Fairchild FDPC8011S service manual

Top
GND (LSS
HSG
SW
SW
SW
Bottom
3.3 mm x 3.3 mm
Pin 1
HSG
SW
SW
SW
V+
(HSD
V+
LS
GND
GND
Pin 1
V+
LSG
GND
GND
PAD9 V+(HSD)
PAD10 GND(LSS)
HSG
SW
SW
SW
SW
V+
LSG
GND
GND
PowerTrench 25V Asymmetric Dual N-Channel MOSFET
Features
Q1: N-Channel Max r
Q2: N-Channel
Max rLow inductance packaging shortens rise/fall times, resulting in
lower switching losses
MOSFET integration enables optimum layout for lower circuit
inductance and reduced switch node ringing
RoHS Compliant
= 7.3 mΩ at VGS = 4.5 V, ID = 12 A
DS(on)
= 2.1 mΩ at VGS = 4.5 V, ID = 24 A
DS(on)
®
Power Clip
General Description
This device includes two specialized N-Channel MOSFETs in a dual package. The switch node has been internally connected to enable easy placement and routing of synchronous buck converters. The control MOSFET (Q1) and synchronous
TM
SyncFET
(Q2) have been designed to provide optimal power
efficiency.
Applications
ComputingCommunicationsGeneral Purpose Point of Load
March 2012
FDPC8011S PowerTrench
®
Power Clip
MOSFET Maximum Ratings T
Symbol Parameter Q1 Q2 Units
V
DS
V
GS
I
D
E
AS
P
D
TJ, T
STG
Thermal Characteristics
R
θJA θJA
R
θJC
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
©2012 Fairchild Semiconductor Corporation FDPC8011S Rev.C2
13OD/15OD FDPC8011S Power Clip 33 13 ” 12 mm 3000 units
= 25 °C unless otherwise noted
A
Drain to Source Voltage 25 25 V Gate to Source Voltage 12 12 V Drain Current -Continuous (Package limited) TC = 25 °C 20 60
= 25 °C 13
A
1a
27
1b
A -Continuous T
-Pulsed 40 120 Single Pulse Avalanche Energy (Note 3) 21 97 mJ Power Dissipation for Single Operation TA = 25 °C 1.6 Power Dissipation for Single Operation T
= 25 °C 0.8
A
1a
1c
2.0
0.9
1b
1d
W
Operating and Storage Junction Temperature Range -55 to +150 °C
Thermal Resistance, Junction to Ambient 77 Thermal Resistance, Junction to Ambient 151
1a
1c
63
135
1b
1d
°C/WR
Thermal Resistance, Junction to Case 5.0 3.5
1
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FDPC8011S PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Off Characteristics
BV
ΔBV ΔT
I
DSS
I
GSS
DSS
DSS J
Drain to Source Breakdown Voltage Breakdown Voltage Temperature
Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current,
Forward
= 250 μA, VGS = 0 V
D
I
= 1 mA, VGS = 0 V
D
ID = 250 μA, referenced to 25 °C I
= 10 mA, referenced to 25 °C
D
V
DS
V
DS
= 20 V, V = 20 V, V
GS GS
= 0 V = 0 V
VGS = 12 V/-8 V, VDS= 0 V V
= 12 V/-8 V, VDS= 0 V
GS
Q1Q225
25
Q1 Q2
Q1 Q2
Q1 Q2
V
14 24
500μAμA
±100 ±100nAnA
mV/°C
1
I
On Characteristics
V
V
GS(th)
ΔV ΔT
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage Gate to Source Threshold Voltage
Temperature Coefficient
Drain to Source On Resistance
Forward Transconductance
= VDS, ID = 250 μA
GS
V
= VDS, ID = 1 mA
GS
ID = 250 μA, referenced to 25 °C I
= 10 mA, referenced to 25 °C
D
V
= 10 V, ID = 13 A
GS
V
= 4.5 V, ID = 12 A
GS
V
= 10 V, ID = 13 A,TJ =125 °C
GS
V
= 10 V, ID = 27 A
GS
V
= 4.5 V, ID = 24 A
GS
V
= 10 V, ID = 27 A ,TJ =125 °C
GS
V
= 5 V, ID = 13 A
DS
V
= 5 V, ID = 27 A
DS
Q1Q20.8
1.1
Q1 Q2
Q1
Q2
Q1 Q2
1.2
1.4
-4
-3
4.6
5.4
5.6
1.2
1.4
1.7 97
231
2.2
2.2 mV/°C
6.0
7.3
7.3
1.8
2.1
2.4
V
mΩ
S
®
Power Clip
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
Q
g
g
gs
gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge V
Total Gate Charge V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Q1:
= 13 V, VGS = 0 V, f = 1 MHZ
V
DS
Q2:
= 13 V, VGS = 0 V, f = 1 MHZ
V
DS
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
1240 4335
332
1126
49
143
0.4
0.5
pF
pF
pF
Ω
7
13
2 5
20 38
2 4
19 64
9
30
2.6
9.3
2.3
7.7
ns
ns
ns
ns
nC
nC
nC
nC
Q1:
= 13 V, ID = 13 A, R
V
DD
Q2: V
= 13 V, ID = 27 A, R
DD
= 0 V to 10 V
GS
= 0 V to 4.5 V
GS
= 6 Ω
GEN
= 6 Ω
GEN
Q1 V
= 13 V,
DD
I
= 13 A
D
Q2 VDD = 13 V, I
= 27 A
D
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
©2012 Fairchild Semiconductor Corporation FDPC8011S Rev.C2
2
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FDPC8011S PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Drain-Source Diode Characteristics
0.8
0.8 22
30
32
1.2
1.2
8
is determined by
θCA
V
= 0 V, IS = 13 A (Note 2)
V
SD
t
rr
Q
rr
Notes:
1.R
is determined with the device mo un ted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. bo ard of FR-4 material. R
θJA
the user's board design.
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
a. 77 °C/W when mounted on a 1 in2 pad of 2 oz copper
SS
SF
DS
DF
G
GS
V
= 0 V, IS = 27 A (Note 2)Q1Q2
GS
Q1
= 13 A, di/dt = 100 A/μs
I
F
Q2 I
= 27 A, di/dt = 300 A/μs
F
G
DF
DS
SF
Q1 Q2
Q1 Q2
is guaranteed by design while R
θJC
b. 63 °C/W when mounted on a 1 in
SS
2
pad of 2 oz copper
V
ns
nC
®
Power Clip
c. 151 °C/W when mounted on a minimum pad of 2 oz copper
SS
SF
DS
DF
SS
SF
DS
DF
G
2 Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
of 21 mJ is based on starting TJ = 25 oC; N-ch: L = 1.2 mH, IAS = 6 A, VDD = 23 V, VGS = 10 V. 100% test at L= 0.1 mH, IAS = 14.5 A.
3. Q1 :E
AS
Q2: EAS of 97 mJ is based on starting TJ = 25 oC; N-ch: L = 0.6 mH, IAS = 18 A, VDD = 23 V, VGS = 10 V. 100% test at L= 0.1 mH, IAS = 32.9 A.
G
d. 135 °C/W when mounted on a minimum pad of 2 oz copper
©2012 Fairchild Semiconductor Corporation FDPC8011S Rev.C2
3
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FDPC8011S PowerTrench
0.0 0 .3 0.6 0.9 1.2 1.5
0
10
20
30
40
V
GS
= 2.5 V
V
GS
= 3 V
V
GS
= 10 V
V
GS
= 4.5 V
V
GS
= 3.5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
0 10203040
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS = 2.5 V
VGS = 4.5 V
VGS = 3 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTA NCE
I
D
, DRAIN CURRENT (A)
VGS = 3.5 V
V
GS
= 10 V
-75 -50 -25 0 25 50 75 100 125 150
0.6
0.8
1.0
1.2
1.4
1.6
ID = 13 A V
GS
= 10 V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J
, JUNCTION TE M P E R ATURE (
o
C)
2345678910
0
4
8
12
16
20
TJ = 125 oC
ID = 13 A
TJ = 25 oC
V
GS
, GATE TO SO U RCE VOLTAGE (V)
r
DS(on)
,
DRAIN TO
SOURCE ON-RESISTANCE
(mΩ)
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
1.01.52.02.53.0
0
10
20
30
40
TJ = 150 oC
V
DS
= 5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
TJ = -55 oC
TJ = 25 oC
I
D
, DRAIN CURRENT (A)
VGS, GATE TO SOURCE VOLTAGE (V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.01
0.1
1
10
40
TJ = -55 oC
TJ = 25 oC
TJ = 150 oC
V
GS
= 0 V
I
S
, REVERSE DRAIN CURRENT (A)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Typical Characteristics (Q1 N-Channel) T
Figure 1.
On Region Characteristics Figure 2.
= 25 °C unless otherwise noted
J
Norma l i z e d O n - R e s i stance
vs Drain Current and Gate Voltage
®
Power Clip
Fi g u r e 3. No r m a lized On R esista n c e
vs Junction Temperature
©2012 Fairchild Semiconductor Corporation FDPC8011S Rev.C2
Figure 5. Transfer Characteristics
Figure 4.
On-R esistan ce vs Gate to
Source Voltage
Figure 6.
Source to Dra in Dio de
Forward Voltage vs Source Current
4
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