Fairchild FDP7N60NZ, FDPF7N60NZ service manual

September 2010
TO-220 FDP Series
G D S
TO-220F FDPF Series (potted)
G
S
D
UniFET-II
FDP7N60NZ / FDPF7N60NZ
600V, 6.5A, 1.25
FDP7N60NZ / FDPF7N60NZ N-Channel MOSFET
TM
Features
•R
• Low gate charge ( Typ. 13nC)
• Low C
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• ESD Improved capability
• RoHS compliant
MOSFET Maximum Ratings T
Symbol Parameter FDP7N60NZ
V
DSS
V
GSS
I
D
I
DM
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt (Note 3) 10 V/ns P
D
, T
T
J
T
L
*Drain current limited by maximum junction temperature
= 1.05 ( Typ.)@ VGS = 10V, ID = 3.25A
DS(on)
( Typ. 7pF)
rss
Drain to Source Voltage 600 V Gate to Source Voltage ±30 V
Drain Current Drain Current - Pulsed (Note 1) 26 26* A
Single Pulsed Avalanche Energy (Note 2) 275 mJ Avalanche Current (Note 1) 6.5 A Repetitive Avalanche Energy (Note 1) 14.7 mJ
Power Dissipation
STG
Operating and Storage Temperature Range -55 to +150 Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
o
= 25
C unless otherwise noted*
C
-Continuous (T
-Continuous (T
(T
= 25oC) 147 33 W
C
- Derate above 25
Description
These N-Channel enhancement mode power field effect transis­tors are produced using Fairchild’s proprietary, planar stripe, DOMS technology.
This advance technology has been especially tailored to mini­mize on-state resistance, provide superior switching perfor­mance, and withstand high energy pulse in the avalanche and commutationmode. These devices are well suited for high effi­cient switched mode power supplies and active power factor cor­rection.
FDPF7N60NZ
= 25oC) 6.5 6.5*
C
= 100oC) 3.9 3.9*
C
o
C 1.2 0.26 W/oC
300
Units
o
o
Thermal Characteristics
Symbol Parameter FDP7N60NZ FDPF7N60NZ Units
R
JCCS
R
JA
Thermal Resistance, Junction to Case 0.85 3.8 Thermal Resistance, Case to Sink Typ. 0.5 ­Thermal Resistance, Junction to Ambient 62.5 62.5
o
C/WR
A
C C
©2010 Fairchild Semiconductor Corporation FDP7N60NZ / FDPF7N60NZ Rev. A
www.fairchildsemi.com1
FDP7N60NZ / FDPF7N60NZ N-Channel MOSFET
Package Marking and Ordering Information T
= 25oC unless otherwise noted
C
Device Marking Device Package Reel Size Tape Width Quantity
FDP7N60NZ FDP7N60NZ TO-220 - - 50
FDPF7N60NZ FDPF7N60NZ TO-220F - - 50
Electrical Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV
DSS
BV
DSS
T
J
I
DSS
I
GSS
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Q
g(tot)
Q
gs
Q
gd
Drain to Source Breakdown Voltage ID = 250A, VGS = 0V, TJ = 25oC 600 - - V Breakdown Voltage Temperature
Coefficient Zero Gate Voltage Drain Current Gate to Body Leakage Current VGS = ±25V, V
I
= 250A, Referenced to 25oC-0.6-V/
D
V
= 600V, V
DS
= 480V, TC = 125oC--10
V
DS
= 0V - - 1
GS
= 0V - - ±10 A
DS
Gate Threshold Voltage VGS = VDS, ID = 250A3-5V Static Drain to Source On Resistance VGS = 10V, ID = 3.25A - 1.05 1.25 Forward Transconductance VDS = 20V, ID = 3.25A (Note 4) -7.3-S
Input Capacitance Output Capacitance - 70 90 pF Reverse Transfer Capacitance - 7 10 pF
= 25V, VGS = 0V
V
DS
f = 1MHz
Total Gate Charge at 10V
V
= 480V, ID = 6.5A
Gate to Source Gate Charge - 3 - nC Gate to Drain “Miller” Charge - 5.6 - nC
DS
V
= 10V
GS
(Note 4, 5)
- 550 730 pF
-1317nC
A
o
C
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Turn-On Delay Time Turn-On Rise Time - 30 70 ns Turn-Off Delay Time - 40 90 ns Turn-Off Fall Time - 25 60 ns
Drain-Source Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature 2: L =13mH, IAS = 6.5A, VDD = 50V, RG = 25, Starting TJ = 25°C 3: ISD 6.5A, di/dt 200A/s, VDD BV 4: Pulse Test: Pulse width 300s, Duty Cycle 2% 5: Essentially Independent of Operating Temperature Typical Characteristics
Maximum Continuous Drain to Source Diode Forward Current - - 6.5 A Maximum Pulsed Drain to Source Diode Forward Current - - 26 A Drain to Source Diode Forward Voltage V Reverse Recovery Time Reverse Recovery Charge - 1.4 - C
, Starting TJ = 25°C
DSS
= 300V, ID = 6.5A
V
DD
R
= 25
G
(Note 4, 5)
= 0V, I
GS
V
= 0V, I
GS
dI
/dt = 100A/s (Note 4)
F
= 6.5A - - 1.4 V
SD
= 6.5A
SD
-17.545ns
- 250 - ns
FDP7N60NZ / FDPF7N60NZ Rev. A
2
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Typical Performance Characteristics
45678
0.1
1
10
100
-55oC
150oC
* Notes :
1. V
DS
= 20V
2. 250
s Pulse Test
25oC
I
D
, Drain Current[A]
VGS, Gate-Source Voltage[V]
0.1 1 10 20
0.1
1
10
20
*Notes:
1. 250
s Pulse Test
2. T
C
= 25oC
V
GS
= 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
I
D
, Drain Current[A]
VDS, Drain-Source Voltage[V]
0.40.60.81.01.21.4
1
10
100
Notes:
1. VGS = 0V
2. 250
s Pulse Test
150oC
I
S
, Reverse Drain Current [A]
VSD, Body Diode Forward Voltage [V]
25oC
0 2 4 6 8 10 12 14
0.8
1.0
1.2
1.4
1.6
1.8
2.0
* Note : TJ = 25oC
VGS = 20V
VGS = 10V
R
DS(on)
[],
Drain-Source On-Resistance
ID, Drain Current [A]
0 2 4 6 8 10 12 14
0
2
4
6
8
10
* Note : ID = 6.5A
VDS = 120V V
DS
= 300V
V
DS
= 480V
V
GS
, Gate-Source Voltage [V]
Qg, Total Ga te Charge [n C]
0.1 1 10
1
10
100
1000
5000
C
oss
C
iss
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
* Note:
1. V
GS
= 0V
2. f = 1MHz
C
rss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
30
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
FDP7N60NZ / FDPF7N60NZ N-Channel MOSFET
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
FDP7N60NZ / FDPF7N60NZ Rev. A
3
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