Fairchild FDP8870 service manual

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FDP8870
N-Channel PowerTrench® MOSFET 30V, 156A, 4.1m
FDP8870
November 2004
General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low r
and fast switching speed.
DS(ON)
Features
•r
•r
• High performance trench technology for extremely low
DS(ON)
DS(ON)
r
DS(ON)
= 4.1mΩ, V = 4.6mΩ, V
= 10V, ID = 35A
GS
= 4.5V, ID = 35A
GS
• Low gate charge
Applications
• High power and current handling capability
• DC/DC converters
DRAIN
(FLANGE)
DRAIN
GATE
TO-220AB
FDP SERIES
MOSFET Maximum Ratings T
SOURCE
= 25°C unless otherwise noted
C
D
G
S
Symbol Parameter Ratings Units
V V
DSS GS
Drain to Source Voltage 30 V Gate to Source Voltage ±20 V Drain Current Continuous (T
I
D
Continuous (T Continuous (T
= 25oC, VGS = 10V) (Note 1)
C
= 25oC, VGS = 4.5V) (Note 1) 147 A
C
= 25oC, VGS = 10V, with R
amb
= 62oC/W) 19 A
θJA
156 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 2) 300 mJ Power dissipation 160 W
o
Derate above 25
C1.07W/
Operating and Storage Te mperature -55 to 175
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
Thermal Resistance Junction to Case TO-220 0.94 Thermal Resistance Junction to Ambient TO-220 ( Note 3) 62
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDP8870 FDP8870 TO-220AB Tube N/A 50 units FDP8870 FD P8870_NL (Note 4) TO-220AB Tube N/A 50 units
©2004 Fairchild Semiconductor Corporation
o
C/W
o
C/W
FDP8870 Rev. A2
FDP8870
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Tes t Cond itions Min Typ Max Units
Off Characteristics
B
VDSS
I
DSS
I
GSS
Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V 30 - - V
V
= 24V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC - - 250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA 1.2 - 2.5 V
= 35A, VGS = 10V - 0.0034 0.0041
I
D
I
= 35A, VGS = 4.5V - 0.0040 0.0046
Drain to Source On Resistance
D
I
= 35A, VGS = 10V,
D
T
= 175oC
J
- 0.0051 0.0065
Dynamic Characteristics
C
ISS
C
OSS
C
RSS
R
G
Q
g(TOT)
Q
g(5)
Q
g(TH)
Q
gs
Q
gs2
Q
gd
Input Capacitance Output Capacitance - 970 - pF Reverse Transfer Capacitance - 570 - pF
= 15V, VGS = 0V,
V
DS
f = 1MHz
Gate Resistance VGS = 0.5V, f = 1MHz - 2.1 - Total Gate Charge at 10V VGS = 0V to 10V Total Gate Charge at 5V VGS = 0V to 5V - 56 69 nC
V
= 15V
Threshold Gate Charge VGS = 0V to 1V - 5.0 6.5 nC Gate to Source Gate Charge - 15 - nC Gate Charge Threshold to Plateau - 10 - nC
DD
= 35A
I
D
= 1.0mA
I
g
Gate to Drain “Miller” Charge - 23 - nC
- 5200 - pF
- 106 132 nC
µA
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 11 - ns Rise Time - 105 - ns Turn-Off Delay Time - 70 - ns Fall Time - 46 - n s Turn-Off Time - - 173 ns
(VGS = 10V)
= 15V, ID = 35A
V
DD
= 4.5V, RGS = 3.3
V
GS
Drain-Source Diode Characteristics
I
= 35A - - 1.25 V
V
SD
t
rr
Q
RR
Notes: 1: Package current limitation is 80A. 2: Starting T 3: Pulse width = 100s. 4: FDP8870_NL is lead free product. FDP8870_NL marking will appea r on the reel label.
Source to Drain Diode Voltage Reverse Recovery Time ISD = 35A, dISD/dt = 100A/µs- -37ns
Reverse Recovered Charge ISD = 35A, dISD/dt = 100A/µs- -21nC
= 25°C, L = 0.15mH, IAS = 64A, VDD = 27V, VGS = 10V.
J
SD
= 15A - - 1.0 V
I
SD
- - 168 ns
©2004 Fairchild Semiconductor Corporation FDP8870 Rev. A2
FDP8870
Typical Characteristics T
= 25°C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLI ER
0
0 25 50 75 100 175
125
150
TC, CASE TEMPERATURE (oC)
Figure 1. Normali ze d Po we r Dissipation vs Case
Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
-3
10
t, RECTANGULAR PULSE DURATION (s)
175
150
125
CURRENT LIMITED BY PACKAGE
100
75
, DRAIN CURRENT (A)
50
D
I
25
0
25 50 75 100 125 150
175
TC, CASE TEMPERATURE (oC)
Figure 2. Maximum Contin uous Drain Current vs
Case Temperature
P
DM
t
1
t
x R
θJC
+ T
2
C
1
10
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-2
10
-1
10
θJC
10
1/t2
0
Figure 3. Normalized Maximum Transient Thermal Impedance
1000
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
VGS = 4.5V
, PEAK CURRENT (A)
DM
I
100
50
-5
10
-4
10
-3
10
-2
10
-1
10
t, PUL SE WIDTH (s)
TC = 25oC FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
10
C
150
0
1
10
Figure 4. Peak Current Capability
©2004 Fairchild Semiconductor Corporation FDP8870 Rev. A2
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