Fairchild FDMC86520L service manual

FDMC86520L

G

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Bottom

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Top

Pin 1

MLP 3.3x3.3

N-Channel Power Trench® MOSFET

60 V, 22 A, 7.9 mΩ
Features

 Max r
 Max r
 Low Profile - 1 mm max in Power 33
 100% UIL Tested

 RoHS Compliant

= 7.9 mΩ at VGS = 10 V, ID = 13.5 A

DS(on)

= 11.7 mΩ at VGS = 4.5 V, ID = 11.5 A

DS(on)

General Description

This N-Channel MOSFET has been designed specifically to
improve the overall efficiency and to minimize switch node
ringing of DC/DC converters using either synchronous or
conventional switching PWM controllers.It has been optimized
for low gate charge, low r
diode reverse recovery performance.

Applications

 Primary Switch in isolated DC-DC
 Synchronous Rectifier
 Load Switch

August 2011

, fast switching speed and body

DS(on)

FDMC86520L N-Channel PowerTrench

®

MOSFET

MOSFET Maximum Ratings T

Symbol Parameter Ratings Units

V

DS

V

GS

I

D

E

AS

P

D

, T

T

J

STG

Thermal Characteristics

R

θJC

R

θJA

Package Marking and Ordering Information

Device Marking Device Package Reel Size Tape Width Quantity

FDMC86520L FDMC86520L Power 33 13 ’’ 12 mm 3000 units

©2011 Fairchild Semiconductor Corporation
FDMC86520L Rev.C

Drain to Source Voltage 60 V
Gate to Source Voltage ±20 V
Drain Current -Continuous (Package limited) TC = 25 °C 22

-Continuous (Silicon limited) T

-Continuous T

-Pulsed 60
Single Pulse Avalanche Energy (Note 3) 79 mJ
Power Dissipation TC = 25 °C 40
Power Dissipation T
Operating and Storage Junction Temperature Range -55 to +150 °C

Thermal Resistance, Junction to Case 3.1
Thermal Resistance, Junction to Ambient (Note 1a) 53

= 25 °C unless otherwise noted

A

= 25 °C 55

C

= 25 °C (Note 1a) 13.5

A

= 25 °C (Note 1a) 2.3

A

1

A

W

°C/W

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FDMC86520L N-Channel PowerTrench

Electrical Characteristics T

= 25 °C unless otherwise noted

J

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV

ΔBV
ΔT

I

DSS

I

GSS

DSS

DSS
J

Drain to Source Breakdown Voltage ID = 250 μA, VGS = 0 V 60 V
Breakdown Voltage Temperature

Coefficient
Zero Gate Voltage Drain Current VDS = 48 V, V
Gate to Source Leakage Current VGS = ±20 V, V

I

= 250 μA, referenced to 25 °C 29 mV/°C

D

= 0 V 1 μA

GS

= 0 V ±100 nA

DS

On Characteristics

V

GS(th)

ΔV
ΔT

r

DS(on)

g

FS

GS(th)

J

Gate to Source Threshold Voltage VGS = VDS, ID = 250 μA11.73V
Gate to Source Threshold Voltage

Temperature Coefficient

Static Drain to Source On Resistance

I

= 250 μA, referenced to 25 °C -7 mV/°C

D

V

= 10 V, ID = 13.5 A 6.5 7.9

GS

= 4.5 V, ID = 11.5 A 9.1 11.7

GS

= 10 V , ID = 13.5 A, TJ = 125 °C 9 11

V

GS

Forward Transconductance VDS = 5 V, ID = 13.5 A 49 S

Dynamic Characteristics

C

iss

C

oss

C

rss

R

g

Input Capacitance
Output Capacitance 638 850 pF
Reverse Transfer Capacitance 25 40 pF
Gate Resistance 0.5 Ω

Switching Characteristics

t

d(on)

t

r

t

d(off)

t

f

Q

g(TOT)

Q

g(TOT)

Q

gs

Q

gd

Turn-On Delay Time
Rise Time 5.2 10 ns
Turn-Off Delay Time 32 55 ns
Fall Time 3.4 10 ns
Total Gate Charge V
Total Gate Charge V
Total Gate Charge 9.6 nC
Gate to Drain “Miller” Charge 4.9 nC

= 30 V, VGS = 0 V,

V

DS

f = 1 MHz

= 30 V, ID = 13.5 A,

V

DD

V

= 10 V, R

GS

= 0 V to 10 V

GS

= 0 V to 4.5 V 21 30 nC

GS

= 6 Ω

GEN

VDD = 30 V,
I

D

= 13.5 A

3420 4550 pF

15 30 ns

45 64 nC

mΩV

®

MOSFET

Drain-Source Diode Characteristics

V

SD

t

rr

Q

rr

NOTES:

1. R

is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R

θJA

the user's board design.

2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.

3. Starting T

FDMC86520L Rev.C

Source to Drain Diode Forward Voltage
Reverse Recovery Time

Reverse Recovery Charge 21 34 nC

= 25 °C; N-ch: L = 0.3 mH, IAS = 23 A, VDD = 54 V, VGS = 10 V.

J

V

GS

V

GS

= 13.5 A, di/dt = 100 A/μs

I

F

53 °C/W when mounted on a

2

pad of 2 oz copper

1 in

= 0 V, IS = 13.5 A (Note 2) 0.82 1.3
= 0 V, IS = 2 A (Note 2) 0.71 1.2

38 62 ns

is guaranteed by design while R

θJC

125 °C/W when mounted on
a minimum pad of 2 oz copper

2

θCA

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V

is determined by

FDMC86520L N-Channel PowerTrench

0 0.5 1.0 1.5 2.0 2.5

0

10

20

30

40

50

60

VGS = 3 V

VGS = 4.5 V

V

DS

, DRAIN TO SOURCE VOLTAGE (V)

I

D

, DRAIN CURRENT (A)

VGS = 3.5 V

VGS = 4 V

VGS = 10 V

PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX

0 102030405060

0

1

2

3

4

VGS = 4.5 V

VGS = 10 V

VGS = 4 V

PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX

NORMALIZED

DRAIN TO SOURCE ON-RESISTANCE

I

D

, DRAIN CURRENT (A)

VGS = 3.5 V

VGS = 3 V

-75 -50 -25 0 25 50 75 100 125 150

0.6

0.8

1.0

1.2

1.4

1.6

1.8

ID = 13.5 A
V

GS

= 10 V

NORMALIZED

DRAIN TO SOURCE ON-RESISTANC E

T

J

, JUNCTION TEMPERATURE (

o

C)

246810

0

10

20

30

40

TJ = 125 oC

ID = 13.5 A

TJ = 25 oC

V

GS

, GATE TO S OURCE V O LTAGE (V )

r

DS(on)

,

DRAIN TO

SOURCE ON-RESISTANCE

(mΩ)

PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX

1.5 2.0 2.5 3.0 3.5 4.0

0

10

20

30

40

50

60

TJ = 150 oC

V

DS

= 5 V

PULSE DURA TION = 80 μs
DUTY CYCLE = 0.5% MAX

TJ = -55 oC

TJ = 25 oC

I

D

, DRAIN CURRENT (A)

VGS, GATE TO SOURCE VOLTAGE (V)

0 0.2 0.4 0.6 0.8 1.0 1.2

0.001

0.01

0.1

1

10

100

TJ = -55 oC

TJ = 25 oC

TJ = 150 oC

V

GS

= 0 V

I

S

, REVERSE DRAIN CURRENT (A)

VSD, BODY DIODE FORWARD VOLTAGE (V)

Typical Characteristics T

Figure 1.

On Region Characteristics Figure 2.

= 25 °C unless otherwise noted

J

Nor mal ized O n-R esi sta nce

vs Drain Current and Gate Voltage

®

MOSFET

Figure 3. N or malized On Re sistanc e

vs Junction Temperature

FDMC86520L Rev.C

Figure 5. Transfer Characteristics

Figure 4.

On-Resistance vs Ga te to

Source Voltage

Figure 6.

Source to D rain Diode

Forward Voltage vs Source Current

3

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