September 2010
TO-220
FDP Series
G D S
TO-220F
FDPF Series
(potted)
G
S
D
UniFET-II
FDP7N60NZ / FDPF7N60NZ
N-Channel MOSFET
600V, 6.5A, 1.25
FDP7N60NZ / FDPF7N60NZ N-Channel MOSFET
TM
Features
•R
• Low gate charge ( Typ. 13nC)
• Low C
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• ESD Improved capability
• RoHS compliant
MOSFET Maximum Ratings T
Symbol Parameter FDP7N60NZ
V
DSS
V
GSS
I
D
I
DM
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt (Note 3) 10 V/ns
P
D
, T
T
J
T
L
*Drain current limited by maximum junction temperature
= 1.05 ( Typ.)@ VGS = 10V, ID = 3.25A
DS(on)
( Typ. 7pF)
rss
Drain to Source Voltage 600 V
Gate to Source Voltage ±30 V
Drain Current
Drain Current - Pulsed (Note 1) 26 26* A
Single Pulsed Avalanche Energy (Note 2) 275 mJ
Avalanche Current (Note 1) 6.5 A
Repetitive Avalanche Energy (Note 1) 14.7 mJ
Power Dissipation
STG
Operating and Storage Temperature Range -55 to +150
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
o
= 25
C unless otherwise noted*
C
-Continuous (T
-Continuous (T
(T
= 25oC) 147 33 W
C
- Derate above 25
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe,
DOMS technology.
This advance technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and
commutationmode. These devices are well suited for high efficient switched mode power supplies and active power factor correction.
FDPF7N60NZ
= 25oC) 6.5 6.5*
C
= 100oC) 3.9 3.9*
C
o
C 1.2 0.26 W/oC
300
Units
o
o
Thermal Characteristics
Symbol Parameter FDP7N60NZ FDPF7N60NZ Units
R
JC
CS
R
JA
Thermal Resistance, Junction to Case 0.85 3.8
Thermal Resistance, Case to Sink Typ. 0.5 Thermal Resistance, Junction to Ambient 62.5 62.5
o
C/WR
A
C
C
©2010 Fairchild Semiconductor Corporation
FDP7N60NZ / FDPF7N60NZ Rev. A
www.fairchildsemi.com1
FDP7N60NZ / FDPF7N60NZ N-Channel MOSFET
Package Marking and Ordering Information T
= 25oC unless otherwise noted
C
Device Marking Device Package Reel Size Tape Width Quantity
FDP7N60NZ FDP7N60NZ TO-220 - - 50
FDPF7N60NZ FDPF7N60NZ TO-220F - - 50
Electrical Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV
DSS
BV
DSS
T
J
I
DSS
I
GSS
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Q
g(tot)
Q
gs
Q
gd
Drain to Source Breakdown Voltage ID = 250A, VGS = 0V, TJ = 25oC 600 - - V
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Body Leakage Current VGS = ±25V, V
I
= 250A, Referenced to 25oC-0.6-V/
D
V
= 600V, V
DS
= 480V, TC = 125oC--10
V
DS
= 0V - - 1
GS
= 0V - - ±10 A
DS
Gate Threshold Voltage VGS = VDS, ID = 250A3-5V
Static Drain to Source On Resistance VGS = 10V, ID = 3.25A - 1.05 1.25
Forward Transconductance VDS = 20V, ID = 3.25A (Note 4) -7.3-S
Input Capacitance
Output Capacitance - 70 90 pF
Reverse Transfer Capacitance - 7 10 pF
= 25V, VGS = 0V
V
DS
f = 1MHz
Total Gate Charge at 10V
V
= 480V, ID = 6.5A
Gate to Source Gate Charge - 3 - nC
Gate to Drain “Miller” Charge - 5.6 - nC
DS
V
= 10V
GS
(Note 4, 5)
- 550 730 pF
-1317nC
A
o
C
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Turn-On Delay Time
Turn-On Rise Time - 30 70 ns
Turn-Off Delay Time - 40 90 ns
Turn-Off Fall Time - 25 60 ns
Drain-Source Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: L =13mH, IAS = 6.5A, VDD = 50V, RG = 25, Starting TJ = 25°C
3: ISD 6.5A, di/dt 200A/s, VDD BV
4: Pulse Test: Pulse width 300s, Duty Cycle 2%
5: Essentially Independent of Operating Temperature Typical Characteristics
Maximum Continuous Drain to Source Diode Forward Current - - 6.5 A
Maximum Pulsed Drain to Source Diode Forward Current - - 26 A
Drain to Source Diode Forward Voltage V
Reverse Recovery Time
Reverse Recovery Charge - 1.4 - C
, Starting TJ = 25°C
DSS
= 300V, ID = 6.5A
V
DD
R
= 25
G
(Note 4, 5)
= 0V, I
GS
V
= 0V, I
GS
dI
/dt = 100A/s (Note 4)
F
= 6.5A - - 1.4 V
SD
= 6.5A
SD
-17.545ns
- 250 - ns
FDP7N60NZ / FDPF7N60NZ Rev. A
2
www.fairchildsemi.com
Typical Performance Characteristics
45678
0.1
1
10
100
-55oC
150oC
* Notes :
1. V
DS
= 20V
2. 250
s Pulse Test
25oC
I
D
, Drain Current[A]
VGS, Gate-Source Voltage[V]
0.1 1 10 20
0.1
1
10
20
*Notes:
1. 250
s Pulse Test
2. T
C
= 25oC
V
GS
= 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
I
D
, Drain Current[A]
VDS, Drain-Source Voltage[V]
0.40.60.81.01.21.4
1
10
100
Notes:
1. VGS = 0V
2. 250
s Pulse Test
150oC
I
S
, Reverse Drain Current [A]
VSD, Body Diode Forward Voltage [V]
25oC
0 2 4 6 8 10 12 14
0.8
1.0
1.2
1.4
1.6
1.8
2.0
* Note : TJ = 25oC
VGS = 20V
VGS = 10V
R
DS(on)
[],
Drain-Source On-Resistance
ID, Drain Current [A]
0 2 4 6 8 10 12 14
0
2
4
6
8
10
* Note : ID = 6.5A
VDS = 120V
V
DS
= 300V
V
DS
= 480V
V
GS
, Gate-Source Voltage [V]
Qg, Total Ga te Charge [n C]
0.1 1 10
1
10
100
1000
5000
C
oss
C
iss
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
* Note:
1. V
GS
= 0V
2. f = 1MHz
C
rss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
30
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
FDP7N60NZ / FDPF7N60NZ N-Channel MOSFET
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
FDP7N60NZ / FDPF7N60NZ Rev. A
3
www.fairchildsemi.com