mo un ted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. bo ard of FR-4 material. R
θJA
the user's board design.
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
a. 77 °C/W when mounted on a 1 in2 pad of 2 oz copper
SS
SF
DS
DF
G
GS
V
= 0 V, IS = 26 A (Note 2)Q1Q2
GS
Q1
= 13 A, di/dt = 100 A/μs
I
F
Q2 I
= 26 A, di/dt = 300 A/μs
F
G
DF
DS
SF
Q1 Q2
Q1 Q2
is guaranteed by design while R
θJC
b. 63 °C/W when mounted on a 1 in
SS
0.80
0.77
2
pad of 2 oz copper
22 29
30
1.2
1.2
7
is determined by
θCA
ns
nC
V
®
Power Clip
c. 151 °C/W when mounted on a minimum pad of 2 oz copper
SS
SF
DS
DF
SS
SF
DS
DF
G
2 Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
of 21 mJ is based on starting TJ = 25 oC; N-ch: L = 1.2 mH, IAS = 6 A, VDD = 23 V, VGS = 10 V. 100% test at L= 0.1 mH, IAS = 14.5 A.
3. Q1 :E
AS
Q2: EAS of 97 mJ is based on starting TJ = 25 oC; N-ch: L = 0.6 mH, IAS = 18 A, VDD = 23 V, VGS = 10 V. 100% test at L= 0.1 mH, IAS = 32.9 A.
4. As an N-ch device, the negat i ve V
rating is for low duty cycle pulse occurence only. No continuous rating is implied.
gs
G
d. 135 °C/W when mounted on a minimum pad of 2 oz copper
©2012 Fairchild Semiconductor Corporation FDPC8013S Rev.C1
3
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FDPC8013S PowerTrench
0.0 0.3 0.6 0.9 1.2 1.5
0
10
20
30
40
V
GS
= 3 V
V
GS
= 3.5 V
V
GS
= 10 V
V
GS
= 6 V
V
GS
= 4.5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
0 10203040
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS = 3 V
VGS = 6 V
VGS = 4.5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTA NCE
I
D
, DRAIN CURRENT (A)
VGS = 3.5 V
V
GS
= 10 V
-75 -50 -25 0 25 50 75 100 125 150
0.6
0.8
1.0
1.2
1.4
1.6
ID = 13 A V
GS
= 10 V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J
, JUNCTION TEMPER ATURE (
o
C)
2345678910
0
7
14
21
28
35
TJ = 125 oC
ID = 13 A
TJ = 25 oC
V
GS
, GATE TO SO U RCE VOLTAGE (V)
r
DS(on)
,
DRAIN TO
SOURCE ON-RESISTANCE
(mΩ)
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
1.0 1.5 2.0 2.5 3.0 3.5
0
10
20
30
40
TJ = 150 oC
V
DS
= 5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
TJ = -55 oC
TJ = 25 oC
I
D
, DRAIN CURRENT (A)
VGS, GATE TO SOURCE VOLTAGE (V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.01
0.1
1
10
40
TJ = -55 oC
TJ = 25 oC
TJ = 150 oC
V
GS
= 0 V
I
S
, REVERSE DRAIN CURRENT (A)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Typical Characteristics (Q1 N-Channel) T
Figure 1.
On Region Characteristics Figure 2.
= 25 °C unless otherwise noted
J
Normali z e d O n - R e s i stance
vs Drain Current and Gate Voltage
®
Power Clip
Fig u r e 3. Nor m a lized On R esistan c e
vs Junction Temperature
©2012 Fairchild Semiconductor Corporation FDPC8013S Rev.C1
Figure 5. Transfer Characteristics
Figure 4.
On-Resistance vs Gate to
Source Voltage
Figure 6.
Source to D rain Diode
Forward Voltage vs Source Current
4
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