Fairchild FDMS6681Z service manual

P-Channel PowerTrench® MOSFET
-30 V, -49 A, 3.2 m: Features
Max r
Max r
Advanced Package and Silicon combination
for low r
HBM ESD protection level of 8kV typical(note 3)
MSL1 robust package design
RoHS Compliant
= 3.2 m: at VGS = -10 V, ID = -21.1 A
DS(on)
= 5.0 m: at VGS = -4.5 V, ID = -15.7 A
DS(on)
DS(on)
May 2009
General Description
The FDMS6681Z has been designed to minimize losses in load switch applications. Advancements in both silicon and package technologies have been combined to offer the lowest r ESD protection.
DS(on)
and
Applications
Load Switch in Notebook and Server
Notebook Battery Pack Power Management
FDMS6681Z P-Channel PowerTrench
®
MOSFET
Top
D
Bottom
D
D
D
Pin 1
S
S
S
G
5
D
D
6
D
7
D
8
4
3
2
1
Power 56
MOSFET Maximum Ratings T
Symbol Parameter Ratings Units
V
DS
V
GS
I
D
P
D
, T
T
J
STG
Drain to Source Voltage -30 V
Gate to Source Voltage ±25 V
Drain Current -Continuous (Package limited) TC= 25 °C -49
-Continuous (Silicon limited) T
-Continuous T
-Pulsed -90
Power Dissipation TC = 25 °C 73
Power Dissipation T
Operating and Storage Junction Temperature Range -55 to +150 °C
= 25 °C unless otherwise noted
A
= 25 °C -116
C
= 25 °C (Note 1a) -21.1
A
= 25 °C (Note 1a) 2.5
A
Thermal Characteristics
G
S
S
S
A
W
R
TJC
R
TJA
Thermal Resistance, Junction to Case 1.7
Thermal Resistance, Junction to Ambient (Note 1a) 50
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDMS6681Z FDMS6681Z Power 56 13 ’’ 12 mm 3000 units
©2009 Fairchild Semiconductor Corporation FDMS6681Z Rev.C4
°C/W
1
www.fairchildsemi.com
FDMS6681Z P-Channel PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
'BV 'T
I
DSS
I
GSS
DSS
DSS
J
Drain to Source Breakdown Voltage ID = -250 PA, VGS = 0 V -30 V
Breakdown Voltage Temperature Coefficient
I
= -250 PA, referenced to 25 °C 20 mV/°C
D
Zero Gate Voltage Drain Current VDS = -24 V, VGS= 0 V -1 PA
Gate to Source Leakage Current VGS = ±25 V, VDS= 0 V ±10 PA
On Characteristics
V
GS(th)
'V 'T
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage VGS = VDS, ID = -250 PA-1-1.7-3V
Gate to Source Threshold Voltage Temperature Coefficient
Static Drain to Source On Resistance
I
= -250 PA, referenced to 25 °C -7 mV/°C
D
V
= -10 V, ID = -22.1 A 2.7 3.2
GS
= -4.5 V, ID = -15.7 A 4.0 5.0
GS
= -10 V, ID = -22.1 A, TJ = 125 °C 3.9 5.0
V
GS
Forward Transconductance VDD = -10 V, ID = -22.1 A 143 S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 1540 2050 pF
Reverse Transfer Capacitance 1345 2020 pF
= -15 V, VGS = 0 V,
V
DS
f = 1 MHz
7803 10380 pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
g
Q
gs
Q
gd
Turn-On Delay Time
Rise Time 38 61 ns
Turn-Off Delay Time 260 416 ns
= -15 V, ID = -22.1 A,
V
DD
V
= -10 V, R
GS
GEN
= 6 :
Fall Time 197 316 ns
Total Gate Charge VGS= 0 V to -10 V
Total Gate Charge VGS= 0 V to -5 V 97 136 nC
Gate to Source Charge 22 nC
= -15 V,
V
DD
I
= -22.1 A
D
Gate to Drain “Miller” Charge 46 nC
15 24 ns
172 241 nC
m:V
®
MOSFET
Drain-Source Diode Characteristics
V
= 0 V, IS= -2.1 A (Note 2) 0.68 1.2 V
V
SD
t
rr
Q
rr
NOTES:
is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
1. R
TJA
the user's board design.
2. Pulse Test: Pulse Width < 300 Ps, Duty cycle < 2.0%.
3. The diode connected between the gate and source servers only as protection against ESD. No gate overvoltage rating is implied.
FDMS6681Z Rev.C4
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge 39 63 nC
a. 50 °C/W when mounted on
2
a 1 in
pad of 2 oz copper.
GS
= 0 V, IS= -22.1 A (Note 2) 0.79 1.25 V
V
GS
= -22.1 A, di/dt = 100 A/Ps
I
F
2©2009 Fairchild Semiconductor Corporation
44 71 ns
is guaranteed by design while R
TJC
b. 125 °C/W when mounted on a minimum pad of 2 oz copper.
is determined by
TCA
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FDMS6681Z P-Channel PowerTrench
Typical Characteristics T
90
75
60
45
DRAIN CURRENT (A)
30
,
D
-I
15
0
0123
Figure 1.
1.6
1.4
PULSE DURATION = 80 Ps DUTY CYCLE = 0.5% MAX
-V
,
DRAIN TO SOURCE VOLTAGE (V)
DS
On Region Characteristics
ID = -22.1 A V
= -10 V
GS
1.2
1.0
NORMALIZED
0.8
DRAIN TO SOURCE ON-RESISTANCE
0.6
-75 -50 -25 0 25 50 75 100 125 150
T
,
JUNCTION TEMPERATURE
J
F i g u r e 3 . N o r m a l i z e d O n R e s i s t a n c e
vs Junction Temperature
VGS = -3.5 V
VGS = -4 V
VGS = -4.5 V
VGS = -10V
= 25 °C unless otherwise noted
J
VGS = -3 V
o
(
C
)
5
PULSE DURATION = 80 Ps
VGS = -3 V
4
DUTY CYCLE = 0.5%MAX
VGS = -3.5 V
3
VGS= -4 V
NORMALIZED
V
= -4.5 V
2
GS
1
V
=-10 V
DRAIN TO SOURCE ON-RESISTANCE
0
0 153045607590
-I
,
DRAIN CURRENT (A)
D
Figure 2.
N o r m a l i z e d O n - R e s i s t a n c e
GS
vs Drain Current and Gate Voltage
12
)
:
m
(
9
6
DRAIN TO
,
DS(on)
r
3
SOURCE ON-RESISTANCE
0
246810
-V
,
GATE TO SOURCE VOLTAGE (V)
GS
Figure 4.
O n - R es i s t a n c e vs G a t e t o
PULSE DURATION = 80 Ps DUTY CYCLE = 0.5% MAX
ID= -22.1 A
TJ= 125 oC
TJ= 25 oC
Source Voltage
®
MOSFET
90
75
60
45
30
, DRAIN CURRENT (A)
D
-I
15
FDMS6681Z Rev.C
PULSE DURATION = 80 Ps DUTY CYCLE = 0.5% MAX
VDS= -5 V
TJ = 150 oC
TJ = 25 oC
TJ = -55 oC
0
01234
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics
4
100
VGS= 0 V
10
TJ= 150 oC
1
0.1
TJ = 25 oC
0.01
, REVERSE DRAIN CURRENT (A)
S
-I
0.001 0 0.2 0.4 0.6 0.8 1.0 1.2
-VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 6.
S o u r ce t o D r a i n D io d e
TJ = -55 oC
Forward Voltage vs Source Current
3©2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDMS6681Z P-Channel PowerTrench
Typical Characteristics T
10
ID= -22.1 A
8
6
4
2
, GATE TO SOURCE VOLTAGE (V)
GS
-V
0
0 50 100 150 200
Figure 7.
100
50
, AVALANCHE CURRENT (A)
AS
-I
1
0.001 0.01 0.1 1 10 100
Fi gu re 9. Un cl am pe d I nd uct iv e
VDD = -10 V
V
Qg, GATE CHARGE (nC)
Gate Charge Characteristics
TJ= 25 oC
TJ= 125 oC
tAV, TI ME IN AVALANCHE (ms)
S w i t c h i n g C a p a b i l i t y
= 25 °C unless otherwise noted
J
VDD = -15 V
= -20 V
DD
TJ= 100 oC
20000
10000
CAPACITANCE (pF)
f = 1 MHz
= 0 V
V
GS
1000
600
0.1 1 10
-VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 8.
C a p a c i t a n c e v s D r a i n
to Source Voltage
-4
10
VGS= 0 V
-5
10
TJ= 150 oC
-6
10
-7
10
-8
10
GATE LEAKAGE CURRENT (A)
,
g
I
-9
10
0 5 10 15 20 25 30
Figure 10.
TJ= 25 oC
V
GATE TO SOURCE VOLTAGE (V)
,
GS
I
vs V
gss
gss
C
iss
C
oss
C
rss
30
®
MOSFET
100
10
1
, DRAIN CURRENT (A)
0.1
D
-I
0.01
0.01 0.1 1 10 100
FDMS6681Z Rev.C
THIS AREA IS LIMITED BY r
Figure 11.
DS(on)
SINGLE PULSE
= MAX RATED
T
J
R
= 125 oC/W
T
JA
T
= 25 oC
A
-VDS, DRAIN to SOURCE VOLTAGE (V)
F o rw a r d Bi a s S af e
Operating Area
4
1 ms
10 ms
100 ms
1 s
10 s
DC
1000
VGS = -10 V
100
SINGLE PULSE
= 125 oC/W
R
T
10
T
JA
= 25 oC
A
1
PEAK TRANSIENT POWER (W)
,
)
PK
(
P
0.1
0.001 0.01 0.1 1 10 100 1000
t, PULSE WIDTH (sec)
Figure 12.
S i n g l e P u l s e M a x i m u m
Power Dissipation
4©2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FDMS6681Z P-Channel PowerTrench
Typical Characteristics T
2
1
JA
T
Z
0.1
IMPEDANCE,
0.01
NORMALIZED THERMAL
0.001
0.001 0.01 0.1 1 10 100 1000
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
Figure 13.
= 25 °C unless otherwise noted
J
NOTES:
SINGLE PULSE
R
= 125 oC/W
T
JA
t, RECTANGULAR PULSE DURATION (sec)
DUTY FACTOR: D = t1/t PEAK TJ = PDM x Z
Junction-to-Ambient Transient Thermal Response Curve
P
DM
t
1
t
2
2
x R
+ T
TJA
TJA
A
®
MOSFET
FDMS6681Z Rev.C
4
5©2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Dimensional Outline and Pad Layout
FDMS6681Z P-Channel PowerTrench
®
MOSFET
FDMS6681Z Rev.C
4
6©2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.
Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK EfficentMax™ EZSWITCH™ *
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®
tm
PDP SPM™ Power-SPM™
®
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Saving our world, 1mW /W /kW at a time™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET™
®
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TinyBoost™ TinyBuck™ TinyLogic TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™*
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*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
FDMS6681Z P-Channel PowerTrench
®
MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS Definition of Terms
.
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Datasheet Identification Product Status Definition
Advance Information Formative / In Design
Preliminary First Production
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.
Rev. I40
©2009 Fairchild Semiconductor Corporation FDMS6681Z Rev.C
4
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