Fairchild FDB2572, FDP2572 service manual

FDB2572
N-Channel PowerTrench® MOSFET 150V, 29A, 54m
FDB25 72
January 2012
Features
•r
•Q
• Low Miller Charge
•Low Q
• UIS Capability (Single Pulse and Repetitive Pulse)
Formerly developmental type 82860
DS(ON)
(tot) = 26nC (Typ.), V
g
Body Diode
RR
GATE
SOURCE
= 10V, ID = 9A
GS
= 10V
GS
DRAIN
(FLANGE)
Applications
• DC/DC converters and Off-Line UPS
• Distributed Pow er Architectures and VRMs
• Primary Switch for 24V and 48V Systems
• High Voltage Synchronous Re ctifier
D
G
TO-263AB
FDB SERIES
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DSS
V
GS
I
D
E
AS
P
D
T
, T
J
STG
Drain to Source Voltage 150 V Gate to Source Voltage ±20 V Drain Curr e nt Continuous (T Continuous (T Continuous (T Pulsed Figure 4 A Single Pulse Avalanche Energy (Note 1) 36 mJ Power dissipation 135 W Derate above 25 Operating and Storage Temperature -55 to 175
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 20 A
C
= 25oC, VGS = 10V, R
amb
o
C0.9W/
= 25°C unless otherwise noted
C
= 43oC/W) 4 A
θJA
S
29 A
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
©2012 Fairchild Semiconductor Corporation
Thermal Resistance Junction to Case 1.11
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea 43
, TO-263
, TO-263 (Note 2) 62Thermal Resistance Junction t o Ambient
o
C/W
o
C/W
o
C/W
FDB2572 Rev. C
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB2572 FDB2572 TO-263AB 330mm 24mm 800 units
FDB25 72
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain t o Source Breakdown Volta ge ID = 250µA, VGS = 0V 150 - - V
V
= 120V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150
V
GS
o
--250
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
=9A, VGS=10V - 0.045 0.054
I
Drain to Source On Resistance
D
= 4A, VGS = 6V, - 0.050 0.075
D
=9A, VGS=10V, TC=175oC - 0.126 0.146
I
D
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 183 - pF Reverse Transfer Capacitance - 40 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total G ate Ch arg e at 10 V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 3.3 4.3 nC Gate to Source Gate Charge - 8 - nC Gate Charge Threshold to Plateau - 5 - nC
V
DD
I
= 9A
D
I
= 1.0m A
g
= 75V
Gate to Drain “Miller” Charge - 6 - nC
-1770- pF
-2634nC
µA
I
Resistive Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 11 - ns Rise Time - 14 - ns T u rn-Off Delay Time - 31 - ns Fall Time - 14 - ns Turn-Off Time - - 66 ns
Drain-Source Diode Characteristics
V
SD
t
rr
Q
RR
Notes: 1: Starting T 2: Pulse Width = 100s
©2012 Fairchild Semiconductor Corporation
Source to Drain Di ode Voltage Reverse Recovery Time ISD = 9A, dISD/dt =100A/µs- -74ns
Reverse Recovered Charge ISD = 9A, dISD/dt =100A/µs - - 169 nC
= 25°C, L = 0.2mH, IAS = 19A.
J
(VGS = 10V)
V
DD
V
GS
I
SD
I
SD
--36ns
= 75V, ID = 9A = 10V, RGS = 11.0
= 9A - - 1 .25 V
= 4A - - 1.0 V
FDB2572 Rev. C
FDB25 72
Typical Characteristics T
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
TC, CASE TEMPERATURE (oC)
= 25°C unless otherwise noted
C
125
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2.0
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
-5
10
-4
10
SINGLE PULSE
, NORMALIZED Z
1.0
0.1
θJC
THERMAL IMPEDANCE
0.01
40
V
= 10V
GS
35
30
25
20
15
, DRAIN CURRENT (A)
10
D
I
5
150
0
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
10
t, RECTANGULAR PULSE DURATION (s)
-2
10
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-1
10
θJC
10
1/t2
0
x R
t
1
t
2
+ T
θJC
C
1
10
500
100
, PEAK CURRENT (A)
DM
I
©2012 Fairchild Semiconductor Corporation
VGS = 10V
20
-5
10
Figure 3. Normalized Maximum Transient Thermal Impedance
TC = 25oC
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-4
10
-3
10
t, PULSE WIDT H (s)
-2
10
-1
10
FOR TEMPERATURES ABOVE 25 CURRENT AS FOLLOWS:
I = I
Figure 4. Peak Current Capability
o
C DERATE PEAK
175 - T
25
0
10
150
C
1
10
FDB2572 Rev. C
FDB25 72
Typical Characteristics T
1000
100
10
OPERATION IN THIS
AREA MAY BE
, DRAIN CURRENT (A)
D
I
LIMITED BY r
1
SINGLE PULSE TJ = MAX R ATED
T
= 25oC
C
0.1 1 10 100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
= 25°C unless otherwise noted
C
10µs 100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
60
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
V
DD
= 15V
TJ = 175oC
50
40
30
100
STARTING TJ = 25oC
10
STARTING TJ = 150oC
1
If R = 0
, AVALANCHE CURRENT (A)
200
tAV = (L)(IAS)/(1.3*RATED BV
AS
I
If R 0 t
= (L/R)ln[(IAS*R)/(1.3*RATED BV
AV
0.1
0.001 0.01 0.1 1 tAV, TIME IN AVALANCHE (ms)
DSS
- VDD)
DSS
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
60
TC = 25oC
50
40
30
VGS = 10V
VGS = 6V
- VDD) +1]
VGS = 7V
20
, DRAIN CURRENT (A)
D
I
10
0
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
TJ = 25oC
TJ = -55oC
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
60
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
55
50
45
40
DRAIN TO SOURCE ON RESISTANCE (m Ω)
0102030
VGS = 6V
VGS = 10V
I
, DRAIN CURRENT (A)
D
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
20
, DRAIN CURRENT (A)
D
I
10
0
012345
3.0
2.5
2.0
1.5
1.0
ON RESISTANCE
0.5
NORMALIZED DRAIN TO SOURCE
0
-80 -40 0 40 80 120 160 200
VDS, DRAIN TO SOURCE VOLTAGE (V)
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
TJ, JUNCTION TEMPERATURE (oC)
VGS = 5V
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
VGS = 10V, ID =9A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
©2012 Fairchild Semiconductor Corporation
FDB2572 Rev. C
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