Fairchild FDMS3664S service manual

FDMS3664S
Q
Q
Power 56
G1
D1
D1
D1
G2
S2
S2
S2
D1
PHASE (S1/D2)
S2
S2 S2 G2
D1
D1 D1
G1
Top Bottom
PHASE
Asymmetric Dual N-Channel MOSFET
Features
Q1: N-Channel
Max rMax r
Q2: N-Channel
Max rMax r
Low inductance packaging shortens r
lower switching losses
MOSFET integration enables optimum layout for lower circuit
ind
RoHS Compliant
= 8 mΩ at VGS = 10 V, ID = 13 A
DS(on)
= 11 mΩ at VGS = 4.5 V, ID = 11 A
DS(on)
= 2.6 mΩ at VGS = 10 V, ID = 25 A
DS(on)
= 3.2 mΩ at VGS = 4.5 V, ID = 22 A
DS(on)
uctance and reduced switch node ringing
®
Power Stage
ise/fall times, resulting in
General Description
This device includes two specialized N-Channel MOSFETs in a dual PQFN package. The switch node has been internally connected to enable easy placement and routing of synchronous buck converters. The control MOSFET (Q1) and synchronous SyncFET (Q2) have been designed to provide optimal power efficiency.
Applications
ComputingCommunicationsGeneral Purpose Point of Load Notebook VCORE
December 2011
FDMS3664S PowerTrench
®
Power Stage
2
5 6 7 8
MOSFET Maximum Ratings T
Symbol Parameter Q1 Q2 Units
V
DS
V
GS
I
D
E
AS
P
D
TJ, T
STG
Drain to Source Voltage 30 30 V Gate to Source Voltage (Note 3) ±20 ±12 V Drain Current -Continuous (Package limited) TC = 25 °C 30 60
-Continuous (Silicon limited) T
-Continuous T
-Pulsed 40 100 Single Pulse Avalanche Energy 33 Power Dissipation for Single Operation TA = 25 °C 2.2 Power Dissipation for Single Operation T Operating and Storage Junction Temperature Range -55 to +150 °C
= 25 °C unless otherwise noted
A
= 25 °C 60 1 18
C
= 25 °C 13
A
= 25 °C 1
A
1a
4 1a
1c
1
25
48
2.5
4 3 2 1
1b
5
1b
1d
1
A
mJ
W
Thermal Characteristics
R
θJA θJA
R
θJC
Package Marking and Ordering Information
©2011 Fairchild Semiconductor Corporation FDMS3664S Rev.C1
Device Marking Device Package Reel Size Tape Width Quantity
Thermal Resistance, Junction to Ambient 57 Thermal Resistance, Junction to Ambient 125 Thermal Resistance, Junction to Case 2.9 2.3
22CF 10OD
FDMS3664S Power 56 13 ” 12 mm 3000 units
1
1a
1c
1b
50
1d
120
°C/WR
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FDMS3664S PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Off Characteristics
BV
ΔBV ΔT
I
DSS
I
GSS
DSS
DSS J
= 250 μA, VGS = 0 V
Drain to Source Breakdown Voltage Breakdown Voltage Temperature
Coefficient
D
I
= 1 mA, VGS = 0 V
D
ID = 250 μA, referenced to 25 °C I
= 10 mA, referenced to 25 °C
D
Zero Gate Voltage Drain Current VDS = 24 V, V
V
= 20 V, VDS= 0 V
Gate to Source Leakage Current
GS
V
= 12 V, VDS= 0 V
GS
GS
= 0 V
Q1Q230
30
Q1 Q2
Q1 Q2
Q1 Q2
V
16 18
500 100
100
mV/°C
1
I
On Characteristics
V
V
GS(th)
ΔV ΔT
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage Gate to Source Threshold Voltage
Temperature Coefficient
Drain to Source On Resistance
Forward Transconductance
= VDS, ID = 250 μA
GS
V
= VDS, ID = 1 mA
GS
ID = 250 μA, referenced to 25 °C I
= 10 mA, referenced to 25 °C
D
= 10 V, ID = 13 A
V
GS
V
= 4.5 V, ID = 11 A
GS
V
= 10 V , ID = 13 A , TJ = 125 °C
GS
V
= 10 V, ID = 25 A
GS
V
= 4.5 V, ID = 22 A
GS
V
= 10 V , ID = 25 A , TJ = 125 °C
GS
V
= 5 V, ID = 13 A
DS
V
= 5 V, ID = 25 A
DS
Q1Q21.1
1.1
Q1 Q2
Q1
Q2
Q1 Q2
1.9
1.6
-6
-3 4
6
5.7
2.0
2.5
2.9 62
179
2.7
2.2 mV/°C
8
11
8.7
2.6
3.2
4.5
μA μA
nA nA
V
mΩ
S
®
Power Stage
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
Q
Q
Q
g
g
gs
gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge V
Total Gate Charge V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
1325
Q1:
= 15 V, VGS = 0 V, f = 1 MHZ
V
DS
Q2:
= 15 V, VGS = 0 V, f = 1 MHZ
V
DS
Q1 Q2
Q1 Q2
Q1 Q2
Q1Q20.2
0.2
2515
466 645
46 7470115
0.6
0.9
1765 3345
620 860
2 3
pF
pF
pF
Ω
7.7
9.21518
2.2
3.41010 19
28
34 46
1.8
2.41010 21
37
29 52
9.51713 24
3.9
5.9
2.6
4
ns
ns
ns
ns
nC
nC
nC
nC
Q1:
= 15 V, ID = 13 A, R
V
DD
Q2:
= 15 V, ID = 25 A, R
V
DD
= 0 V to 10 V
GS
= 0 V to 4.5 V
GS
Q1: V
DD
I
= 13 A
D
Q2: V
DD
I
= 25 A
D
= 6 Ω
GEN
= 6 Ω
GEN
= 15 V,
= 15 V,
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
Q1 Q2
©2011 Fairchild Semiconductor Corporation FDMS3664S Rev.C1
2
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FDMS3664S PowerTrench
Electrical Characteristics T
= 25 °C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Drain-Source Diode Characteristics
1.2
V
= 0 V, IS = 13 A (Note 2)
GS
V
= 0 V, IS = 2 A (Note 2)
V
SD
t
rr
Q
rr
Notes: 1: R
θJA
by the user's board design.
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
a. 57 °C/W when mounted on
2
a 1 in
pad of 2 oz copper
GS
V
= 0 V, IS = 25 A (Note 2)
GS
V
= 0 V, IS = 2 A (Note 2)
GS
Q1: I
= 13 A, di/dt = 100 A/μs
F
Q2: I
= 25 A, di/dt = 300 A/μs
F
Q1 Q1 Q2 Q2
Q1 Q2
Q1 Q2
is guaranteed by design wh ile R
θJC
b. 50 °C/W when mounted on
2
a 1 in
pad of 2 oz copper
0.8
1.2
0.7
0.8
0.6 26
24 10
22
1.2
1.2 42
38 20
34
θCA
is determined
V
ns
nC
®
Power Stage
c. 125 °C/W when mounted on a minimum pad of 2 oz copper
2: Pulse Test: Pulse Wid th < 300 μs, Duty cycle < 2.0%. 3: As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied with the negative Vgs rating. 4: EAS of 33 mJ is based on starting TJ = 25 oC; N-ch: L = 1.9 mH, IAS = 6 A, VDD = 27 V, VGS = 10 V. 100% test at L= 0.1 mH, IAS = 16 A.
of 48 mJ is based on starting TJ = 25 oC; N-ch: L = 0.6 mH, IAS = 13 A, VDD = 27 V, VGS = 10 V. 100% test at L= 0.1 mH, IAS = 23 A.
5: E
AS
d. 120 °C/W when mounted on a minimum pad of 2 oz copper
©2011 Fairchild Semiconductor Corporation FDMS3664S Rev.C1
3
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FDMS3664S PowerTrench
0.0 0.2 0.4 0.6 0.8 1.0
0
10
20
30
40
V
GS
= 6 V
V
GS
= 4 V
V
GS
= 10 V
V
GS
= 4.5 V
V
GS
= 3.5 V
PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX
I
D
, DRAIN CURRENT (A)
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
0 10203040
0
1
2
3
4
VGS = 6 V
VGS = 3.5 V
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
NORMALIZED
DRAIN TO SOURCE ON-RESISTA NCE
I
D
, DRAIN CURRENT (A)
V
GS
= 4 V
VGS = 4.5 V
V
GS
= 10 V
-75 -50 -25 0 25 50 75 100 125 150
0.6
0.8
1.0
1.2
1.4
1.6
ID = 13 A V
GS
= 10 V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J
, JUNCTION TEMPERATURE (
o
C)
246810
0
4
8
12
16
20
TJ = 125 oC
ID = 13 A
TJ = 25 oC
V
GS
, GATE TO SOURCE VOLTA GE (V)
r
DS(on)
,
DRAIN TO
SOURCE ON-RESISTANCE
(mΩ)
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
1.5 2.0 2.5 3.0 3.5 4.0
0
10
20
30
40
TJ = 150 oC
V
DS
= 5 V
PULSE DURA TION = 80 μs DUTY CYCLE = 0.5% MAX
TJ = -55 oC
TJ = 25 oC
I
D
, DRAIN CURRENT (A)
VGS, GATE TO SOURCE VOLTAGE (V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.001
0.01
0.1
1
10
40
TJ = -55 oC
TJ = 25 oC
TJ = 150 oC
V
GS
= 0 V
I
S
, REVERSE DRAIN CURRENT (A)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Typical Characteristics (Q1 N-Channel) T
Figure 1.
On Region Characteristics Figure 2.
= 25 °C unless otherwise noted
J
Norm a l i z e d O n - R e sistance
vs Drain Current and Gate Voltage
®
Power Stage
Fi g u re 3. No r m alized O n Resist a n ce
vs Junction Temperature
©2011 Fairchild Semiconductor Corporation FDMS3664S Rev.C1
Figure 5. Transfer Characteristics
Figure 4.
On-Res istance vs Gate to
Source Voltage
Figure 6.
Source to Drain Diode
Forward Voltage vs Source Current
4
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FDMS3664S PowerTrench
0 5 10 15 20 25
0
2
4
6
8
10
ID = 13 A
V
DD
= 20 V
V
DD
= 10 V
V
GS
, GATE TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
VDD = 15 V
0.1 1 10 30
10
100
1000
2000
f = 1 MH z V
GS
= 0 V
CAPACITANCE (pF)
VDS, DRAIN TO SOURCE VOLTAGE (V)
C
rss
C
oss
C
iss
0.001 0.01 0.1 1 10 100
1
10
100
TJ = 100 oC
TJ = 25 oC
TJ = 125 oC
tAV, TIME IN AVALANCHE (ms)
I
AS
, AVALANCHE CURRENT (A)
25 50 75 100 125 150
0
20
40
60
80
R
θJC
= 2.9 oC/W
V
GS
= 4.5 V
Limited by Package
V
GS
= 10 V
I
D
, DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
0.01 0.1 1 10 100200
0.01
0.1
1
10
100
100 μs
DC
100 ms
10 ms
1 ms
1 s
I
D
, DRAIN CURRENT (A)
VDS, DRAIN to SOURCE VOLTAGE (V)
THIS A REA IS
LIMITED BY r
DS(on)
SINGLE PULSE T
J
= MAX RATED
R
θJA
= 125
o
C/W
T
A
= 25
o
C
10 s
10-410-310-210
-1
110
100 1000
0.1
1
10
100
1000
SINGLE PULSE R
θJA
= 125 oC/W
P(
PK
), PEAK TRANSIENT POWER (W)
t, PULSE WIDTH (sec)
Typical Characteristics (Q1 N-Channel) T
Figure 7.
Gate Charge Characteristics Figure 8.
= 25 °C unless otherwise noted
J
Capa c i t a nce v s D r ain
to Source Voltage
®
Power Stage
Figure 9.
Un c l a mp e d I nd u c tiv e
Switching Capability
©2011 Fairchild Semiconductor Corporation FDMS3664S Rev.C1
Figure 11. Forward Bias Safe
Op
erating Area
Figure 10.
Maximum Continuous Drain
Current vs Case Temperature
Figure 12. Single Pulse Maximum
Power Dissipation
5
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