Fairchild FDB2532, FDP2532, FDI2532 service manual

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FDB2532 / FDP2532 / FDI2532
N-Channel PowerTrench® MOSFET 150V, 79A, 16m
FDB2532 / FDP2532 / FDI2532
August 2002
Features
•r
•Q
• Low Miller Charge
•Low Q
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
Formerly developmental type 82884
= 14mΩ (Typ.), V
DS(ON)
(tot) = 82nC (Typ.), V
g
Body Diode
RR
= 10V, ID = 33A
GS
= 10V
GS
Applications
• DC/DC converters and Off-Line UPS
• Distributed Pow er Architectures and VRMs
• Primary Switch for 24V and 48V Systems
• High Voltage Synchronous Re ctifier
• Direct Injection / Diesel Injection Systems
• 42V Automotive Lo ad Control
• Electronic Valve T rain System s
DRAIN
(FLANGE)
GATE
SOURCE
DRAIN
GATE
SOURCE
TO-220AB
FDPSERIES
MOSFET Maximum Ratings T
DRAIN
(FLANGE)
TO-263AB
FDB SERIES
= 25°C unless otherwise noted
C
DRAIN
(FLANGE)
SOURCE
TO-262AB
FDISERIES
DRAIN
GATE
G
Symbol Parameter Ratings Units
V
DSS
V
GS
Drain to Source Voltage 150 V Gate to Source Voltage ±20 V Drain Curr e nt Continuous (T
I
D
Continuous (T Continuous (T
= 25oC, VGS = 10V)
C
= 100oC, VGS = 10V) 56 A
C
= 25oC, VGS = 10V, R
amb
= 43oC/W) 8 A
θJA
79 A
Pulsed Figure 4 A
E
AS
P
D
, T
T
J
STG
Single Pulse Avalanche Energy (Note 1) 400 mJ Power dissipation 310 W
o
Derate above 25
C2.07W/
Operating and Storage Temperature -55 to 175
D
S
o
C
o
C
Thermal Characteristics
R
θJC
R
θJA
R
θJA
This product ha s been des igned to me et the e xtr eme test c ondit ions and envir onment deman ded by the automot ive indus t ry. For a
All Fairchild Semiconductor prod ucts are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
©2002 Fairchild Semiconductor Corporation
Thermal Resistance Junction t o Case TO-220, TO-263, TO -262 0.48 Thermal Resistance Junction t o Ambient TO-220, TO-262 (Note 2) 62 Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea 43
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
certification.
FDB2532 / FDP2532 / FDI2532 Rev. B
o
C/W
o
C/W
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDB2532 FDB2532 TO-263AB 330mm 24mm 800 units FDP2532 FDP2532 TO-220AB Tube N/A 50 units
FDI2532 FDI2532 TO-262AB Tube N/A 50 units
FDB2532 / FDP2532 / FDI2532
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
B I
DSS
I
GSS
VDSS
Drain t o Source Breakdown Volta ge ID = 250µA, VGS = 0V 150 - - V
V
= 120V - - 1
Zero Gate Voltage Drain Current
DS
= 0V TC = 150oC- - 250
V
GS
Gate to Source Leakage Current VGS = ±20V - - ±100 nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold Voltage VGS = VDS, ID = 250µA2-4V
= 33A, VGS = 10V - 0.014 0.016
I
D
I
= 16A, VGS = 6V, - 0.016 0.024
Drain to Source On Resistance
D
= 33A, VGS = 10V,
I
D
T
= 175oC
C
- 0.040 0.048
Dynamic Characteristics
C C C Q Q Q Q Q
ISS OSS RSS
g(TOT) g(TH) gs gs2 gd
Input Capacitance Output Capacitance - 615 - pF Reverse Transfer Capacitance - 135 - pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total G ate Ch arg e at 10 V VGS = 0V to 10V Threshold Gate Charge VGS = 0V to 2V - 11 14 nC Gate to Source Gate Charge - 23 - nC Gate Charge Threshold to Plateau - 13 - nC
V
DD
I
= 33A
D
I
= 1.0m A
g
= 75V
Gate to Drain “Miller” Charge - 19 - nC
-5870- pF
-82107nC
µA
Resistive Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time Turn-On Delay Time - 16 - ns Rise Time - 30 - ns T u rn-Off Delay Time - 39 - ns Fall Time - 17 - ns Turn-Off Time - - 84 ns
(VGS = 10V)
V
DD
V
GS
--69ns
= 75V, ID = 33A = 10V, RGS = 3.6
Drain-Source Diode Characteristics
I
= 33A - - 1 .25 V
V
SD
t
rr
Q
RR
Notes: 1: Starting T 2: Pulse Width = 100s
©2002 Fairchild Semiconductor Corporation FDB2532 / FDP2532 / FDI2532 Rev. B
Source to Drain Di ode Voltage Reverse Recovery Time ISD = 33A, dISD/dt= 100A/µs- - 105ns
Reverse Recovery Charge ISD = 33A, dISD/dt= 100A/µs - - 327 nC
= 25°C, L = 0.5 mH, IAS = 40A.
J
SD
= 16A - - 1.0 V
I
SD
FDB2532 / FDP2532 / FDI2532
Typical Characteristics T
= 25°C unless otherwise noted
A
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0255075100 175
125
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs
Ambient Temperature
2.0 DUTY CYCLE - DESCENDING ORDER
0.5
1.0
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θJC
Z
THERMAL IMPEDANCE
SINGLE PULSE
0.01
-5
10
-4
10
10
125
V
= 10V
GS
100
75
50
, DRAIN CURRENT (A)
D
I
25
150
0
25 50 75 100 125 150 175
Figure 2. Maximum Continuous Drain Curr ent vs
-3
t, RECTANGULAR PULSE DURATION (s)
-2
10
TC, CASE TEMPERATURE (oC)
Case Temperature
P
DM
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
10-1 10
θJC
1/t2
0
x R
t
θJC
1
t
2
+ T
C
1
10
Figure 3. Normalized Maximum Transient Thermal Impedance
, PEAK CURRENT (A)
DM
I
2000
1000
100
50
VGS = 10V
-5
10
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-4
10
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
TC = 25oC FOR TEMPERATURES
o
ABOVE 25
C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
I = I
25
0
10
C
150
1
10
Figure 4. Peak Current Capability
©2002 Fairchild Semiconductor Corporation FDB2532 / FDP2532 / FDI2532 Rev. B
Typical Characteristics T
= 25°C unl ess otherwise noted
A
FDB2532 / FDP2532 / FDI2532
1000
100
OPERATION IN THIS
10
, DRAIN CURRENT (A)
D
I
1
0.1
AREA MAY BE
LIMITED BY r
SINGLE PULSE TJ = MAX RATED
T
= 25oC
C
1 10 100
DS(ON)
VDS, DRAIN TO SOURCE VOLTAGE (V)
10µs
100µs
1ms
10ms
DC
Figure 5. Forward Bias Safe Operating Area
180
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
150
V
= 15V
DD
120
90
60
, DRAIN CURRENT (A)
D
I
30
0
TJ = 25oC
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 VGS, GATE TO SOURCE VOLTAGE (V)
TJ = 175oC
TJ = -55oC
200
STARTING TJ = 25oC
STARTING TJ = 150oC
- VDD)
DSS
= (L/R)ln[(IAS*R)/(1.3*RATED BV
tAV, TIME IN AVALANCHE (ms)
DSS
300
100
10
If R = 0
, AVALANCHE CURRENT (A)
tAV = (L)(IAS)/(1.3*RATED BV
AS
I
If R 0 t
AV
1
0.001 0.01 0.1 1
NOTE: Refer to Fairchild Application Notes AN7515 and AN7517
Figure 6. Unclamped Inductive Switching
Capability
180
150
120
90
60
, DRAIN CURRENT (A)
D
I
30
0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
VGS = 10V
VGS = 5V
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS = 7V
VGS = 6V
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
- VDD) +1]
TC = 25oC
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
18
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
17
16
15
14
13
DRAIN TO SOURCE ON RESISTANCE (m Ω)
VGS = 6V
VGS = 10V
0 20406080
I
, DRAIN CURRENT (A)
D
Figure 9. Drain to So urce On Resistanc e v s Drai n
Current
©2002 Fairchild Semiconductor Corporation FDB2532 / FDP2532 / FDI2532 Rev. B
3.0
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
2.5
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-80 -40 0 40 80 120 160 200 TJ, JUNCTION TEMPERATURE (oC)
VGS = 10V, ID =33A
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
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