Fairchild FDP3672 service manual

FDP3672
N-Channel PowerTrench® MOSFET 105V, 41A, 33m
FDP3672
September 2003
Features
•r
•Q
• Low Miller Charge
•Low Q
• Optimized eff iciency at high frequ encies
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
= 25mΩ (Typ.), V
DS(ON)
(tot) = 28nC (Typ.), V
g
Body Diode
RR
= 10V, ID = 41A
GS
= 10V
GS
Applications
• DC/DC converters and Off-Line UPS
• Distributed Pow er Architectures and VRMs
• Primary Switch for 24V and 48V Systems
• High Voltage Synchronous Re ctifier
• Direct Injection / Diesel Injection Systems
• 42V Automotive Lo ad Control
• Electronic Valve T rain System s
Formerly developmental type 82760
D
DRAIN
(FLANGE)
TO-220AB
FDP SERIES
MOSFET Maximum Ratings T
C
SOURCE
DRAIN
GATE
= 25°C unless otherwise noted
G
S
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Source Voltage 105 V Gate to Source Voltage ±20 V Drain Curr e nt Continuous (T
I
D
Continuous (T Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 31 A
C
= 25oC, VGS = 10V, R
amb
= 62oC/W) 5.9 A
θJA
41 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 48 mJ Power dissipation 135 W Derate above 25
o
C0.9W/
Operating and Storage Temperature -55 to 175
o
C
o
C
Thermal Characteristi cs
R
θJC
R
θJA
This product ha s been des igned to me et the e xtr eme test c ondit ions and envir onment deman ded by the automot ive indus t ry. For a
All Fairchild Semiconductor prod ucts are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
©2003 Fairchild Semiconductor Corporation
Thermal Resistance Junction to Case TO-220 1.11 Thermal Resistance Junction t o Ambient TO-220 (No te 2) 62
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
certification.
FDP3672 Rev. A3
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDP3672 FDP3672 TO-220AB Tube N/A 50 units
FDP3672
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain t o Source Breakdown Volta ge ID = 250µA, VGS = 0V 105 - - V
V
= 80V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC= 150oC- - 250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
I
Drain to Source On Resistance
= 41A, V
D
I
= 21A, VGS = 6V, - 0.031 0.055
D
I
= 41A, V
D
T
= 175oC
C
= 10V - 0.025 0.033
GS
= 10V ,
GS
- 0.063 0.070
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 240 - pF Reverse Transfer Capacitance - 55 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total G ate Ch arg e at 10 V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 3.9 5 nC Gate to Source Gate Charge - 12 - nC Gate Charge Threshold to Plateau - 8.0 - nC
V
DD
I
= 41A
D
I
= 1.0m A
g
= 50V
Gate to Drain “Miller” Charge - 6.5 - nC
-1670- pF
-2837nC
µA
Resistive Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 12 - ns Rise Time - 48 - ns T u rn-Off Delay Time - 24 - ns Fall Time - 27 - ns Turn-Off Time - - 77 ns
(VGS = 10V)
V
DD
V
GS
--90ns
= 50V, ID = 41A = 10V, RGS = 11.0
Drain-Source Diode Characteristics
I
= 41A - - 1 .25 V
V
SD
t
rr
Q
RR
Notes: 1: Starting T 2: Pulse Width = 100s
©2003 Fairchild Semiconductor Corporation FDP3672 Rev. A3
Source to Drain Di ode Voltage Reverse Recovery Time ISD = 41A, dISD/dt =100A/µs- - 39ns
Reverse Recovered Charge ISD = 41A, dISD/dt =100A/µs- - 42nC
= 25°C, L = 0.11mH, IAS = 30A.
J
SD
= 21A - - 1.0 V
I
SD
FDP3672
Typical Characteristics T
= 25°C unless otherwise noted
C
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
150
50
V
= 10V
GS
40
30
20
, DRAIN CURRENT (A)
D
I
10
0
25 50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
Figure 2. Maximum Continuous Drain Curr ent vs
Case Temperature
, NORMALIZED Z
, PEAK CURRENT (A) I
θJC
DM
THERMAL IMPEDANCE
500
100
30
0.1
0.01
10
-5
10
VGS = 10V
-5
SINGLE PULSE
-4
10
-3
10
-2
10
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-1
10
t, RECTANGULAR PULSE DURATION (s)
Figure 3. Normalized Maximum Transient Thermal Impedance
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-4
10
-3
10
t, PULSE WIDTH (s)
-2
10
-1
10
TC = 25oC
FOR TEMPERATURES ABOVE 25 CURRENT AS FOLLOWS:
I = I
P
DM
1/t2
x R
θJC
0
10
o
25
0
10
t
1
t
2
+ T
θJC
C
C DERATE PEAK
175 - T
C
150
1
10
1
10
Figure 4. Peak Current Capability
©2003 Fairchild Semiconductor Corporation FDP3672 Rev. A3
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