FDMC6890NZ
Dual N-Channel PowerTrench® MOSFET
20V, 4A, Q1:68mΩ, Q2:100mΩ
Features
Q1: N-Channel
Max r
Max r
Q2: N-Channel
Max r
Max r
Low gate Charge
RoHS Compliant
= 68mΩ at VGS = 4.5V, ID = 4A
DS(on)
= 100mΩ at VGS = 2.5V, ID = 3A
DS(on)
= 100mΩ at VGS = 4.5V, ID = 4A
DS(on)
= 150mΩ at VGS = 2.5V, ID = 2A
DS(on)
General Description
FDMC6890NZ is a compact single package solution for DC to
DC converters with excellent thermal and switching
characteristics. Inside the Power 33 package features two
N-channel MOSFETs with low on-state resistance and low gate
charge to maximize the power conversion and switching
efficiency. The Q1 switch also integrates gate protection from
unclamped voltage input.
Application
DC - DC Conversion
FDMC6890NZ Dual N-Channel PowerTrench
October 2006
®
MOSFET
Up
S1
G1 G2
D1/S2
D1/S2
Power 33
D2
MOSFET Maximum Ratings T
Symbol Parameter Q1 Q2 Units
V
DS
V
GS
I
D
P
D
, T
T
J
STG
Drain to Source Voltage 20 20 V
Gate to Source Voltage ±12 ±12 V
-Continuous 4
-Pulsed 10
Power Dissipation (Steady State) Q1 (Note 1a) 1.92
Power Dissipation (Steady State) Q2 1.78
Operating and Storage Junction Temperature Range -55 to +150 °C
Bottom
G1
D1
D1/S2
S1
= 25°C unless otherwise noted
A
D1/S2
G2
D2
D2
D2
D1/S2
S1
G2
4
5
6
3
D1/S2
2
G1
1
Thermal Characteristics
R
θJA
R
θJA
Thermal Resistance, Junction to Ambient Q1 (Note 1a) 65
Thermal Resistance, Junction to Ambient Q2 70
Package Marking and Ordering Information
A
W
°C/W
Device Marking Device Package Reel Size Tape Width Quantity
6890N FDMC6890NZ Power 33 7inch 8mm 3000 units
©2006 Fairchild Semiconductor Corporation
FDMC6890NZ Rev.C
1
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FDMC6890NZ Dual N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Typ e Min Typ Max Units
Off Characteristics
BV
∆BV
∆T
I
DSS
I
GSS
DSS
DSS
J
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current VGS = ±12V, VDS= 0V
On Characteristics
V
GS(th)
∆V
∆T
r
DS(on)
g
FS
GS(th)
J
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA
Gate to Source Threshold Voltage
Temperature Coefficient
Drain to Source On Resistance
Forward Transconductance VDS = V, ID =4A
ID = 250µA, VGS = 0V Q1Q220
20
ID = 250µA, referenced to 25°C Q1
Q2
VDS = 16V, V
= 0V Q1
GS
Q2
Q1
Q2
Q1Q20.6
0.6
ID = 250µA, referenced to 25°C
VGS = 4.5V, ID = 4A
VGS = 2.5V, ID = 3A
VGS = 4.5V, ID = 4A
VGS = 2.5V, ID = 2A
Q1
Q2
Q1
Q2
Q1
Q2
V
13
12
0.9
1.0
-3
-3
58
77
67
102
10
7
mV/°C
1
1
±10
±100µAnA
2
2
mV/°C
68
100
100
150
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance
V
Output Capacitance
= 10V, VGS = 0V, f= 1MHZ
DS
Reverse Transfer Capacitance
Gate Resistance f = 1MHz
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
205
190
60
60
40
35
270
250
80
80
60
55
3.3
2.8
µA
V
mΩ
S
pF
pF
pF
Ω
®
MOSFET
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g(TOT)
Q
g(2)
Q
gs
Q
gd
FDMC6890NZ Rev.C
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge at 4.5V V
Total Gate Charge at 2V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
VDD = 10V, ID = 4A, R
= 0V to 4.5V
GS
VDD = 10 V
ID = 4A
2
GEN
= 6Ω
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
4
4
13
12
10
7
6
6
2.4
1.8
1.4
0.6
0.4
0.5
0.9
0.8
10
10
22
21
19
14
12
12
3.4
2.6
1.9
0.8
ns
ns
ns
ns
nC
nC
nC
nC
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FDMC6890NZ Dual N-Channel PowerTrench
Electrical Characteristics T
= 25°C unless otherwise noted
J
Symbol Parameter Test Conditions Type Min Typ Max Units
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
Notes:
1: R
is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
θJA
the user's board design.
2: Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.
Source to Drain Diode Forward Voltage V
Reverse Recovery Time
Reverse Recovery Charge
a. 65°C/W when mounted on
a 1 in2 pad of 2 oz copper
= 0V, IS = 4A
GS
I
= 4A, di/dt = 100A/s
F
Q1
Q2
0.94
0.92
Q1
Q2
Q1
Q2
is guaranteed by design while R
θJC
b. 150°C/W when mounted on a
minimum pad of 2 oz copper
18
17
10
1.25
1.25
27
26
9
14
15
is determined by
θCA
V
ns
nC
®
MOSFET
FDMC6890NZ Rev.C
3
www.fairchildsemi.com
FDMC6890NZ Dual N-Channel PowerTrench
Typical Characteristics (Q1 N-Channel)T
12
10
8
6
4
, DRAIN CURRENT (A)
D
2
I
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
Figure 1.
1.4
ID = 4A
1.3
V
GS
1.2
1.1
1.0
NORMALIZED
0.9
0.8
0.7
DRAIN TO SOURCE ON-RESISTANCE
-50 -25 0 25 50 75 100 125 150
F i g u r e 3 . N o r m a l i z e d O n - R e s i s t a n c e
VGS = 4.5V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
VGS = 2.5V
VGS = 1.8V
VDS, DRAIN TO SOURCE VOLTAGE (V)
On-Region Characteristics Figure 2.
= 4.5V
TJ, JUNCTION TEMPERATURE (oC)
vs Junction Temperature
= 25°C unless otherwise noted
J
3.0
2.5
VGS = 1.8V
2.0
1.5
NORMALIZED
1.0
DRAIN TO SOURCE ON-RESISTANCE
0.5
024681012
ID, DRAIN CURRENT(A)
N o r m a l i z e d O n - R e s i s t a n c e
vs Drain Current and Gate Voltage
200
(mΩ)
160
120
, DRAIN TO
80
DS(on)
r
SOURCE ON-RESISTANCE
40
1.5 2.0 2.5 3.0 3.5 4.0 4.5
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 4.
O n - R es i s t a n c e vs G a t e t o
Source Voltage
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
V
= 2.5V
GS
V
= 4.5V
GS
ID = 4A
PULSE DURATION = 80µs
DUTY CYCLE = 0.5%MAX
TJ = 150oC
o
T
= 25
C
J
®
MOSFET
9
8
7
6
5
4
3
2
, DRAIN CURRENT (A)
D
I
1
0
0.00.51.01.52.02.5
Figure 5. Transfer Characteristics
FDMC6890NZ Rev.C
PULSE DURATI ON = 80µs
DUTY CYCLE = 0.5%MAX
TJ = 150oC
VGS, GATE TO SOURCE VOLTAGE (V)
TJ = 25oC
TJ = -55oC
20
10
V
= 0V
GS
1
TJ = 150oC
0.1
TJ = 25oC
0.01
, REVERSE DRAIN CURRENT (A)
S
I
1E-3
0.2 0.4 0.6 0.8 1.0 1.2 1.4
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 6.
S o u r ce t o D r a i n Di o d e
TJ = -55oC
Forward Voltage vs Source Current
4
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