N
May 2008
FDP8896
FDP8896
N-Channel PowerTrench® MOSFET
30V, 92A, 5.9mΩ
General Description
This N-Channel MOSFET has been designed specifically to
improve the overall efficiency of DC/DC converters using
either synchronous or conventional switching PWM
controllers. It has been optimized for low gate charge, low
r
and fast switching speed.
DS(ON)
Applications
• DC/DC converters
(FLANGE)
DRAIN
TO-220AB
FDP SERIES
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
V
I
E
P
T
D
DSS
GS
AS
D
, T
J
STG
Drain to Source Voltage 30 V
Gate to Source Voltage ±20 V
Drain Current
Continuous (T
Continuous (T
Continuous (T
= 25oC, VGS = 10V) (Note 1)
C
= 25oC, VGS = 4.5V) (Note 1) 85 A
C
= 25oC, VGS = 10V, with R
amb
Pulsed Figure 4 A
Single Pulse Avalanche Energy (Note 2) 74 mJ
Power dissipation 80 W
Derate above 25
o
C0.53W/
Operating and Storage Te mperature -55 to 175
SOURCE
DRAIN
GATE
= 25°C unless otherwise noted
C
Features
•r
•r
• High performance trench technology for extremely low
• Low gate charge
• High power and current handling capability
•
RoHS Compliant
= 62oC/W) 16 A
θJA
DS(ON)
DS(ON)
r
DS(ON)
= 5.9mΩ, V
= 7.0mΩ, V
G
= 10V, ID = 35A
GS
= 4.5V, ID = 35A
GS
D
S
92 A
tmM
o
o
C
C
Thermal Characteristics
R
θJC
R
θJA
Thermal Resistance Junction to Case TO-220 1.88
Thermal Resistance Junction to Ambient TO-220 ( Note 3) 62
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDP8896 FDP8896 TO-220AB Tube N/A 50 units
©2008 Fairchild Semiconductor Corporation
o
C/W
o
C/W
FDP8896 Rev. A2
FDP8896
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Tes t Cond itions Min Typ Max Units
Off Characteristics
B
VDSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V 30 - - V
V
= 24V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC - - 250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA 1.2 - 2.5 V
I
= 35A, VGS = 10V - 0.0050 0.0059
D
= 35A, VGS = 4.5V - 0.0060 0.0070
I
Drain to Source On Resistance
D
I
= 35A, VGS = 10V,
D
= 175oC
T
J
- 0.0078 0.0094
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
R
G
Q
g(TOT)
Q
g(5)
Q
g(TH)
Q
gs
Q
gs2
Q
gd
Input Capacitance
Output Capacitance - 490 - pF
Reverse Transfer Capacitance - 300 - pF
= 15V, VGS = 0V,
V
DS
f = 1MHz
Gate Resistance VGS = 0.5V, f = 1MHz - 2.3 - Ω
Total Gate Charge at 10V VGS = 0V to 10V
Total Gate Charge at 5V VGS = 0V to 5V - 25 36 nC
V
= 15V
Threshold Gate Charge VGS = 0V to 1V - 2.3 3.0 nC
Gate to Source Gate Charge - 8 - nC
Gate Charge Threshold to Plateau - 5.7 - nC
DD
= 35A
I
D
= 1.0mA
I
g
Gate to Drain “Miller” Charge - 9.5 - nC
- 2525 - pF
-4867nC
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time - 9 - ns
Rise Time - 103 - ns
Turn-Off Delay Time - 56 - ns
Fall Time - 44 - n s
Turn-Off Time - - 150 ns
(VGS = 10V)
Drain-Source Diode Characteristics
V
SD
t
rr
Q
RR
Notes:
1: Package current limitation is 80A.
2: Starting T
3: Pulse width = 100s.
4
Source to Drain Diode Voltage
Reverse Recovery Time ISD = 35A, dISD/dt = 100A/µs- -27ns
Reverse Recovered Charge ISD = 35A, dISD/dt = 100A/µs- -12nC
= 25°C, L = 36µH, IAS = 64A, VDD = 27V, VGS = 10V.
J
- - 168 ns
= 15V, ID = 35A
V
DD
= 4.5V, RGS = 6.2Ω
V
GS
I
= 35A - - 1.25 V
SD
I
= 20A - - 1.0 V
SD
©2008 Fairchild Semiconductor Corporation FDP8896 Rev. A2
FDP8896
Typical Characteristics T
= 25°C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULT IPL I ER
0
0 25 50 75 100 175
125
150
TC, CASE TEMPERATURE (oC)
Figure 1. Normali ze d Po we r Dis sip ation vs Case
Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
-3
10
t, RECTANGULAR PULSE DURATION (s)
100
CURRENT LIMITED
BY PACKAGE
80
VGS = 10V
60
VGS = 4.5V
40
, DRAIN CURRENT (A)
D
I
20
0
25 50 75 100 125 150
175
TC, CASE TEMPERATURE (oC)
Figure 2. Maximum Contin uous Drain Current vs
Case Temperature
P
DM
t
1
t
x R
θJC
+ T
2
C
1
10
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
10
-1
10
θJC
10
1/t2
0
Figure 3. Normalized Maximum Transient Thermal Impedance
1000
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
VGS = 4.5V
, PEAK CURRENT (A)
DM
I
100
50
-5
10
-4
10
-3
10
-2
10
-1
10
t, PUL SE WIDTH (s)
TC = 25oC
FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2008 Fairchild Semiconductor Corporation FDP8896 Rev. A2